H05K3/426 - CPC Classification Index

#1

20250301576

2025-09-25

HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL

#2

20240196540

2024-06-13

HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL

#3

20230389189

2023-11-30

Laminated film structure and method for manufacturing laminated film structure

#4

20230180397

2023-06-08

Method and process for creating high-performance coax sockets

#5

20230156924

2023-05-18

Laminated film structure and method for manufacturing laminated film structure

#6

20230063808

2023-03-02

COAXIAL VIA SHIELDED INTERPOSER

#7

20220279656

2022-09-01

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

#8

20220151081

2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#9

20220102295

2022-03-31

Substrate with gradiated dielectric for reducing impedance mismatch

#10

20220039260

2022-02-03

Wiring board

#11

20210329794

2021-10-21

METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

#12

20210251086

2021-08-12

MANUFACTURING METHOD OF CONDUCTIVE MEMBER

#13

20210051804

2021-02-18

Electroless and electrolytic deposition process for forming traces on a catalytic laminate

#14

20200413548

2020-12-31

Method for plating printed circuit board and printed circuit board using the same

#15

20200344895

2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#16

20200329567

2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#17

20200296837

2020-09-17

Methods of manufacturing printed wire boards

#18

20200275558

2020-08-27

Glass wiring board, method for manufacturing the same, and semiconductor device

#19

20200128680

2020-04-23

CIRCUIT BOARD AND PLATING METHOD THEREOF

#20

20190362987

2019-11-28

Substrate with glass sheet, resin layer and through-glass via

#21

20190306991

2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#22

20190306974

2019-10-03

Printed circuit board deformable in both length and width

#23

20190289715

2019-09-19

Circuit board, method of manufacturing circuit board, and electronic device

#24

20190177556

2019-06-13

Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate

#25

20190166698

2019-05-30

Molded interconnect device

#26

20190135010

2019-05-09

Array-type electrode, digital printing mold and method for manufacturing array-type electrode

#27

20190124763

2019-04-25

Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board

#28

20190045638

2019-02-07

Double-sided circuit board and method for preparing the same

#29

20190014666

2019-01-10

Process for forming traces on a catalytic laminate

#30

20180277471

2018-09-27

Through-hole electrode substrate

#31

20180206346

2018-07-19

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD THEREOF

#32

20180160528

2018-06-07

Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board

#33

20180145004

2018-05-24

Wiring board, and manufacturing method

#34

20180110118

2018-04-19

Length- and width-deformable printed circuit board and method for manufacturing the same

#35

20180002541

2018-01-04

Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate

#36

20170354034

2017-12-07

Printed wiring board and method of manufacturing the same

#37

20170309572

2017-10-26

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

#38

20170231096

2017-08-10

Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring circuit component

#39

20170231092

2017-08-10

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

#40

20170229318

2017-08-10

Method for producing glass substrate and glass sheet

#41

20170156209

2017-06-01

Method for manufacturing through wiring substrate and method for manufacturing device

#42

20170086295

2017-03-23

Inductor and capacitor integrated on a substrate

#43

20170013712

2017-01-12

Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas

#44

20160374206

2016-12-22

Method for manufacturing circuit board

#45

20160329273

2016-11-10

Through-hole electrode substrate

#46

20160295708

2016-10-06

Via in a printed circuit board

#47

20160278218

2016-09-22

Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material

#48

20160255721

2016-09-01

PRINTED CIRCUIT BOARD PRECURSOR

#49

20160192490

2016-06-30

Printed circuit board and method of manufacturing the same

#50

20160172293

2016-06-16

Interposer with signal-conditioned edge probe points

#51

20160128176

2016-05-05

Multilayer circuit board

#52

20150359097

2015-12-10

Structure of via hole of electrical circuit board

#53

20150351257

2015-12-03

METHOD FOR PRODUCING WIRING BOARD

#54

20150334836

2015-11-19

Via in a printed circuit board

#55

20150257282

2015-09-10

Substrate with conductive vias

#56

20150237742

2015-08-20

Method for treating substrate that support catalyst particles for plating processing

