Conductive Dispersions And Methods Of Manufacture

METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE METAL TRACE AND CORRESPONDING METAL TRACE, PARTICULARLY SUITABLE FOR TRANSIENT ELECTRONIC DEVICES

Thermal Management in Circuit Board Assemblies

WIRING BOARD

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION THEREOF

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION THEREOF

SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND SMART WEARABLE SYSTEM

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

Thermal Management in Circuit Board Assemblies

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

HEAT-CURABLE RESIN COMPOSITION

Hybrid nanosilver/liquid metal ink composition and uses thereof

Methods of dispensing a metallic nanoparticle composition from a nozzle onto a substrate

Ink composition, method for forming a conductive member, and conductive device

Biopolymer-based electromagnetic interference shielding matertals

Thermal management in circuit board assemblies

Molecular inks

Boron nitride nanotube coated substrates for sintering of metallic traces by intense pulse light

INKJET PRINTING INK

Imprinted metallization on polymeric substrates

Thermal management in circuit board assemblies

Fluorocarbon resin composition and prepreg and copper foil substrate using the same

Fluorocarbon prepreg and resin composition thereof

MATERIAL DEPOSITION IN A MAGNETIC FIELD

Hybrid nanosilver/liquid metal ink composition and uses thereof

Molecular ink with improved thermal stability

Composition for sintering, method for producing silver nanoparticles, circuit board, and method for manufacturing circuit board

Circuit module and manufacturing method for circuit module

Substrate for power module, circuit board for power module, and power module

Metal oxide nanoparticle ink composition, method of producing same, and method of forming conductive layer pattern using same

Circuit board, electronic circuit device, and production method of circuit board

Prepreg, metal-clad laminated board, and printed wiring board

Thermal management in circuit board assemblies

Ink composition, method for forming a conductive member, and conductive device

Biopolymer-based electromagnetic interference shielding materials

ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME

Method of manufacturing a polymer printed circuit board

Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode

METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL ALLOYS

Double-sided and multilayered printed circuit board fabrication using inkjet printing

Electric connection structure and electric connection member

Dry method of metallizing polymer thick film surfaces

Organic-inorganic-hybrid thin film and method of manufacturing the same

Ink reinforcement for printed electronics

Metallic nano structure, method of fabricating the same, and electrical apparatus having the same

Display device and method for manufacturing the same

Hybrid nanosilver/liquid metal ink composition and uses thereof

PRINTED WIRING BOARD

Evacuated core circuit board

Method of manufacturing polymer printed circuit board

Printing method using two lasers

Method for coating a device and devices having nanofilm thereon

Method for coating devices and resulting products

METHOD OF MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC CIRCUIT BOARD OBTAINED BY SAME

Printed circuit, thin film transistor and manufacturing method thereof

Electric connection structure and electric connection member

Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board

Molecular inks

Metal nanowire thin-films

Conductive ink for a rollerball pen and conductive trace formed on a substrate

Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a method for producing stretchable electrode arrays and/or stretchable conductive paths in general

SILVER PARTICLE COATING COMPOSITION

Bipolymer-based electromagnetic interference shielding materials

Electronic component module and method for manufacturing electronic component module

Microreactor-assisted printing of conductive traces with in-situ reactive inks

Method of manufacturing a flexible and/or stretchable electronic device

Bonding method using bonding material

Bonding material and bonding method using the same

Capacitors for multilayer printed circuit boards

Conformal coating composition containing metal nanoparticles to prevent sulfur related corrosion

Two-step, direct-write laser metallization

Method of forming metallic pattern on polymer substrate

Transparent conductive coatings for optoelectronic and electronic devices

Producing an apparatus by covering an electronic component with a conformal coating containing metal nanoparticles

Nano-copper solder for filling thermal vias

Composite nanometal paste containing copper filler and joining method

Patterned conductive film, method of fabricating the same, and application thereof

Conductive-pattern forming method and composition for forming conductive pattern by photo irradiation or microwave heating

Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels

Process to produce conformal nano-composite coating for mititgation of manufacturing defects using chemical vapor deposition and nano-structures

Nanowire-based transparent conductors and applications thereof

Plating catalyst and method

Electrode substrate and planar optoelectronic device

Bonding material comprising coated silver nanoparticles and bonded object produced using same

Methods of fabricating electrode sensor

In-process orientation of particles used in direct-write inks to control electrical characteristics

