Printed circuit board minimizing undesirable signal reflections in a via and methods therefor

Method and device for applying a solder to a substrate

Molded SiP package with reinforced solder columns

Electrical connector and terminal thereof

Structure of circuit board

Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device

Method of manufacturing a composite electronic part, and composite electronic part

Wired circuit board and connection structure between wired circuit boards

Methods of making microelectronic assemblies

Electrical connector with stepped housing

Flux for soldering, soldering method, and printed circuit board

Flip-attached and underfilled stacked semiconductor devices

Ball grid array package

Integrated circuit package having metallic members intruding into solder balls

Solder deposit method on electronic packages for post-connection process

Method for depositing solder material on an electronic component part using separators

Manufacturing method of flexible printed wiring board

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Solder ball placement system

Method and apparatus for mounting conductive ball

Method for improved high current component interconnections

Conductive ball arraying apparatus

Semiconductor device manufacturing method

Method and apparatus for attaching solder balls to substrate

SOLDER BALL EXCELLENT IN MICRO-ADHESION PREVENTING PROPERTIES AND WETTING PROPERTIES AND METHOD FOR PREVENTING THE MICRO-ADHESION OF SOLDER BALLS

SOLDERING METHOD AND APPARATUS

MAGNETIC HEAD ASSEMBLY HAVING AuSn DISPERSION LAYER AND METHOD OF SOLDER BONDING

Printed wiring board

Electrical contacts having solder stops

Electronic Part Manufacturing Method

Printed wiring board

Soldering device and method for forming electrical solder connections in a disk drive unit

Support with solder ball elements and a method for populating substrates with solder balls

Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length

Electronic part manufacturing method

Method of bonding metal ball for magnetic head assembly

Apparatus and method for solder ball placement

Electronic circuit protection device

Method and circuit structure employing a photo-imaged solder mask

Conductive terminal and the electrical connector using the conductive terminal

Contact terminal structure

Contact terminal structure

Ball film for integrated circuit fabrication and testing

Manufacturing method for wiring circuit substrate

Method of bonding solder pads of flip-chip package

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Three dimensional packaging optimized for high frequency circuitry

Conductive ball mounting apparatus

Method of making a circuitized substrate

Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy

Conductive ball mounting apparatus

Slider, magnetic head assembly and manufacturing the same

Soldering method, soldering device, bonding method, bonding device, and nozzle unit

Method for fabricating flip-attached and underfilled semiconductor devices

Apparatus including a dielectric mirror and method of reflecting radiation away from a portion of an apparatus

Wired circuit board

Electrical contacts having solder stops

Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass

Ball mounting method

Soldering method and apparatus

Methods relating to forming interconnects

Solder ball loading method and solder ball loading unit background of the invention

Ball grid array contacts with spring action

Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension

Method of making a circuitized substrate

Electronic circuit and method of manufacturing the same

Conductive terminal and the electrical connector using the conductive terminal

Multi-layered flexible print circuit board and manufacturing method thereof

Injection molded metal bonding tray for integrated circuit device fabrication

Substrate via pad structure providing reliable connectivity in array package devices

Conductive terminal and the electrical connector using the conductive terminal

Suspension board with circuit

Method and apparatus for electrically coupling a slider to a wireless suspension substrate

Wired circuit board

Method and apparatus for placing conductive balls

Electrical connector with a solder ball locking structure

Bonding apparatus using conductive material

Conductive ball bonding method and conductive ball bonding apparatus

Flux for soldering, soldering method, and printed circuit board

Electrical connector with a solder ball locking structure

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

Semiconductor device and manufacturing method thereof

Method for attaching an IC socket connector to a circuit board

Method of connecting a contact with a solder and an electronic device using the method

Method for forming bump on electrode pad with use of double-layered film

Heat-decaying materials, transfer sheet using the same, and patterning method

Method for the precise and reliable placement of solid metallic and non-metallic particles

Manufacturing method of semiconductor device

Solder ball formation structure for a terminal socket

Repairable ball grid array contact

Methods and apparatus for transferring conductive pieces during semiconductor device fabrication

Method for improved high current component interconnections

Circuit board for connecting an integrated circuit to a support and IC BGA package using same

Method for manufacturing an ink-jet head

Method of creating solder bar connections on electronic packages

Semiconductor component assemblies having interconnects

Rotating disk storage device and integrated wire head suspension assembly

Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls

Head/slider supporting structure having lead wire inclined relative to slider pad

Electrical connection and component assembly for constitution of a hard disk drive

Ball transferring method and apparatus

Stacked IC

Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale

Colored conductive wires for a semiconductor package

Flip-chip solder bump formation using a wirebonder apparatus

Method and apparatus for conductive ball bonding of components

Electrical connector and contact

Method of applying a pattern of particles to a substrate

Ball mounting method

Manufacturing method of ball grid array package

Ball grid array resistor network

Ball grid array resistor network

Method of constructing an integrated lead suspension

Solder bonding method and solder bonding device

Methods relating to forming interconnects and resulting assemblies

Method and system for packaging ball grid arrays

Integrated lead suspension and method of construction

Connector with solder-bearing contact

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Junction structure and junction method for conductive projection

Solder ball bonding method and bonding device

Ball film for integrated circuit fabrication and testing

Method of making a circuitized substrate

Method of constructing an integrated lead suspension

Integrated lead suspension and method of construction

Method of constructing an integrated lead suspension

Electrical connection and component assembly for constitution of a hard disk drive

Semiconductor device and method for production thereof

Solder bearing conductive terminal

Conductive block mounting process for electrical connection

Ball grid array package

Methods of bonding solder balls to bond pads on a substrate, and bonding frames

Solder preform assembly and methods of preforming solder for electronic board assembly

Solder ball module for contact assembly of an electrical connector

Manufacturing method of circuit substrate including electronic device

Electrical connector

Extended landing pad substrate package structure and method