#57

20150060128

2015-03-05

Double-sided circuit board and method for preparing the same

#58

20150053469

2015-02-26

Printed circuit board and method of manufacturing the same

#59

20150021069

2015-01-22

Method of manufacturing printed circuit board

#60

20140345916

2014-11-27

Printed circuit board and method of manufacturing the same

#61

20140338965

2014-11-20

Printed wiring board

#62

20140290989

2014-10-02

Method of manufacturing a structure of via hole of electrical circuit board

#63

20140224527

2014-08-14

Flexible circuit board and process for producing the same

#64

20140151107

2014-06-05

Touch member and method of manufacturing the same

#65

20130334168

2013-12-19

MANUFACTURING METHOD OF CIRCUIT PATTERN

#66

20130328214

2013-12-12

Through-hole electrode substrate

#67

20130313122

2013-11-28

Method For Fabricating Conductive Structures of Substrate

#68

20130286610

2013-10-31

Base substrate, electronic device, and method of manufacturing base substrate

#69

20130242498

2013-09-19

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

#70

20130105202

2013-05-02

Circuit board structure

#71

20130089982

2013-04-11

Method of Fabricating a Substrate Having Conductive Through Holes

#72

20130075268

2013-03-28

Methods of Forming Through-Substrate Vias

#73

20130072012

2013-03-21

Method For Forming Package Substrate With Ultra-Thin Seed Layer

#74

20130008702

2013-01-10

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#75

20120329276

2012-12-27

Method for manufacturing a through hole electrode substrate

#76

20120312591

2012-12-13

Printed Circuit Board and Method of Manufacturing the Same

#77

20120305977

2012-12-06

Interposer and manufacturing method thereof

#78

20120255769

2012-10-11

PRINTED CIRCUIT BOARD

#79

20120220123

2012-08-30

Through-hole electrode substrate and method of manufacturing the same

#80

20120186867

2012-07-26

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#81

20120168316

2012-07-05

Fabricating process of embedded circuit structure

#82

20120160551

2012-06-28

EMBEDDED STRUCTURE OF CIRCUIT BOARD

#83

20120145665

2012-06-14

Method of manufacturing printed circuit board

#84

20120138341

2012-06-07

Hole in pad thermal management

#85

20120111609

2012-05-10

Printed circuit board having plating pattern buried in via

#86

20120103932

2012-05-03

METHODS FOR FABRICATING CURRENT-CARRYING STRUCTURES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIALS

#87

20120097319

2012-04-26

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE

#88

20120067633

2012-03-22

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#89

20120031656

2012-02-09

SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME

#90

20120031655

2012-02-09

Multi-layer circuit assembly and process for preparing the same

#91

20120012375

2012-01-19

Insulating material and printed circuit board having the same

#92

20110308845

2011-12-22

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#93

20110289773

2011-12-01

Method of manufacturing printed wiring board with built-in electronic component

#94

20110285007

2011-11-24

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

#95

20110253306

2011-10-20

Method of manufacturing multi-layer printed circuit board

#96

20110252641

2011-10-20

Method of manufacturing multi-layer printed circuit board

#97

20110232948

2011-09-29

Printed wiring board and method for manufacturing printed wiring board

#98

20110192637

2011-08-11

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#99

20110165732

2011-07-07

Semiconductor package having buss-less substrate

#100

20110108427

2011-05-12

Method of making substrate package with through holes for high speed I/O flex cable

#101

20110099807

2011-05-05

Method of manufacturing printed circuit board

#102

20110062594

2011-03-17

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

#103

20110061230

2011-03-17

Methods for fabricating current-carrying structures using voltage switchable dielectric materials

#104

20110056740

2011-03-10

Method of manufacturing a through-hole electrode substrate

#105

20110036626

2011-02-17

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#106

20110035939

2011-02-17

Method of manufacturing multilayer wiring board

#107

20110024164

2011-02-03

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

#108

20110023297

2011-02-03

MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

#109

20100317154

2010-12-16

Semiconductor device and method for manufacturing the same

#110

20100308968

2010-12-09

Miniature RFID tag

#111

20100276184

2010-11-04

Multilayer printed board and method for manufacturing the same

#112

20100254098

2010-10-07

Circuit board, mounting structure, and method for manufacturing circuit board

#113

20100239857

2010-09-23

STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#114

20100175811

2010-07-15

INSERT COMPONENT EMBEDDING METHOD

#115

20100164120

2010-07-01

Through-hole electrode substrate and method of manufacturing the same

#116

20100142170

2010-06-10

Method of manufacturing a chip embedded printed circuit board

#117

20100139960

2010-06-10

Method of manufacturing a printed circuit board

#118

20100122843

2010-05-20

Circuit board and method of manufacturing the same

#119

20100122840

2010-05-20

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

#120

20100113264

2010-05-06

Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, metal layer-coated resin film using the same, and method for producing metal layer-coated resin film

