SOLDER PREFORM ASSEMBLY AND METHODS OF PREFORMING SOLDER FOR ELECTRONIC BOARD ASSEMBLY

CONNECTOR

OPTICAL MODULE

INTEGRATED CIRCUIT (IC) ASSEMBLY INCLUDING A DIRECT CONNECTION PAD STRUCTURE FOR A SURFACE-MOUNT DEVICE (SMD)

BALL ATTACH TOOL

WIRING BOARD AND MOUNTING STRUCTURE USING SAME

SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVED SINGLE ENDED SIGNALING

Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole

Lead-Free Solder Ball

Methods and heat distribution devices for thermal management of chip assemblies

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Circuit board structure and manufacturing method thereof

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

3D GLASS MODULES

Methods and heat distribution devices for thermal management of chip assemblies

Printed circuit board

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

CONNECTOR

Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

Vacuum-assisted BGA joint formation

Sliding device for supplying or removing a sliding process material to or from a surface of an object to be conveyed

APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD FOR FORMING THE SAME

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

Board-to-board connecting structure and method for manufacturing the same

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONICS AND ENHANCED VIA RELIABILITY

Methods and heat distribution devices for thermal management of chip assemblies

Methods and heat distribution devices for thermal management of chip assemblies

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINISHED PROBE PRODUCT, MANUFACTURING METHOD THEREOF, PROBE CARD, AND MANUFACTURING METHOD THEREOF

Apparatus with embedded fine line space in a cavity, and a method for forming the same

Touch sensor module and image display device comprising same

Processor and chipset continuity testing of package interconnect for functional safety applications

Method for orienting solder balls on a BGA device

Reversible electronic card and method of implementation thereof

High frequency module, board equipped with antenna, and high frequency circuit board

Printed wiring board and method for manufacturing printed wiring board

Electronic device comprising an electronic component mounted on a support substrate and assembly method

Solder ball feeding device

Circuit board structures and methods of fabricating the same

Printed wiring board and method for manufacturing printed wiring board

Solder ball, solder joint, and joining method

Method for orienting solder balls on a BGA device

Ball grid array and land grid array assemblies fabricated using temporary resist

"Lead-Free Solder Ball"

Processor and chipset continuity testing of package interconnect for functional safety applications

Wiring board, electronic device, and wiring board manufacturing method

Method for bonding flexible part including inclined leads

Capacitor

Socket receiving an electronic component having a plurality of contact pads

Electrical connector

Separator for electrical assembly

HYBRID LOW METAL LOADING FLUX

Guiding board for a ball placement machine

TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR TEST SOCKET

MULTILAYER PRINTED CIRCUIT BOARD

Manufacturing method for semiconductor package with cantilever pads

Method for cleaning an Electronic circuit board

RF INTERCONNECT

Package to board interconnect structure with built-in reference plane structure

High frequency module, board equipped with antenna, and high frequency circuit board

Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate

Lead-Free Solder Ball

Electrical connector with terminals made from soldering balls

Conductive particle, and connection material, connection structure, and connecting method of circuit member

Method Of Making A Camera For Use On A Vehicle

Using white LEDs to enhance intensity of colored light from colored LEDs

Method for producing metal ball, joining material, and metal ball

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

Printed wiring board assembly, electrical device, and method for assembling printed wiring board assembly

Systems and methods for reinforced adhesive bonding

Methods of forming trenches in packages structures and structures formed thereby

SOLDER MASK FIRST PROCESS

Electrical connector with laser soldering and method for assembling the same

Component mounting method

Component mounting method

CPU package substrates with removable memory mechanical interfaces

Cu core ball

Methods of fabricating an electronic package structure

Ball grid array and land grid array assemblies fabricated using temporary resist

Method for orienting solder balls on a BGA device

Carrier substrate

Electronic package design that facilitates shipping the electronic package

Method for fabricating circuit board structure

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

Apparatus for cleaning an electronic circuit board

Apparatus for adsorbing solder ball and method of attaching solder ball using the same

