H05K2201/09436 - CPC Classification Index

#1

20230275061

2023-08-31

Shielded electronic component package

#2

20220052016

2022-02-17

Shielded electronic component package

#3

20200315006

2020-10-01

Ceramic electronic component

#4

20200315005

2020-10-01

Ceramic electronic component

#5

20190371760

2019-12-05

Shielded electronic component package

#6

20190069402

2019-02-28

Ceramic electronic component

#7

20180277471

2018-09-27

Through-hole electrode substrate

#8

20170374747

2017-12-28

Substrates with ultra fine pitch flip chip bumps

#9

20170318679

2017-11-02

Control circuit board and robot control device

#10

20170285779

2017-10-05

Touch panel and junction structure of touch panel and flexible printed circuit board

#11

20170148723

2017-05-25

Semiconductor device having polyimide layer

#12

20160351525

2016-12-01

Shielded electronic component package

#13

20160329273

2016-11-10

Through-hole electrode substrate

#14

20160066439

2016-03-03

Electronic device for vehicle

#15

20150289392

2015-10-08

Electronic device module and manufacturing method thereof

#16

20150223361

2015-08-06

Electronic component module and manufacturing method thereof

#17

20150195913

2015-07-09

Electric component module

#18

20150000966

2015-01-01

Printed circuit board and method of manufacturing the same

#19

20140362542

2014-12-11

Array substrate assembly and display device

#20

20140312101

2014-10-23

Materials, structures and methods for microelectronic packaging

#21

20140262442

2014-09-18

Module and method of manufacturing the same

#22

20140140019

2014-05-22

Display apparatus and method of manufacturing the same

#23

20140003015

2014-01-02

Mount board and electronic device

#24

20140000946

2014-01-02

Wiring board and electronic device using the same

#25

20130335940

2013-12-19

Electronic circuit substrate, display device, and wiring substrate

#26

20130328214

2013-12-12

Through-hole electrode substrate

#27

20130153282

2013-06-20

PRINTED CIRCUIT BOARD

#28

20130029458

2013-01-31

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME

#29

20130025926

2013-01-31

CIRCUIT SUBSTRATE

#30

20120267155

2012-10-25

CIRCUIT SUBSTRATE

#31

20120181687

2012-07-19

Materials, structures and methods for microelectronic packaging

#32

20120175265

2012-07-12

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

#33

20120061347

2012-03-15

Method for manufacturing a printed wiring board

#34

20120060368

2012-03-15

Method of fabricating circuit board structure

#35

20120037406

2012-02-16

Method and apparatus for using flex circuit technology to create an electrode

#36

20120006584

2012-01-12

WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE

#37

20110303450

2011-12-15

MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER

#38

20110242780

2011-10-06

Mount board and electronic device

#39

20110205716

2011-08-25

CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

#40

20110195543

2011-08-11

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

#41

20110174527

2011-07-21

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

#42

20110154661

2011-06-30

Method of fabricating printed circuit board assembly

#43

20110108982

2011-05-12

Printed circuit board

#44

20110108315

2011-05-12

Process for fabricating circuit substrate

#45

20110108313

2011-05-12

Fabricating process of circuit substrate

#46

20110091999

2011-04-21

Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device

#47

20110090656

2011-04-21

Terminal structure, electronic device, and manufacturing method thereof

#48

20110083885

2011-04-14

METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME

#49

20110072656

2011-03-31

Method for forming a current distribution structure

#50

20110056740

2011-03-10

Method of manufacturing a through-hole electrode substrate

#51

20110056738

2011-03-10

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

#52

20110037171

2011-02-17

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

#53

20110036620

2011-02-17

Printed circuit board and method for fabricating the same

#54

20110005822

2011-01-13

STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE

#55

20100307801

2010-12-09

Multilayer ceramic substrate and manufacturing method thereof

#56

20100302747

2010-12-02

System and method for coupling a lens to a printed circuit

#57

20100227462

2010-09-09

Pad structure for liquid crystal display and method of manufacturing thereof

#58

20100214728

2010-08-26

Mounting board and display device

#59

20100207847

2010-08-19

Plasma display device

#60

20100200279

2010-08-12

Electronic component mounting substrate and method for manufacturing electronic component mounting substrate

