ClassID:

234830

H05K2203/0769 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Uses of liquids, e.g. rinsing, coating, dissolving Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure

Recent Application in this class:
#1
20240206076
2024-06-20

Methods of making metal patterns on flexible substrate

#2
20220151081
2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#3
20210161018
2021-05-27

Methods of making metal patterns on flexible substrate

#4
20200344895
2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#5
20200329567
2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#6
20190306991
2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#7
20180311889
2018-11-01

Method for treating millimetre and/or micrometre and/or nanometre structures on a surface of a substrate

#8
20180020546
2018-01-18

Method of manufacturing flexible electronic circuits having conformal material coatings

#9
20170164484
2017-06-08

Conductive patterns and methods of using them

#10
20170164482
2017-06-08

Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates

#11
20170013723
2017-01-12

Etch-resistant inkjet inks for manufacturing conductive patterns

#12
20160250830
2016-09-01

Fluororesin base material, printed wiring board, and circuit module

#13
20160249822
2016-09-01

Flexible conductive track arrangement and manufacturing method

#14
20160192482
2016-06-30

Patterned conductive structure and method for forming the same

#15
20160137860
2016-05-19

Hot melt compositions with improved etch resistance

#16
20160066430
2016-03-03

Hot melt compositions with improved etch resistance

#17
20160050750
2016-02-18

Biodegradable materials for multilayer transient printed circuit boards

#18
20150271924
2015-09-24

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE, AND MULTILAYER CIRCUIT BOARD

#19
20150053643
2015-02-26

Hot melt compositions with improved etch resistance

#20
20150027768
2015-01-29

Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

#21
20140323968
2014-10-30

Materials, electronic systems and modes for active and passive transience

#22
20140305900
2014-10-16

Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates

#23
20140179060
2014-06-26

In situ-built pin-grid arrays for coreless substrates, and methods of making same

#24
20140144674
2014-05-29

Electrical components and methods of manufacturing electrical components

#25
20140021169
2014-01-23

Polyimide-containing layer and method for etching polyimide-containing layer

#26
20130188323
2013-07-25

Recyclable circuit assembly

#27
20130068511
2013-03-21

System and method for formation of electrical conductors on a substrate

#28
20130056247
2013-03-07

Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board

#29
20130001794
2013-01-03

In situ-built pin-grid arrays for coreless substrates, and methods of making same

#30
20120308718
2012-12-06

Fabricating method for multilayer printed circuit board

#31
20120012365
2012-01-19

THERMAL FLEX CONTACT CARRIERS #2

#32
20110247860
2011-10-13

Method of producing circuit board, and circuit board obtained using the manufacturing method

#33
20100330504
2010-12-30

Method for electroconductive pattern formation

#34
20100044078
2010-02-25

Laminate including water soluble release layer for producing circuit board and method of producing circuit board

#35
20100040874
2010-02-18

FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AND METHOD FOR MANUFACTURING CIRCUIT BOARD

#36
20090314528
2009-12-24

Wiring board and wiring board manufacturing method

#37
20090032915
2009-02-05

TFCC (TM) and SWCC (TM) thermal flex contact carriers

#38
20090014411
2009-01-15

Fabricating method for multilayer printed circuit board

#39
20080212301
2008-09-04

Electronic part mounting board and method of mounting the same

#40
20080137316
2008-06-12

Method for producing a high-aspect ratio conductive pattern on a substrate

#41
20080005901
2008-01-10

Method of coupling a surface mount device

#42
20070284706
2007-12-13

Interconnections resistant to wicking

#43
20070273605
2007-11-29

Method for forming radio frequency antenna

#44
20070194089
2007-08-23

Facility and method for high-performance circuit board connection

#45
20070066045
2007-03-22

Method for manufacturing substrate with cavity

#46
20070020445
2007-01-25

Flexible structures for sensors and electronics

#47
20060141159
2006-06-29

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.

#48
20060128176
2006-06-15

Selective application of conductive material to substrates by pick and place of compliant contact arrays

#49
20060110907
2006-05-25

Method for removing resin mask layer and method for manufacturing solder bumped substrate

#50
20060067065
2006-03-30

Holder for surface mount device during reflow

#51
20050253772
2005-11-17

Method for forming radio frequency antenna

#52
20050078035
2005-04-14

Method for forming radio frequency antenna

#53
20050070095
2005-03-31

Protective layer during scribing

#54
20050035462
2005-02-17

Selective application of conductive material to circuit boards by pick and place

#55
20050017369
2005-01-27

Interposer

#56
20050000730
2005-01-06

Printed wiring board, electronic component mounting method, and electronic apparatus