233819 ⎘
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material; After-treatment of the printed patterns, e.g. sintering or curing methods Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
CERAMIC CIRCUIT BOARD, MANUFACTURING METHOD FOR CERAMIC CIRCUIT BOARD, AND BRAZING MATERIAL FOR CIRCUIT FORMATION
#2PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING LAMINATED ELECTRONIC COMPONENT, AND LAMINATED ELECTRONIC COMPONENT
#3CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
#4THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT BONDED POWER DEVICES
#5Methods for printing a conductive pillar with high precision
#6Wiring formation method
#73D-printed ceramics with conductor infusion for ultra-high-speed electronics
#8FORMED FILM AND A MANUFACTURING METHOD THEREOF
#9METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS
#10Method for manufacturing ceramic substrate and ceramic substrate
#11CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
#12Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
#13Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention
#14Solvent composition for electronic device production
#15Printed substrate forming method
#16Aqueous based nanoparticle ink
#17Multilayered ceramic substrate and method for manufacturing same
#18Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
#19Highly conductive transparent glass-based circuit board
#20PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATION MATERIALS ON GREEN SHEET CERAMIC
#21Ceramic substrate and method for manufacturing ceramic substrate
#22Wiring board and method for manufacturing same
#23Methods of Fabricating Conductive Thick-Film Pastes of Base Metals with High Conductivity Achieved
#24Electric connection structure and electric connection member
#25Printed circuit board and electronic component
#26Circuit board and production method therefor
#27Insulating ceramic paste, ceramic electronic component, and method for producing the same
#28Method and system for in situ sintering of conductive ink
#29Ceramic circuit board and electronic device
#30ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME
#31Gas sensor, electrically conductive oxide sintered body, and wiring board
#32Precision screen printing with sub-micron uniformity of metallization materials on green sheet ceramic
#33Method of manufacturing a ceramic substrate
#34Ceramic substrate
#35METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND SILVER-BASED CONDUCTOR MATERIAL
#36CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME
#37Thick film paste and use thereof
#38Wiring forming method and circuit board
#39Ceramic substrate, electronic component, and method of manufacturing ceramic substrate
#40Electric connection structure and electric connection member
#41Multi-layer cooling element
#42Core-shell nanostructures and related inks, films and methods
#43NANO-SIZED SILVER PARTICLE INK, NANO-SIZED SILVER PARTICLE SINTERED BODY, AND METHOD FOR PRODUCING NANO-SIZED SILVER PARTICLE INK
#44TEMPERATURE SENSORS WITH INTEGRATED SENSING COMPONENTS
#45Multi-component nanoinks for direct write applications
#46Method for firing copper paste
#47Ceramic wiring board and method for producing the same
#48Conductive paste
#49METHODS OF FORMING HIGH DENSITY METAL WIRING FOR FINE LINE AND SPACE PACKAGING APPLICATIONS AND STRUCTURES FORMED THEREBY
#50PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER
#51Laminated ceramic electronic component
#52Conductive composition for thin film printing and method for forming thin film conductive pattern
#53Method of forming conductive trace
#54ESD protection device
#55TRANSPARENT CONDUCTIVE SUBSTRATE PRODUCTION METHOD AND TRANSPARENT CONDUCTIVE SUBSTRATE
#56COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD
#57Insulating ceramic paste, ceramic electronic component, and method for producing the same
#58Burning method
#59Two-step, direct-write laser metallization
#60COPPER PARTICLE COMPOSITION
#61METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK
#62METHOD OF FORMING METAL LINES HAVING HIGH CONDUCTIVITY USING METAL NANOPARTICLE INK ON FLEXIBLE SUBSTRATE
#63High speed differential wiring in glass ceramic MCMS
#64High speed differential wiring in glass ceramic MCMS
#65Conductive paste, method for forming wiring, electronic component, and silicon solar cell
#66TRANSPARENT CONDUCTIVE SUBSTRATE PRODUCTION METHOD, TRANSPARENT CONDUCTIVE SUBSTRATE, AND ELECTROSTATIC CAPACITANCE TOUCH PANEL
#67TEMPERATURE-RESISTANT, TRANSPARENT ELECTRICAL CONDUCTOR, METHOD FOR THE PRODUCTION THEREOF, AND USE THEREOF
#68Imprinted bi-layer micro-structure method with bi-level stamp
#69Imprinted bi-layer micro-structure method
#70Imprinted multi-layer micro-structure method with multi-level stamp
#71Imprinted multi-layer micro-structure
#72FORMATION OF CONDUCTIVE CIRCUIT
#73Thick print copper pastes for aluminum nitride substrates
#74Thick film conductive inks for electronic devices
#75Method of manufacturing a laminated electronic component
#76Circuit board made of AIN with copper structures
#77Conductive metal ink composition and method for forming a conductive pattern
#78Low firing temperature copper composition
#79Sensor device and method for manufacture
#80High performance surface mount electrical interconnect
#81High performance electrical circuit structure
#82Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid
#83Thick film paste and use thereof
#84CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL DEVICE USING THE SAME
#85Wireless telemetry electronic circuit board for high temperature environments
#86Method for manufacturing a circuit for high temperature and high g-force environments
#87Sensor device and method for manufacture
#88NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#89Process for producing ceramic substrate
#90Preparation method for an electroconductive patterned copper layer
#91Method of manufacturing non-shrinking multilayer ceramic substrate
#92NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#93CRYSTALLINE ENCAPSULANTS
#94Composite organic encapsulants
#95Ceramic multi-layer circuit substrate and manufacturing method thereof
#96Wireless telemetry electronic circuit board for high temperature environments
#97Printed circuit board and method of manufacturing the same
#98LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME
#99Ceramic substrate, method of manufacturing the same, and electrical device using the same
#100METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE
#101Method for manufacturing multilayer ceramic substrate
#102METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME
#103CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#104Embedded resistor and capacitor circuit and method of fabricating same
#105High-capacitance density thin film dielectrics having columnar grains formed on base-metal foils
#106Method for producing ceramic compact
#107Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
#108Methods for integration of thin-film capacitors into the build-up layers of a PWB
#109CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
#110METHOD FOR MANUFACTURING CERAMIC PLATES
#111Methods of making high capacitance density ceramic capacitors
#112Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board
#113Method for Producing Metallized Ceramic Substrate
#114Metal Thin Film-Forming Method And Metal Thin Film
#115Method of making thin-film capacitors on metal foil using thick top electrodes
#116Ceramic substrate and fabricating method thereof
#117Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof
#118Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components
#119Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
#120Organic encapsulant compositions for protection of electronic components
#121Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
#122Electrodes, inner layers, capacitors, electronic devices and methods of making thereof
#123Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
#124Oxygen doped firing of barium titanate on copper foil
#125Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
#126Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method
#127Method for producing dielectric ceramic powder and method for producing composite dielectric material
#128Thick-film dielectric and conductive compositions
#129Method of forming one or more base structures on an LTCC cofired module
#130Imprinted multi-layer micro structure method