245265 ⎘
Metal working; Method of mechanical manufacture; Electrical device making; Conductor or circuit manufacturing; On flat or curved insulated base, e.g., printed circuit, etc.; Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#2Method for producing a printed circuit board
#3Method for manufacturing a photonic waveguide and photonic waveguide manufactured by said method
#4Methods of making a test sensor
#5Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#6Quartz crystal unit, quartz crystal oscillator and electronic apparatus
#7Method for producing a microphone unit and a microphone unit
#8Electronic component mounting system and electronic component mounting method
#9Interdigitated chip capacitor assembly
#10Methods for manufacturing a Z-directed printed circuit board component having a removable end portion
#11Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#12Quartz crystal unit, quartz crystal oscillator and electronic apparatus
#13Testing probe head for wafer level testing, and test probe card
#14Methods of making a test sensor
#15Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board
#16Methods and systems for generating tracing information for gas cylinders
#17Method for protecting a touch-screen display
#18Method for assembling an electrical connector assembly
#19Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR
#20Layout method and layout structure of touch panel electrode
#21Method of manufacturing passive component module
#22Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
#23Method of manufacturing wiring substrate having built-in component
#24Method of fabricating a semiconductor test probe head
#25Method and system for generating tracing information for gas cylinders
#26Method for manufacturing connector
#27Methods for controlling wafer curvature
#28Method for producing a nickel strip
#29Method of manufacturing in-plane switching mode liquid crystal display
#30Opto-electric hybrid board and manufacturing method therefor
#31Printed circuit board
#32Layout method of touch panel electrode
#33Method of manufacturing an electrical connector
#34Methods of making calibration-adjusted sensors
#35Method for high-frequency tuning an electrical device
#36INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS
#37Method for affixing adhesive films and main board with adhesive films applied using the method
#38Method of manufacturing a printed circuit board
#39Device for separating electronic components
#40Electronic sensor or sensor device, in particular an acceleration sensor, having a chip module mounted in a sensor housing
#41Electronic Assemblies without Solder and Methods for their Manufacture
#42Method and apparatus for disassembling display device
#43Printed circuit board
#44Double transformer balun for maximum power amplifier power
#45Method of manufacturing printed circuit board
#46Touch panel, display device with the same, and method for manufacturing the display device
#47Manufacturing method of a quartz crystal unit , a quartz crystal oscillator and an electronic apparatus
#48Methods and structures for controlling wafer curvature
#49Method for making calibration-adjusted sensors
#50Insulating aperture in printed circuit boards
#51Method for manufacturing a coreless packaging substrate
#52INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS
#53Integrated Alignment and Bonding System
#54Stripline flex circuit
#55Precise multi-pole magnetic component
#56Method for evaluating silicon wafer
#57Wiring board having via and method forming a via in a wiring board
#58Method of making a plurality of calibration-adjusted sensors
#59Method of making analyte sensor
#60Manufacturing method of quartz crystal unit
#61Method for manufacturing a quartz crystal unit
#62Printed circuit board
#63Method of fabricating filtered printhead ejection nozzle
#64Method of making a microwave field director structure having V-shaped vane doublets
#65Printed board with component mounting pin
#66Printed board with component mounting pin
#67ALIGNMENT PRECISION ENHANCEMENT OF ELECTRONIC COMPONENT PROCESS ON FLEXIBLE SUBSTRATE DEVICE AND METHOD THEREOF THE SAME
#68Method for manufacturing multilayer printed circuit boards using inner substrate
#69Method of making a circuit assembly
#70Method of forming a flip-chip package
#71Method of manufacturing electronic component package
#72Method of manufacturing heat sink using clad metal
#73Substrate with multi-layer interconnection structure and method of manufacturing the same
#74Inkjet printhead nozzle with a patterned surface
#75Method for cutting PCB
#76Method for manufacturing keypad
#77Keypad assembly
#78Nonreciprocal circuit device and manufacturing method of the same
#79Method for manufacturing the BGA package board
#80Method of running cable from a duct to a device
#81Quartz crystal unit and method for manufacturing a quartz crystal unit and electronic apparatus
#82Method for high-frequency tuning an electrical device
#83Integrated circuit device mounting with folded substrate and interposer
#84Method of manufacturing a quartz resonator
#85Method for manufacturing electronic component, and electronic component
#86Stripline flex circuit
#87Method for making a circuit plate
#88Electropolishing of inkjet printer components
