LED with remote phosphor and shell reflector

Method for manufacturing light emitting device

Light source, method of manufacturing the light source, and method of mounting the light source

Optoelectronic device

Inorganic filler, resin composition comprising the same and heat radiation substrate using the same

Phototherapy light engine

Joined body, electronic device, projector, and manufacturing method of joined body

HEAT DISSIPATION FILM, DISPERSION LIQUID FOR HEAT EMISSION LAYER, METHOD FOR PRODUCING HEAT DISSIPATION FILM AND SOLAR CELL

Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate

WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE

Semiconductor light emitting device

Light emitting diode device

Roll-to-roll fabricated light sheet and encapsulated semiconductor device

Light-emitting apparatus having different packaging densities

Thermosetting resin composition, semiconductor device, and electrical/electronic component

Substrate for light emitting devices and light emitting device

Vertical topology light emitting device

White Light LED Filament Having Blue Light Emitting Units and a Strip-Shaped Fluorescent Wafer

Light emitting element module

Light-emitting apparatus

Metal coating method, light-emitting device, and manufacturing method for the same

Method for manufacturing semiconductor light-emitting device and semiconductor light-emitting device

Light-emitting apparatus

Light emitting device having first and second electrodes on one side of a light emitting structure

Cured thermoset for high thermal conductive materials

Substrate for light emitting devices, light emitting device, and method for producing substrate for light emitting devices

Floating heat sink support with conductive sheets and LED package assembly for LED flip chip package

Substrate for light emitting device, light emitting device, and manufacturing method of substrate for light emitting device

Blue light leakage-suppressing LED structure

Nitride semiconductor light emitting device

Optoelectronic device comprising a light-emitting diode

Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof

Light emitting package having a guiding member guiding an optical member

LED LIGHT SOURCE AND MANUFACTURING METHOD THEREOF

LED package and method of manufacturing the same

Luminescent ceramic for a light emitting device

Two piece aluminum heat sink

Light-emitting device substrate, light-emitting device, and method for producing light-emitting device substrate

Light-emitting apparatus

Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

Composite substrate with alternating pattern of diamond and metal or metal alloy

Heat sink for an illumination device

Light-emitting device

HEAT RADIATION SHEET, LIGHT EMITTING DEVICE, AND HEAT RADIATION BACK SHEET FOR PHOTOVOLTAIC MODULE, EACH INCLUDING BORON NITRIDE HEAT DISSIPATION LAYER

Light emitting device package

Thermal management in electronic devices with yielding substrates

Substrate for light emitting device, light emitting device, and method for manufacturing substrate for light emitting device

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Method of manufacturing lighting emitting device with aligned-bonding

Method of manufacturing a semiconductor device including through silicon plugs

Light emitting device

Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same

Light emitting device

Light emitting apparatus

LED MODULE

Process for forming light-emitting diodes

LED assembly and liquid crystal display device including the same

Light emitting device and method for manufacturing the same

Light emitting apparatus and production method thereof

LED support assembly and LED module

HEAT DISSIPATING PLATE DEVICE FOR LIGHT EMITTING DIODE, HEAD LAMP FOR AUTOMOBILE AND METHOD FOR PREPARING THE SAME

OPTOELECTRONIC DEVICE INCLUDING IMPROVED THERMAL MANAGEMENT

Lighting system

Vertical topology light emitting device

Optoelectronic device

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

LED packages using highly reflective die attach material and enhanced reflective substrates

Devices and methods including an LED and reflective die attach material

Assembly that emits electromagnetic radiation and method of producing an assembly that emits electromagnetic radiation

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Light emitting device and light emitting apparatus

Light emitting device package and light unit

Islanded carrier for light emitting device

Nano-structure assembly and nano-device comprising same

Light emitting module

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

White light emitting diode, manufacturing method and packaging material thereof

Lighting device and LED luminaire

Thermoplastic resin composition having excellent reflectivity

Light emitting die component formed by multilayer structures

LED light-emitting device

ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

Vertical nitride semiconductor device and method for manufacturing same

Light emitting device with an adhered heat-dissipating structure

HEAT RADIATION SHEET FOR BOARD, MANUFACTURING METHOD THEREOF, AND HEAT RADIATION BOARD

Package of light emitting diode with heat sink

Color conversion arrangement, a lighting unit, a solid state light emitter package and a luminaire

Light emitting diode and method of manufacturing the same

Printed LED heat sink double lock

Thermal management in electronic devices with yielding substrates

LED chip-on-board component and lighting module

Light emitting device with reduced epi stress

Wiring substrate

Light-emitting diode package and method of manufacturing the same

LED lighting apparatus and method for manufacturing the same

Ceramic substrate and semiconductor package having the same

Structured substrate

Composite substrate

Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device

Light emitting device

Floating heat sink support with copper sheets and LED package assembly for LED flip chip package