#61

20100163293

2010-07-01

Printed wiring board and method for manufacturing printed wiring board

#62

20100163287

2010-07-01

Method of manufacturing a substrate structure

#63

20100147574

2010-06-17

Wiring board and method of manufacturing the same

#64

20100141888

2010-06-10

Liquid crystal display and method for manufacturing the same

#65

20100140800

2010-06-10

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

#66

20100096750

2010-04-22

Packaging substrate

#67

20100096165

2010-04-22

Golden finger for flexible printed circuitboard

#68

20100059858

2010-03-11

Integrated capacitors in package-level structures, processes of making same, and systems containing same

#69

20100052148

2010-03-04

PACKAGE STRUCTURE AND PACKAGE SUBSTRATE

#70

20100038803

2010-02-18

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

#71

20100032194

2010-02-11

PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD AND ELECTRONIC DEVICE

#72

20100009471

2010-01-14

Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device

#73

20100006327

2010-01-14

CIRCUIT BOARD STRUCTURE

#74

20090229879

2009-09-17

Printed circuit board and mounting structure for surface mounted device

#75

20090225268

2009-09-10

Mounting structure and electro optical device

#76

20090174073

2009-07-09

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME

#77

20090166068

2009-07-02

Electronic component

#78

20090146316

2009-06-11

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

#79

20090139748

2009-06-04

Wiring substrate

#80

20090133917

2009-05-28

Multilayered Circuit Board for Connection to Bumps

#81

20090101398

2009-04-23

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

#82

20090095519

2009-04-16

Current distribution structure and method

#83

20090050359

2009-02-26

Circuit board having electrically connecting structure and fabrication method thereof

#84

20090038838

2009-02-12

Circuit board and method for fabricating the same

#85

20090026462

2009-01-29

WIRING SUBSTRATE AND METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE

#86

20090020323

2009-01-22

Circuit board structure and method for fabricating the same

#87

20090004504

2009-01-01

Circuit system with circuit element and reference plane

#88

20090002973

2009-01-01

Mount Board and Electronic Device

#89

20080308931

2008-12-18

Electronic structures including barrier layers defining lips

#90

20080266508

2008-10-30

Liquid crystal display and method for manufacturing the same

#91

20080265411

2008-10-30

Structure of packaging substrate and method for making the same

#92

20080257595

2008-10-23

Packaging substrate and method for manufacturing the same

#93

20080246146

2008-10-09

Wiring substrate and wiring substrate manufacturing method

#94

20080217046

2008-09-11

Circuit board surface structure and fabrication method thereof

#95

20080176035

2008-07-24

Circuit board structure

#96

20080150657

2008-06-26

Tunable high impedance surface device

#97

20080099928

2008-05-01

Low fabrication cost, high performance, high reliability chip scale package

#98

20080099233

2008-05-01

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

#99

20080093115

2008-04-24

Interposer, electrical package, and contact structure and fabricating method thereof

#100

20080087986

2008-04-17

Materials, structures and methods for microelectronic packaging

#101

20080026558

2008-01-31

Pad structure for liquid crystal display and method of manufacturing thereof

#102

20080020602

2008-01-24

Electrically connecting terminal structure of circuit board and manufacturing method thereof

#103

20080017410

2008-01-24

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

#104

20080003803

2008-01-03

Semiconductor package substrate for flip chip packaging

#105

20070281557

2007-12-06

Method of fabricating circuit board having different electrical connection structures

#106

20070281503

2007-12-06

METHOD FOR REPAIRING CONDUCTIVE STRUCTURE OF CIRCUIT BOARD

#107

20070281389

2007-12-06

Method for fabricating electrical conductive structure of circuit board

#108

20070278673

2007-12-06

Methods for repairing circuit board having defective pre-soldering bump

#109

20070278670

2007-12-06

Multilayer electronic component, electronic device, and method for producing multilayer electronic component