Additives for grain fragmentation in Pb-free Sn-based solder

NANO-PATTERNING APPARATUS, SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF

Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component

HIGH SURFACE AREA FILLER FOR USE IN CONFORMAL COATING COMPOSITIONS

Electrically conductive adhesive (ECA) for multilayer device interconnects

METHOD FOR APPLYING CARBON/TIN MIXTURES TO METAL OR ALLOY LAYERS

Conductive inks obtained by combining AQCs and metal nanoparticles

BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, AND METHOD OF PREPARING THE SAME

Bonding material and bonding method using the same

Apparatus and method for suspension wicking of nanoparticles into microchannels

Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications

Method of forming multilayer capacitors in a printed circuit substrate

COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND METHOD FOR FORMING ELECTRODE USING THE COPPER NANO PASTE

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING BONDED PARTICLE CONSTITUENTS

Dielectric protective layer for a self-organizing monolayer (SAM)

NANOCLAYS IN POLYMER COMPOSITIONS, ARTICLES CONTAINING SAME, PROCESSES OF MAKING SAME, AND SYSTEMS CONTAINING SAME

Transparent conductive coatings for optoelectronic and electronic devices

SUBSTRATE ASSEMBLY CONTAINING CONDUCTIVE FILM AND FABRICATION METHOD THEREOF

Uninterrupted flow pump apparatus and method

Stabilized metal nanoparticles and methods for production thereof

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

Metal nanoparticles and methods for producing and using same

Semiconductor apparatus and the method of manufacturing the same

Method of making a circuitized substrate

METHOD OF FABRICATING PATTERN

METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

Conductive paste and conductive circuit board produced therewith

Electronic device for voltage switchable dielectric material having high aspect ratio particles

Coatings for electronic circuits

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

Anti-corrosion conformal coating for metal conductors electrically connecting an electronic component

Metal nanowire thin-films

Pad structure with a nano-structured coating film

Insulated ultrafine powder, process for producing same and resin composite material with high dielectric constant using same

Coated and Planarised Polymeric Films

Nanowire-based transparent conductors and applications thereof

Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Pattern electrode manufacturing method and pattern electrode

Metal pattern composition and method of forming metal pattern using the same

Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate

In-process orientation of particles in a direct-write ink to control electrical characteristics of an electrical component being fabricated

RADIATION-ASSISTED NANOPARTICLE PRINTING

Apparatus and method for forming electronic devices

Method for preparing a patterned electric circuit

MICROSTRUCTURED MATERIAL AND PROCESS FOR ITS MANUFACTURE

Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles

Embedded capacitor, embedded capacitor sheet using the same and method of manufacturing the same

METHOD FOR FORMING CIRCUIT BOARD STRUCTURE OF COMPOSITE MATERIAL

Additives for grain fragmentation in Pb-free Sn-based solder

Method of forming metal wiring and metal wiring formed using the same

Method for electroplating a substrate

Electronic device for voltage switchable dielectric material having high aspect ratio particles

Device applications for voltage switchable dielectric material having high aspect ratio particles

Electrically conductive, thermosetting elastomeric material and uses therefor

Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof

PRINTED ELECTRONIC COMPONENT ASSEMBLY ENABLED BY LOW TEMPERATURE PROCESSING

Surface Coating

Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof

Lead solder-free electronics

Reducing agent for low temperature reducing and sintering of copper nanoparticles

Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film

METHOD OF FORMING STRUCTURES USING DROP-ON-DEMAND PRINTING

Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof

Insulated ultrafine powder, process for producing same and resin composite material with high dielectric constant using same

METALLIC PASTES AND INKS

Photo-curing process for metallic inks

Method for manufacturing conductors and semiconductors

Lead-free solder paste

Silver-coated ball and method for manufacturing same

METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT

Functionalized nanostructure, methods of manufacture thereof and articles comprising the same

Printed circuit board printing system

Method for producing conductive coating film

METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD

Laminate and Process for Producing the Same

Biaxially Oriented Nanocomposite Film, Method of Manufacture, and Articles Thereof

Voltage switchable dielectric material having bonded particle constituents

Method for manufacturing a substrate with surface structure by employing photothermal effect