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS

SOLDER BALL ATTACHING APPARATUS AND METHOD OF MANUFACTURING THE SAME

Multi-layer substrate and method of manufacturing multi-layer substrate

Cu ball

BALL GRID ARRAY MOUNTING SYSTEM

Connector

Face-up substrate integration with solder ball connection in semiconductor package

Conductive ball mounting device

SOLDER ALLOY FOR LOW-TEMPERATURE PROCESSING

Solderable conductive polymer thick film composition

Printed circuit board having buried circuit pattern and method for manufacturing the same

Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer

Electrical connector

SOLDER BALL ATTACHING APPARATUS, FLUX DOTTING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFACTURING PRINTED WRING BOARD USING MASK

Lead-free solder ball

Substrate structure and fabrication method thereof

Ball grid array system

Solder ball and electronic member

Bump electrode, board which has bump electrodes, and method for manufacturing the board

Ball mounting method and working machine for board

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Hybrid interconnect

Under ball metallurgy (UBM) for improved electromigration

Printing circuit board with traces in an insulator

Carrier substrate and manufacturing method thereof

Method of mounting semiconductor element, and semiconductor device

Under ball metallurgy (UBM) for improved electromigration

High-speed transportation mechanism for micro solder balls

Method of forming external terminals of a package and apparatus for performing the same

Metal core solder ball and heat dissipation structure for semiconductor device using the same

BGA structure using CTF balls in high stress regions

Hybrid low metal loading flux

SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD

High performance surface mount electrical interconnect

Electrical interconnect IC device socket

Printed circuit board and method for manufacturing the same

Conductive ball mounting method

Laminated flex circuit layers for electronic device components

METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS

Systems and methods for vertically stacking a sensor on an integrated circuit chip

VIAS FOR MITIGATING PAD DELAMINATION

Spherical solder reflow method

Printed wiring board and method for manufacturing the same

PRINTED WIRING BOARD

Method for manufacturing multilayer printed wiring board

Solder ball for semiconductor packaging and electronic member using the same

Terminal assembly with regions of differing solderability

Electrical connector and terminal thereof

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Three-dimensional coiling via structure for impedance tuning of impedance discontinuity

Solder ball loading mask, apparatus and associated methodology

Solder Ball Loading Mask, Apparatus And Associated Methodology

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Interposer-embedded printed circuit board

Wiring substrate manufacturing method

Wiring board and method of manufacturing a semiconductor device

WIRING SUBSTRATE MANUFACTURING METHOD

Method of producing circuit board

Printed wiring board and a method of manufacturing a printed wiring board

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Multilayer wiring substrate

SOLDER BALL MOUNTING APPARATUS, SOLDER BALL MOUNTING METHOD, AND METAL BALL MOUNTING APPARATUS

Wiring substrate and method of manufacturing the same

CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE

Solder bump formation on a circuit board using a transfer sheet

Printed wiring board and method for manufacturing printed wiring board

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Printed wiring board

Solder Ball Pin

Electrical element and electrical connector

MANUAL METHOD FOR REBALLING USING A SOLDER PREFORM

Semiconductor device and method of manufacturing the same

Method of manufacturing a wired circuit board

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLECTIVE MOUNTING METHOD AND COLLECTIVE MOUNTING APPARATUS

Circuit Board with Variable Topography Solder Interconnects

Bumping Electronic Components Using Transfer Substrates

Wiring board

Method of manufacturing a printed wiring board

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Conductive ball mounting apparatus having a movable conductive ball container

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

PACKAGE PROCESS AND PACKAGE STRUCTURE

Solder attached contact and a method of manufacturing the same

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

Apparatus and method for arranging magnetic solder balls

Solder ball printing apparatus

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Terminal assembly with regions of differing solderability

Conductive ball mounting apparatus and conductive ball mounting method

Formation of solder bumps

Micro Ball Feeding Method

Substrate manufacturing apparatus, substrate manufacturing method, ball-mounted substrate, and electronic component-mounted substrate

Method for depositing solder material on an electronic component part

BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD

Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board

Printed wiring board

Electronic component built-in substrate and method of manufacturing the same

Method for fabricating flip-attached and underfilled semiconductor devices

Solder ball mounting method and apparatus

Conductive ball mounting apparatus

Electronic Part Manufacturing Method

Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly

Solder ball printing apparatus

Printed wiring board

Method and device for transferring a solder deposit configuration

Method and device for contacting, positioning and impinging a solder ball formation with laser energy

