Inventor profile of:

Bernard Aspar

City:

Rives

Country:

France

Published Applications:

45

Last publication date:

2013-10-17

Top Assignees for applications by Bernard Aspar

The entities that hold a legal rights for patent applications filed by inventor Aspar Bernard:

Recent patent applications by Aspar Bernard

Bernard Aspar from Rives, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-17
US20130273713A1
Electricity

Process for the transfer of a thin film comprising an inclusion creation step

#2 | 2013-09-05
US20130230967A1
Electricity

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

#3 | 2013-03-28
US20130078785A1
Electricity

Method for trimming a structure obtained by the assembly of two plates

#4 | 2012-05-31
US20120133028A1
Physics

METHOD OF PRODUCING A THIN LAYER OF SEMICONDUCTOR MATERIAL

#5 | 2011-04-21
US20110092051A1
Electricity

Process for the transfer of a thin film comprising an inclusion creation step

#6 | 2011-03-08
US10474984
-

Detachable substrate with controlled mechanical strength and method of producing same

#7 | 2010-07-15
US20100176397A1
Performing operations; transporting

Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate

#8 | 2009-12-17
US20090311477A1
Electricity

Compliant Substrate In Particular For Hetero-Epitaxial Depositing

#9 | 2009-11-05
US20090275152A1
Performing operations; transporting

Process for the collective fabrication of microstructures consisting of superposed elements

#10 | 2009-05-21
US20090130392A1
Physics

Method of producing a thin layer of semiconductor material

#11 | 2009-04-16
US20090095399A1
Electricity

Method for trimming a structure obtained by the assembly of two plates

#12 | 2009-03-03
US10276306
-

Embrittled substrate and method for making same

#13 | 2008-10-16
US20080254596A1
Electricity

Method for transferring wafers

#14 | 2008-07-24
US20080176382A1
Performing operations; transporting

Process of forming and controlling rough interfaces

#15 | 2008-07-24
US20080176381A1
Performing operations; transporting

Surface roughening process

#16 | 2008-06-05
US20080128868A1
Electricity

Method of transferring a circuit onto a ground plane

#17 | 2008-02-14
US20080036039A1
Electricity

New Structure for Microelectronics and Microsystem and Manufacturing Process

#18 | 2007-10-04
US20070232025A1
Electricity

Process for the transfer of a thin film

#19 | 2007-08-30
US20070200144A1
Performing operations; transporting

Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate

#20 | 2007-08-21
US10362278
-

Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure

#21 | 2007-06-12
US10667707
-

Process for the transfer of a thin film

#22 | 2007-03-29
US20070072393A1
Electricity

Method for preparing and assembling substrates

#23 | 2006-12-14
US20060281212A1
Performing operations; transporting

Stacked structure and production method thereof

#24 | 2006-08-31
US20060191627A1
Electricity

Process for cutting out a block of material and formation of a thin film

#25 | 2006-07-27
US20060166461A1
Electricity

Method of producing mixed substrates and structure thus obtained

#26 | 2006-06-27
US10784601
-

Method of producing a thin layer of semiconductor material

#27 | 2006-06-13
US10753172
-

Layer transfer method

#28 | 2006-06-01
US20060115961A1
Physics

Method of producing a thin layer of semiconductor material

#29 | 2006-04-18
US10312864
-

Method for cutting a block of material and forming a thin film

#30 | 2006-04-13
US20060079071A1
Electricity

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

#31 | 2006-01-26
US20060019476A1
Electricity

Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element

#32 | 2005-12-13
US10415672
-

Method for making a stacked comprising a thin film adhering to a target substrate

#33 | 2005-12-08
US20050270867A1
Electricity

Intermediate suction support and its utilisation for producing a thin film structure

#34 | 2005-11-01
US10473813
-

Method for selectively transferring at least an element from an initial support onto a final support

#35 | 2005-10-06
US20050221583A1
Electricity

Method for making thin layers containing microcomponents

#36 | 2005-09-20
US10432362
-

Method for producing a thin film comprising introduction of gaseous species

#37 | 2005-09-06
US10469633
-

Method for producing thin layers on a specific support and an application thereof

#38 | 2005-08-18
US20050178495A1
Electricity

Method for transferring elements between substrates

#39 | 2005-07-21
US20050158634A1
Physics

Photolithography mask comprising absorber/phase-shifter elements

#40 | 2005-07-05
US10616586
-

Layer transfer methods

#41 | 2005-06-21
US10240751
-

High density element structure formed by assembly of layers and method for making same

#42 | 2005-06-09
US20050124138A1
Electricity

Method for handling semiconductor layers in such a way as to thin same

#43 | 2005-05-26
US20050112847A1
Performing operations; transporting

Method for separating wafers bonded together to form a stacked structure

#44 | 2005-02-10
US20050029224A1
Electricity

Detachable substrate or detachable structure and method for the production thereof

#45 | 2005-02-08
US10433543
-

Flat liquid crystal, screen operating in reflective mode and method for manufacturing this screen

InventorID:

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