Method for forming a thin layer of particulate on a substrate

FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

Nanoscale metal paste for interconnect and method of use

Polyamide acid containing ultrafine metal particle

Nanomaterial facilitated laser transfer

HIGH DIELECTRIC POLYMER COMPOSITE

Surface Coating

Surface coating process

Surface coating process

Surface coating

Nonaqueous conductive nanoink composition

CONVERGENT-DIVERGENT-CONVERGENT NOZZLE FOCUSING OF AEROSOL PARTICLES FOR MICRON-SCALE DIRECT WRITING

CONDUCTIVE CIRCUIT MANUFACTURING METHOD

Method and apparatus related to nanoparticle systems

Method for producing conductor structures and applications thereof

Metallic ink

Wiring forming method of printed circuit board

Conductive polymer composites

Method of making a circuitized substrate having at least one capacitor therein

METHOD OF FORMING BURIED WIRING LINES, AND SUBSTRATE AND DISPLAY DEVICE USING THE SAME

Method for forming a photoresist-laminated substrate, method for plating an insulating substrate, method for surface treating of a metal layer of a circuit board, and method for manufacturing a multi layer ceramic condenser using metal nanoparticles aerosol

Embedded capacitive stack

Embedded capacitive stack

Functional composites, functional inks and applications thereof

Polymide resin composition modified with bismaleimide and cyanate

Low temperature bonding material comprising metal particles and bonding method

Method of making circuitized substrate with a resistor

Light-emitting diode assembly

Nanowire-based transparent conductors and applications thereof

MOLDABLE HIGH DIELECTRIC CONSTANT NANO-COMPOSITES

COMPOSITION AND ASSOCIATED METHOD

COMPOSITION AND ASSOCIATED METHOD

Method to form a pattern of functional material on a substrate

Circuit pattern formation device and method of forming circuit pattern to substrate

Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof

Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof

POLYIMIDE SOLVENT CAST FILMS HAVING A LOW COEFFICIENT OF THERMAL EXPANSION AND METHOD OF MANUFACTURE THEREOF

FLUID COMPOSITION RECEIVING LAYER FOR PRINTED CONDUCTIVE LAYERS AND METHODS THEREFOR

Device applications for voltage switchable dielectric material having high aspect ratio particles

Metal nanoparticle having a self-assembled monolayer on its surface, and formation of conductive pattern using the same

Laser patterning and conductive interconnect/materials forming techniques for fine line and space features

Solderable pads utilizing nickel and silver nanoparticle ink jet inks

Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same

Filled epoxy compositions

Printed circuits prepared from filled epoxy compositions

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Anisotropic conductive adhesive

Polymeric epoxy resin composition

Hardenable reaction resin system

Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate

Method and Apparatus for Low-Temperature Plasma Sintering

Thin film pattern forming device and method

Method for forming solder pattern on board

Electrically conductive adhesives

Transparent conducting structures and methods of production thereof

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method of forming structures using drop-on-demand printing

Magnetic composites and methods of making and using

Method for producing through-contacts and a semiconductor component with through-contacts

Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape

Screen printing using nanoporous polymeric membranes and conductive inks

Functional ink apparatus and method

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Conductive adhesive, method of producing the same, and bonding method

Use of nanoparticles in film formation and as solder

Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom

Fabricating method for flat display device

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Forming a patterned metal layer using laser induced thermal transfer method

Printable electric circuits, electronic components and method of forming the same

Electronic module and method for the production thereof

METHOD OF FORMING CONDUCTIVE FILM AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

High-k thin film grain size control

Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method

High energy soldering composition and method of soldering

Electrophotographic printing of electronic devices

System and a method for synthesizing nanoparticle arrays in-situ

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Printed circuits on shrink film

Structured composite dielectrics

Conductive path made of metallic nanoparticles and conductive organic material

Printed circuit board printing system and method using liquid electrophotographic printing

Nano-sized metals and alloys, and methods of assembling packages containing same

Resin composition, method of its composition, and cured formulation

Forming electrical conductors on a substrate

Method to form a conductive structure

Treating an area to increase affinity for a fluid

Pattern form object and a manufacturing method thereof

Process for fabrication of printed circuit boards

Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

Liquid thermosetting ink

Electronic device and method for producing the same

Etching resist precursor compound, fabrication method of circuit board using the same and circuit board

Printed circuits on shrink film

Methods of forming solder areas on electronic components and electronic components having solder areas

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Nano-metal composite made by deposition from colloidal suspensions

Printed circuit board manufacture

Hardenable reaction resin system

Organic/inorganic oxide mixed film, passive device contained electronic substrate using the film, and method of manufacturing organic/inorganic oxide mixed film