#121

20100096177

2010-04-22

Coreless substrate having filled via pad and method of manufacturing the same

#122

20100078826

2010-04-01

Substrate package with through holes for high speed I/O flex cable

#123

20100065324

2010-03-18

Method for making an embedded structure

#124

20100044079

2010-02-25

Metal Deposition

#125

20100040896

2010-02-18

Metal Deposition

#126

20100038121

2010-02-18

Metal Deposition

#127

20100038119

2010-02-18

Metal Deposition

#128

20100021649

2010-01-28

Method of manufacturing printed circuit board

#129

20100021045

2010-01-28

Manufacturing method of printed circuit board and manufacturing apparatus for the same

#130

20100018762

2010-01-28

BUILDUP PRINTED CIRCUIT BOARD

#131

20100018758

2010-01-28

PRINTED WIRING BOARD

#132

20100012357

2010-01-21

Printed circuit board with improved via design

#133

20100006328

2010-01-14

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#134

20090321119

2009-12-31

DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, MOBILE DEVICE, AND MANUFACTURING METHOD OF DEVICE MOUNTING BOARD

#135

20090297873

2009-12-03

FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME

#136

20090295685

2009-12-03

FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME

#137

20090295684

2009-12-03

FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME

#138

20090294296

2009-12-03

METHOD OF MANUFACTURING FLEXIBLE FILM

#139

20090284935

2009-11-19

Manufacturing process for a circuit board

#140

20090284443

2009-11-19

FLEXIBLE FILM AND DISPLAY DEVICE INCLUDING THE SAME

#141

20090282674

2009-11-19

Electrical interconnect structure and process thereof and circuit board structure

#142

20090260868

2009-10-22

Printed circuit board and method of manufacturing the same

#143

20090249618

2009-10-08

Method for manufacturing a circuit board having an embedded component therein

#144

20090242411

2009-10-01

POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD

#145

20090242250

2009-10-01

POLYIMIDE FILM, METHOD FOR PRODUCTION THEREOF, POLYIMIDE-METAL LAMINATED PRODUCT, AND CIRCUIT BOARD

#146

20090236137

2009-09-24

Method for forming resist pattern, method for producing circuit board, and circuit board

#147

20090205862

2009-08-20

Method of manufacturing a printed circuit board

#148

20090205202

2009-08-20

Method of manufacturing printed wiring board with built-in electronic component

#149

20090178840

2009-07-16

PCB and manufacturing method thereof

#150

20090166079

2009-07-02

Microstructure and method of manufacturing the same

#151

20090166076

2009-07-02

Insulating material and printed circuit board having the same

#152

20090117336

2009-05-07

CIRCUIT BOARD, METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD, AND ELECTRONIC COMPONENT USING SUCH CIRCUIT BOARD

#153

20090090540

2009-04-09

Method for providing an efficient thermal transfer through a printed circuit board

#154

20090051602

2009-02-26

Case structure having conductive pattern and method of manufacturing the same

#155

20090051036

2009-02-26

Semiconductor package having buss-less substrate

#156

20090044970

2009-02-19

Current-carrying structures fabricated using voltage switchable dielectric materials

