Inlay With Exposed Porous Layer, Component Carrier, and Manufacturing Method

PRINTED CIRCUIT BOARD HAVING LEAD PADS THAT ACCOMMODATE OFFSET ELECTRONIC COMPONENT LEADS

Apparatus and methods for nanoplasma switches

ELECTRONIC DEVICE

Inlay With Exposed Porous Layer, Component Carrier and Manufacturing Methods

Board-level pad pattern for multi-row QFN packages

Package to printed circuit board transition

Film for a package substrate

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

Conductive terminal and connector assembly

Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device

Printed wiring board and method for manufacturing the same

Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate

Printed circuit board via design

Multichannel RF feedthroughs

RJ-45 communication plug with plug blades received in apertures in a front edge of a printed circuit board

High voltage polymer dielectric capacitor isolation device

Patch cord having a plug with contacts having a curved segment extending forwardly of a front edge of a printed circuit board

Method of fabricating touch screen panel

Package substrate and method for manufacturing package substrate

Communication patch cord having a plug with contact blades connected to conductors of a cable

Manufacturing method of part-mounting package

High voltage polymer dielectric capacitor isolation device

Electronic modules having grounded electromagnetic shields

Patch cord having a plug contact with a signal injection point in its middle

Connecting power leads to circuit board

Connection board, optoelectronic component arrangement and illumination device

Display apparatus

Attenuation reduction grounding pattern structure for connection pads of flexible circuit board

External storage device and method of manufacturing external storage device

Connector assembly and female connector used for the same

Wiring board and semiconductor device

Patch cord having a plug with differential transmission lines

Communication plug having a printed circuit board with surface mounted blades

Apparatus capable of selectively using different types of connectors

PRINTED CIRCUIT BOARD

Circuit-terminal connecting device

Electrical connector assembly

WIRING BOARD, CONNECTOR AND ELECTRONIC APPARATUS

Light emitting device including a light emitting element mounted on a sub-mount

Multichannel RF feedthroughs

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR

Ceramic substrate and method for manufacturing the same

Method of manufacturing an electronic module

Compliant core peripheral lead semiconductor test socket

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Touch screen panel and fabricating method therof

Method for providing an alternative power source for a graphics card

Method of fabricating wiring board and method of fabricating semiconductor device

Method for forming pattern and a wired board

External storage device and method of manufacturing external storage device

Connector

Double-side-conducting flexible-circuit flat cable with cluster section

Apparatus capable of selectively using different types of connectors

Board with connection terminals

Female connector, male connector assembled to the same, and electric/electronic apparatus using them

PLASMA DISPLAY DEVICE

PRINTED CIRCUIT BOARD UNIT AND ELECTRONIC DEVICE

CIRCUIT BOARD VIA STRUCTURE AND METHOD FORMING THE SAME

Apparatus for stacking integrated circuits

PLANAR ILLUMINATION DEVICE

DISPLAY DEVICE AND METHOD OF DRIVING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Printed wiring board

Plasma display device

Electrical isolating structure for conductors in a substrate

Method for manufacturing a multilayer printed wiring board

Multilayered printed circuit board

LIGHT EMITTING DEVICE, DISPLAY DEVICE AND SOLID-STATE LIGHT EMITTING ELEMENT SUBSTRATE

Printed circuit board and manufacturing method therefor

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Printed circuit board ball grid array system having improved mechanical strength

Sub-mount, light emitting device including sub-mount and methods of manufacturing such sub-mount and/or light emitting device

Method and apparatus of changing PCB pad structure to increase solder volume and strength

Wafer level package and method of manufacturing the same

Electronic component mounting board, method for manufacturing the same and electronic circuit unit

Multilayer printed wiring board and electronic device using the same

Apparatus and methods for the measurement of cardiac output

Socket, method for manufacturing socket, and semiconductor device

Method for forming laminated multiple substrates

Method and apparatus for providing an alternative power source for a graphics card

Stacked semiconductor module, method of fabricating the same, and electronic system using the same

Printed circuit board interconnecting structure with compliant cantilever interposers

Power electronic module having improved heat dissipation capability

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR FABRICATION THEREOF

Multilayered printed circuit board

PRINTED WIRING BOARD STRUCTURE AND ELECTRONIC APPARATUS

Method for manufacturing multilayer wiring board

Flexible printed circuit

Sensor and manufacturing method of sensor

Motor

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

High-frequency PCB connections that utilize blocking capacitors between the pins

Printed circuit board with embedded circuit component

Low fabrication cost, high performance, high reliability chip scale package

PRINTED CIRCUIT BOARD AND A METHOD FOR IMBEDDING A BATTERY IN A PRINTED CIRCUIT BOARD

LIQUID CRYSTAL DISPLAY

Technique for laminating multiple substrates

Package substrate

Via heat sink material

High speed, high density board to board interconnect

Electrical connector

Camera module, method of manufacturing the same, and printed circuit board for the camera module

RF and MMIC stackable micro-modules

SEMICONDUCTOR MEMORY CARD

Circuit board with configurable ground link

Adjusting a characteristic of a conductive via stub in a circuit board

PRINTED CIRCUIT BOARD INTERCONNECTION AND METHOD

PCB and connector design

Micro solder pot

Flyback transformer wire attach method to printed circuit board

Method of fabricating wiring board and method of fabricating semiconductor device

Printed circuit board and manufacturing method therefor

Long range optical reader

Method for forming a conductive pattern and a wired board

Inductor

Printed circuit boards for use in optical transceivers

Device for reflecting electromagnetic radiation

Wiring board and method for producing same

Circuit board and electric device having circuit board

Multilayered printed circuit board

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Chip package substrate having soft circuit board and method for fabricating the same

Printed circuit boards having improved solder pads

Laser beam processing method and component machined by the method

Flyback transformer wire attach method to printed circuit board

Low fabrication cost, high performance, high reliability chip scale package

Low fabrication cost, high performance, high reliability chip scale package

RF and MMIC stackable micro-modules

Direct contact power transfer pad and method of making same

Via heat sink material

Method for connecting connection members to board

Apparatus and method for stacking integrated circuits

Laser diode driving circuit and an optical head

Printed wiring board having impedance-matched differential pair signal traces

Flyback transformer wire attach method to printed circuit board

Method for fabricating a substrate, including a plurality of chip package substrates