Light-emitting device and manufacturing method thereof

Semiconductor device

Light emitting device package

Light-emitting device

Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device

Semiconductor device and method of manufacturing the same

Optoelectronic device, optical element and method for producing same

Light emitting device and method for operating a plurality of light emitting arrangements

Package for high-power LED devices

Light emitting device, light source for illumination, and illumination apparatus

Electric conductive heat dissipation substrate

Electron emission surface for X-ray generation

Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof

Light emitting device and light emitting apparatus having the same

Light emitting device and method for manufacturing the same

LED illumination module and LED illumination apparatus

Vertical topology light-emitting device

High heat-radiant optical device substrate

LED device with improved thermal performance

LIGHT-EMITTING DEVICE

LED module having LED chips as light source

Light emitting diode and forming method thereof

LED package and method of manufacturing the same

THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO

Nitride semiconductor light emitting device

Lighting module and method of manufacturing a lighting module

Light-Emitting Diode Having Diamond-Like Carbon Layer and Manufacturing Method and Application Thereof

Radiation-emitting component, transparent material and filler particles, and method of producing same

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Method for making light emitting diode

LIQUID-FILLED PACKAGING STRUCTURE OF HEATING COMPONENT

Light Emitting Device

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods

Method of producing an optoelectronic semiconductor chip

Light emitting device package

LED package

LED CHIP-ON-BOARD TYPE FLEXIBLE PCB AND FLEXIBLE HEAT SPREADER SHEET PAD AND HEAT-SINK STRUCTURE USING THE SAME

Lighting systems with heat extracting light emitting elements

Light emitting package having a guiding member guiding an optical member

Light emitting device and light emitting device package

Light emitting diode package

Bonded body and semiconductor module

LED package and method of the same

LED LIGHTING ASSEMBLY AND AN ILLUMINATING APPARATUS HAVING THE LED LIGHTING ASSEMBLY

Supporting substrate for preparing semiconductor light-emitting device and semiconductor light-emitting device using supporting substrates

Lighting assembly, a light source and a luminaire

Solid state light sources with common luminescent and heat dissipating surfaces

Solid state light sources with common luminescent and heat dissipating surfaces

Solid state light sources based on thermally conductive luminescent elements containing interconnects

SOLID STATE LIGHTING COMPONENT PACKAGE WITH REFLECTIVE LAYER

SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING DEVICE AND SUBSTRATE

Semiconductor light emitting device

Light emitting device package

Clad material for LED light-emitting element holding substrate, and method for manufacturing same

Light emitting device and method for manufacturing the same

LED light source with thermally conductive luminescent matrix

Two piece aluminum heat sink

Light emitting diode

Silicon-based cooling package for light-emitting devices

Semiconductor light emitting device comprising cut-and-bent portions

Light emitting device

Light-emitting device including a heat dissipation hole

Thermal management in electronic devices with yielding substrates

Thermally-conductive sheet, LED mounting substrate, and LED module

Light emitting device with enhanced pre-dip and method of manufacturing the same

Light emitting device package

Polyamide composition having high thermal conductivity

Vertical topology light-emitting device

Mixed light source

Barrier with integrated self cooling solid state light sources

Light emitting device package and light unit

Light-emitting device having transparent package and manufacturing method

Lightweight solid state light source with common light emitting and heat dissipating surface

Light emitting diode

Flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer

Light emitting device, light emitting device package, and lighting system

LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING HEAT DISSIPATION SUBSTRATE

Wiring substrate and electronic device

METHOD FOR MANUFCTURING BACKLIGHT MODULE

Light-emitting diode package and method of fabricating the same

Semiconductor device and production method therefor

Heat conducting composite material and light-emitting diode having the same

Light-emitting device including case and sealant

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Graphite-containing substrates for LED packages

High heat-radiant optical device substrate and manufacturing method thereof

LED package with lead terminals having protrusions of differing widths and method for fabricating the same

Luminescence device

Luminescent material

Light-emitting module and lamp using same

Device mounting board, semiconductor module, and method for fabricating the device mounting board

Supporting substrate for preparing semiconductor light-emitting device and semiconductor light-emitting device using supporting substrates

Solid state light sources based on thermally conductive luminescent elements containing interconnects