Method of forming collapse chip connection bumps on a semiconductor substrate

Minute ball array apparatus

Securing integrated circuit dice to substrates

METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS

Apparatus for mounting conductive balls

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

Method of bonding semiconductor devices utilizing solder balls

Solder ball loading mask, apparatus and associated methodology

Techniques for arranging solder balls and forming bumps

SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD

PRODUCTION METHOD OF SOLDER CIRCUIT BOARD

Device for applying an electronic component

Flux for soldering and method for manufacturing an electronic device using the same

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Microball attachment using self-assembly for substrate bumping

Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure

Conductive ball mounting method and surplus ball removing apparatus

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING THE SAME

Solder ball attachment ring and method of use

METHOD OF FORMING CONDUCTIVE BUMPS

Multi-beam laser bonding apparatus and bonding method using the same

Solder ball mounting device

Method for manufacturing a printed wiring board

Solder Ball Placement Vacuum Tool

Printed circuit board

MULTICHIP MODULE

HGA suspension pad barrier for elimination of solder bridging defect

Electrical contact with retaining device for clipping solder ball

Method of forming solder bumps on substrates

Solder ball loading method and solder ball loading unit

Three dimensional packaging optimized for high frequency circuitry

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Apparatus and method for arranging magnetic solder balls

Method of mounting conductive ball and conductive ball mounting apparatus

Connection structure between wired circuit boards

CONDUCTIVE BALL MOUNTING APPARATUS

Device packages

Thermally insulating bonding pad structure for solder reflow connection

Method of providing a RF shield of an electronic device

Method and apparatus for loading solder balls

Apparatus and method of mounting conductive ball

Approaches for manufacturing a head gimbal assembly

Conductive ball mounting method and apparatus having a movable solder ball container

Solder bump forming method

Conductive ball mounting method

Flip-chip package structure, and the substrate and the chip thereof

Method and apparatus for placing conductive balls

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

Method for manufacturing a printed wiring board

Micro-ball loading device and loading method

BONDING METHOD AND BONDING APPARATUS

MANUAL METHOD FOR REBALLING USING A SOLDER PREFORM

Method and device for transferring a solder deposit configuration

Conductive ball arraying apparatus

Printed wiring board and a method of manufacturing a printed wiring board

Substrate manufacturing method

BGA socket having extensible solder ball so as to compensate warpage connector housing

Method for manufacturing a printed wiring board

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION

Method of manufacturing a wired circuit board

Soldering method and apparatus

Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same

Conductive ball mounting apparatus and conductive ball mounting method

Transfer mask in micro ball mounter

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

Fine pitch electrical interconnect assembly

Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint

SOLDERING NOZZLE AND APPARATUS USING THE SAME

Connector applied underfill

Bumping electronic components using transfer substrates

Low-thickness electronic module comprising a stack of electronic packages provided with connection balls

Suspension board with circuit

Head gimbal assembly with improved interconnection between head slider and suspension, fabricating method thereof, and magnetic disk drive with the same

Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same

Electrical terminal

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Electrical terminal

Mounting method for semiconductor parts on circuit substrate

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

Method for the production of a soldered joint

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Solder ball mounting method and solder ball mounting apparatus

Solder ball mounting method and solder ball mounting substrate manufacturing method

Automated ball mounting process with solder ball testing

Method of providing solder bumps on a substrate using localized heating

Manufacturing method and manufacturing apparatus of printed wiring board

Apparatus and method for supplying electrically conductive material

Electrical connector

Electrical contacts and electrical connector assembly having such electrical contacts

System and method for reducing stress-related damage to ball grid array assembly

Ball transferring method and apparatus

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

ELECTRONIC DEVICE WITH A PLURALITY OF SUBSTRATES AND METHOD FOR MANUFACTURING SAME

Method of providing mixed size solder bumps on a substrate using a solder delivery head

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method

Electrical connector

IC contact for LGA socket

Method of providing solder bumps using reflow in a forming gas atmosphere