#110

20070278654

2007-12-06

Method of making an electronic package

#111

20070249155

2007-10-25

Method to manufacture a coreless packaging substrate

#112

20070249154

2007-10-25

Method to manufacture a coreless packaging substrate

#113

20070242207

2007-10-18

FLAT DISPLAY PANEL AND CONNECTION STRUCTURE

#114

20070200254

2007-08-30

Method and apparatus for using flex circuit technology to create an electrode

#115

20070186412

2007-08-16

Method for fabricating circuit board with conductive structure

#116

20070161223

2007-07-12

Conductive structures for electrically conductive pads of circuit board and fabrication method thereof

#117

20070158838

2007-07-12

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

#118

20070158818

2007-07-12

Integrated capacitors in package-level structures, processes of making same, and systems containing same

#119

20070155156

2007-07-05

Bonding pad structure for a display device and fabrication method thereof

#120

20070114673

2007-05-24

Wiring substrate and electronic parts packaging structure

#121

20070108619

2007-05-17

Bonding pad with high bonding strength to solder ball and bump

#122

20070041163

2007-02-22

Method for producing an electronic component or module and a corresponding component or module

#123

20070035010

2007-02-15

Circuit substrate

#124

20070024795

2007-02-01

Liquid crystal display and method for manufacturing the same having particular pad unit

#125

20070024794

2007-02-01

Liquid crystal display and method for manufacturing the same

#126

20070000685

2007-01-04

Connecting sheet

#127

20060290742

2006-12-28

Circuit board for inkjet head

#128

20060279000

2006-12-14

Pre-solder structure on semiconductor package substrate and method for fabricating the same

#129

20060257631

2006-11-16

Probe pad structure in a ceramic space transformer

#130

20060252249

2006-11-09

Solder ball pad surface finish structure of circuit board and fabrication method thereof

#131

20060225917

2006-10-12

Conductive bump structure of circuit board and fabrication method thereof

#132

20060220246

2006-10-05

Bump land structure of circuit substrate for semiconductor package

#133

20060219567

2006-10-05

Fabrication method of conductive bump structures of circuit board

#134

20060181218

2006-08-17

Display apparatus and method of manufacturing the same

#135

20060169484

2006-08-03

Printed wiring board having a solder pad and a method for manufacturing the same

#136

20060113108

2006-06-01

Printed wiring board and a method of manufacturing the same

#137

20060096778

2006-05-11

Protective circuit board for battery pack

#138

20060090335

2006-05-04

Method for fabricating connection terminal of circuit board

#139

20060081977

2006-04-20

Ceramic multilayer substrate

#140

20060060956

2006-03-23

Materials, structures and methods for microelectronic packaging

#141

20060051952

2006-03-09

Method for fabricating conductive bump of circuit board

#142

20060037192

2006-02-23

Printed wiring board without traces on surface layers enabling PWB's without solder resist

#143

20060017873

2006-01-26

Liquid crystal display and method for manufacturing the same having particular pad unit

#144

20050282315

2005-12-22

High-reliability solder joint for printed circuit board and semiconductor package module using the same

#145

20050250249

2005-11-10

Method of making an electronic package

#146

20050242437

2005-11-03

Method and apparatus for supporting microelectronic substrates

#147

20050215086

2005-09-29

Sheet-form connector and production method and application therefor

#148

20050215045

2005-09-29

Methods of forming bumps using barrier layers as etch masks

#149

20050215043

2005-09-29

Low fabrication cost, high performance, high reliability chip scale package

#150

20050205293

2005-09-22

Substrate

#151

20050189650

2005-09-01

Low fabrication cost, high performance, high reliability chip scale package

#152

20050167830

2005-08-04

Pre-solder structure on semiconductor package substrate and method for fabricating the same

#153

20050140008

2005-06-30

Electronic circuit unit and method of fabricating the same

#154

20050122462

2005-06-09

Liquid crystal display device and fabricating method thereof

#155

20050072597

2005-04-07

Bonding pad structure for a display device and fabrication method thereof

#156

20050054187

2005-03-10

Method for forming ball pads of BGA substrate

#157

20050017058

2005-01-27

Method of fabricating circuit substrate