Multilayered LED printed circuit board

DEVICES AND METHODS

Light emitting package having a guiding member guiding an optical member

Lighting emitting device with aligned-bonding having alignment patterns

Semiconductor light emitting device

Siloxane Compound and Cured Product Thereof

Broadband dielectric reflectors for LED with varying thickness

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

Carrier substrate and method for producing semiconductor chips

Molded package for light emitting device and light emitting device using the same

Package of light emitting diode and method for manufacturing the same

Light emitting devices and substrates with improved plating

Light emitter packages, systems, and methods having improved performance

Flexible light emitting semiconductor device

Circuit Board, LED Light Strip and Method for Making the LED Light Strip

ILLUMINATING DEVICE

Method of manufacturing a semiconductor device including through silicon plugs

Light emitting diode and forming method thereof

Electronic component

Broadband dielectric reflectors for LED

Light emitting diode wafer-level package with self-aligning features

Method of manufacturing semiconductor element

Semiconductor element and method of manufacturing same

Method of bonding light emitting diode (LED) for LED module and LED manufactured thereby

Light-emitting diode and light-emitting diode lamp

LED device with improved thermal performance

Optoelectronic Semiconductor Component and Method for Producing it

NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

Graphite structure, and electronic device using the same

Optoelectronic Semiconductor Component And Method For Producing Same

Lighting device including phosphor layer and light-transmitting layer that is arranged in contact with the phosphor layer to release static charge to substrate

Ceramic-based light emitting diode (LED) devices, components, and methods

Light emitting device, light emitting device package and light emitting module

LIGHT EMITTING DIODE SYSTEM AND METHODS RELATING THERETO

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

HEAT SINK BIMETALLIC PILLAR BUMP AND THE LED HAVING THE SAME

Light-emitting element and method for manufacturing same

Ceramics substrate for mounting light-emitting element and light-emitting device

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods

LIGHT EMITTING DEVICE

Light emitting diode and flip-chip light emitting diode package

Electronic device

ELECTRONIC DEVICE

LED lighting module for vehicle headlight

Glass ceramic composition, substrate for light emitting element, and light emitting device

LIGHT EMITTING DEVICE

Light emitting device and light emitting apparatus having the same

Light emitting diode (LED) packages and related methods

LED PACKAGE MODULE

SILICON SUBMOUNT FOR LIGHT EMITTING DIODE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor light emitting module comprising an exposed plate surface

Optoelectronic lighting module and automotive headlamp

LED package and method of making the same

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

Embedded optical element package module using a thermocouple

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE AND THE LIGHT-EMITTING DEVICE

RADIATION HEAT DISSIPATION LED STRUCTURE AND THE MANUFACTURING METHOD THEREOF

CHIP-ON-BOARD LED STRUCTURE

Method for producing ceramic for heat-radiating members, ceramic for heat-radiating members, and solar cell module and LED light-emitting module using said ceramic

LED Array Having Embedded LED and Method Therefor

Stress regulated semiconductor devices and associated methods

MANUFACTURING METHOD OF PACKAGE CARRIER

LED PACKAGE AND METHOD OF THE SAME

Light emitting device package and light unit

Compound semiconductor light-emitting element

LED module

Thin metal substrate having high thermal conductivity

Film system for LED applications

Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof

Light emitting package

Light emitting diode (LED) die having peripheral electrode frame and method of fabrication

Posts in glue layer for group-III nitride LEDs

Substrate for mounting light-emitting element and light-emitting device

THERMALLY CONDUCTIVE THERMOPLASTIC COMPOSITIONS

Method for forming package substrate

Metal laminated structure and method for producing the same

Light emitter device packages, modules and methods

Dissipation module for a light emitting device and light emitting diode device having the same

Light emitting device and light emitting apparatus

THERMALLY ENHANCED LIGHT EMITTING DEVICE PACKAGE

LED module, backlight unit including the LED module, and method for manufacturing the LED module

Package structure and manufacturing method thereof

Light emitting diode carrier

LED module having LED chips as light source

LED PACKAGE STRUCTURE AND MODULE THEREOF

Stress regulated semiconductor devices and associated methods

Method for making light emitting diode

SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, ITS PRODUCTION PROCESS AND LIGHT-EMITTING DEVICE

HEAT RADIATING SUBSTRATE

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

Light emitting diode

Lift-off structure for substrate of a photoelectric device and the method thereof

Housing for an optoelectronic component and method for producing a housing

Thermal dissipation substrate

Light emitting diode

LARGE SINGLE CHIP LED DEVICE FOR HIGH INTENSITY PACKING

Light emitting device package including UV light emitting diode

Self-cooling solid-state emitters

LIGHT-EMITTING DIODE DEVICE

Semiconductor device package including a paste member

Electronic, Especially Optical or Optoelectronic Component, and Method for the Production Thereof