#157

20090039514

2009-02-12

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#158

20090008145

2009-01-08

Embedded circuit structure and fabricating process of the same

#159

20090002958

2009-01-01

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

#160

20080286538

2008-11-20

Polyimide-Metal Laminated Body and Polyimide Circuit Board

#161

20080283282

2008-11-20

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#162

20080277148

2008-11-13

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

#163

20080264677

2008-10-30

Circuit board structure having embedded capacitor and fabrication method thereof

#164

20080251287

2008-10-16

Substrate and method for manufacturing the same

#165

20080223605

2008-09-18

Embedded circuit board and process thereof

#166

20080222886

2008-09-18

Method for manufacturing carrier substrate

#167

20080116079

2008-05-22

Method of manufacturing a wiring board by utilizing electro plating

#168

20080094813

2008-04-24

Circuit board structure

#169

20080092379

2008-04-24

Method for fabricating circuit board structure

#170

20080060193

2008-03-13

Methods of fabricating substrates including at least one conductive via

#171

20080052905

2008-03-06

Fabricating method for printed circuit board

#172

20080038523

2008-02-14

Printed circuit board and fabricating method of the same

#173

20080026602

2008-01-31

Printed Circuit Board With Improved Via Design

#174

20080022523

2008-01-31

Method of forming a printed circuit board with improved via design

#175

20080020132

2008-01-24

Substrate having stiffener fabrication method

#176

20080006605

2008-01-10

Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces

#177

20070261234

2007-11-15

Method of manufacturing build-up printed circuit board

#178

20070243422

2007-10-18

METHOD FOR PRODUCING PRINTED CIRCUIT BOARD STRUCTURES COMPRISING VIA HOLES, ELECTRONIC DEVICE UNIT, AND USE OF A FLEXIBLE STRIP CONDUCTOR FILM IN THIS DEVICE

#179

20070240901

2007-10-18

Wiring board and method for fabricating the same

#180

20070226998

2007-10-04

Multi-layer circuit assembly and process for preparing the same

#181

20070220745

2007-09-27

Method for Producing Traverse Connections in Printed Circuit Board Sets

#182

20070211403

2007-09-13

Molded high impedance surface

#183

20070173135

2007-07-26

Printed wiring board for mounting semiconductor

#184

20070170593

2007-07-26

Method of making zinc-aluminum alloy connection

#185

20070170065

2007-07-26

Method for filling through hole

#186

20070169343

2007-07-26

Methods of fabricating substrates including one or more conductive vias

#187

20070153488

2007-07-05

Multi-layer printed circuit board and method for fabricating the same

#188

20070148827

2007-06-28

Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus

#189

20070141310

2007-06-21

Printed circuit board and method of manufacturing the same

#190

20070124929

2007-06-07

Method for manufacturing printed wiring board

#191

20070114653

2007-05-24

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

#192

20070084823

2007-04-19

Method of manufacturing double-sided printed circuit board

#193

20060289203

2006-12-28

Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board

#194

20060254808

2006-11-16

Substrate precursor structures

#195

20060254052

2006-11-16

Conductive sheet having conductive layer with improved adhesion and product including the same

#196

20060213685

2006-09-28

Single or multi-layer printed circuit board with improved edge via design

#197

20060199004

2006-09-07

Electroconductive adhesive tape

#198

20060191710

2006-08-31

Multilayer printed wiring board and a process of producing same

#199

20060191709

2006-08-31

Printed circuit board, flip chip ball grid array board and method of fabricating the same

#200

20060191708

2006-08-31

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#201

20060185141

2006-08-24

Method of manufacturing a multilayer wiring board

#202

20060175084

2006-08-10

Wiring board and method for fabricating the same

#203

20060141159

2006-06-29

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.

#204

20060086535

2006-04-27

Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device

#205

20060054588

2006-03-16

Method of Manufacturing Double-Sided Printed Circuit Board

#206

20060016779

2006-01-26

Method of manufacturing a wiring board by utilizing electro plating

#207

20060005383

2006-01-12

Method of forming printed circuit card

#208

20060000640

2006-01-05

Multilayer printed wiring board and a process of producing same

#209

20050200027

2005-09-15

Conductive through wafer vias

#210

20050189136

2005-09-01

Method of manufacturing multi-layer printed circuit board

#211

20050150683

2005-07-14

Methods of fabricating substrates including at least one conductive via

#212

20050103524

2005-05-19

Double sided wired circuit board

#213

20050095862

2005-05-05

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

#214

20050042366

2005-02-24

Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections

#215

20050039949

2005-02-24

Methods for fabricating current-carrying structures using voltage switchable dielectric materials

#216

20050039948

2005-02-24

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#217

20050029014

2005-02-10

Conductive sheet having conductive layer with improved adhesion and product including the same

#218

20050012217

2005-01-20

Multilayer wiring board and manufacture method thereof

#219

20050001309

2005-01-06

Printed wiring board for mounting semiconductor