#89Methods of making analyte sensors
#90Method of making calibration-adjusted analyte sensors
#91Manufacturing method of printed circuit board using an ink jet
#92Method of making a plurality of flow sensors
#93Heat sink design using clad metal
#94Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
#95Micro-fluid ejection head structure
#96Method for manufacturing a surface acoustic wave
#97Touch panel, display device with the same, and method for manufacturing the display device
#98Printed board with a pin for mounting a component
#99Method and process for embedding electrically conductive elements in a dielectric layer
#100Power inductor with reduced DC current saturation
#101Method of fabricating conductor crossover structure for power inductor
#102Method for manufacturing a film bulk acoustic resonator
#103Method of attenuating electromagnetic energy
#104Surface acoustic wave apparatus and manufacturing method therefor
#105Method of fabricating electrical connection terminal of embedded chip
#106Method of fabricating an RF substrate with selected electrical properties
#107Method for manufacturing an electronic component
#108Method of fabricating inkjet nozzle chambers having filter structures
#109Method of fabricating inkjet nozzles having associated ink priming features
#110Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
#111Method of manufacturing wiring board
#112Fabricating method of keypad assembly
#113Method of producing a wiring board
#114Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition
#115Electronic apparatus having display portion and oscillator and manufacturing method of the same
#116Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
#117Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
#118Method of manufacturing wiring substrate having terminated buses
#119Ceramic substrate and method of breaking same
#120Wiring board and method of manufacturing the same
#121Chip resistor
#122Method for providing a power inductor
#123Power inductor with reduced DC current saturation
#124Method of fabricating a conducting crossover structure for a power inductor
#125Method of making a microfluid ejection head structure
#126Methods for fabricating thin complaint spring contacts
#127Combined chip/heat-dissipating metal plate and method for manufacturing the same
#128Method of producing inkjet printhead
#129Method for replacing defective PCB from PCB panel
#130Method of manufacturing a metal housing of an electrical connector
#131Folded substrate with interposer package for integrated circuit devices
#132Multilayer wiring board
#133Method for manufacturing piezoelectric resonator
#134Precise multi-pole magnetic component
#135Vertically mountable and alignable semiconductor device packages and assemblies including the same
#136Methods for securing packaged semiconductor devices to carrier substrates
#137BGA package board and method for manufacturing the same
#138Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages
#139Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices
#140Method for making a circuit plate
#141Method for producing an ink jet head
#142Method of fabricating a thermal inkjet head having a symmetrical heater
#143Package modification for channel-routed circuit boards
#144Printed circuit board defective area transplant repair method
#145Method of fabricating electrical connection terminal of embedded chip
#146Wiring board and production method of wiring board
#147Double transformer balun for maximum power amplifier power
#148Compact navigation device assembly
#149Electronic package repair process
#150Graphite-based heat sinks and method and apparatus for the manufacture thereof
#151Method for manufacturing graphite-base heat sinks
#152Apparatus for replacing defective PCB from PCB panel
#153Method of forming an opening or cavity in a substrate for receiving an electronic component
#154Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel
#155Method of forming an opening or cavity in a substrate for receiving an electronic component
#156Method of forming an opening or cavity in a substrate for receiving an electronic component
#157Method of forming an opening or cavity in a substrate for receiving an electronic component
#158Packaging structure and packaging method of electronic components
#159Device for coupling PCB sheet having position deciding jig part
#160Device for coupling PCB sheet
#161Method and device for through-hole plating of substrates and printed circuit boards
#162Securing solid-matrix panels for cutting using a tooling fixture
#163Device for coupling PCB sheet
#164Rubber plate used in an ion implanter and method of preparing the same
#165Method of fabricating an RF substrate with selected electrical properties
#166Film bulk acoustic resonator and method for manufacturing the same
#167Solder paste stencil manufacturing system
#168Method for manufacturing a surface acoustic wave device with a piezoelectric substrate
#169Manufacturing method for precise multi-pole magnetic components
#170Method of manufacturing an ink-jet head
#171Flow sensor with self-aligned flow channel
#172Method for forming a chip package
#173Electronic device carrier and manufacture tape
#174Method for making liquid discharge head
#175Power inductor with reduced DC current saturation