Rives
France
45
2013-10-17
The entities that hold a legal rights for patent applications filed by inventor Aspar Bernard:
Bernard Aspar from Rives, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
Process for the transfer of a thin film comprising an inclusion creation step
#2 | 2013-09-05Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate
#3 | 2013-03-28Method for trimming a structure obtained by the assembly of two plates
#4 | 2012-05-31METHOD OF PRODUCING A THIN LAYER OF SEMICONDUCTOR MATERIAL
#5 | 2011-04-21Process for the transfer of a thin film comprising an inclusion creation step
#6 | 2011-03-08Detachable substrate with controlled mechanical strength and method of producing same
#7 | 2010-07-15Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate
#8 | 2009-12-17Compliant Substrate In Particular For Hetero-Epitaxial Depositing
#9 | 2009-11-05Process for the collective fabrication of microstructures consisting of superposed elements
#10 | 2009-05-21Method of producing a thin layer of semiconductor material
#11 | 2009-04-16Method for trimming a structure obtained by the assembly of two plates
#12 | 2009-03-03Embrittled substrate and method for making same
#13 | 2008-10-16Method for transferring wafers
#14 | 2008-07-24Process of forming and controlling rough interfaces
#15 | 2008-07-24Surface roughening process
#16 | 2008-06-05Method of transferring a circuit onto a ground plane
#17 | 2008-02-14New Structure for Microelectronics and Microsystem and Manufacturing Process
#18 | 2007-10-04Process for the transfer of a thin film
#19 | 2007-08-30Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate
#20 | 2007-08-21Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure
#21 | 2007-06-12Process for the transfer of a thin film
#22 | 2007-03-29Method for preparing and assembling substrates
#23 | 2006-12-14Stacked structure and production method thereof
#24 | 2006-08-31Process for cutting out a block of material and formation of a thin film
#25 | 2006-07-27Method of producing mixed substrates and structure thus obtained
#26 | 2006-06-27Method of producing a thin layer of semiconductor material
#27 | 2006-06-13Layer transfer method
#28 | 2006-06-01Method of producing a thin layer of semiconductor material
#29 | 2006-04-18Method for cutting a block of material and forming a thin film
#30 | 2006-04-13Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate
#31 | 2006-01-26Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element
#32 | 2005-12-13Method for making a stacked comprising a thin film adhering to a target substrate
#33 | 2005-12-08Intermediate suction support and its utilisation for producing a thin film structure
#34 | 2005-11-01Method for selectively transferring at least an element from an initial support onto a final support
#35 | 2005-10-06Method for making thin layers containing microcomponents
#36 | 2005-09-20Method for producing a thin film comprising introduction of gaseous species
#37 | 2005-09-06Method for producing thin layers on a specific support and an application thereof
#38 | 2005-08-18Method for transferring elements between substrates
#39 | 2005-07-21Photolithography mask comprising absorber/phase-shifter elements
#40 | 2005-07-05Layer transfer methods
#41 | 2005-06-21High density element structure formed by assembly of layers and method for making same
#42 | 2005-06-09Method for handling semiconductor layers in such a way as to thin same
#43 | 2005-05-26Method for separating wafers bonded together to form a stacked structure
#44 | 2005-02-10Detachable substrate or detachable structure and method for the production thereof
#45 | 2005-02-08Flat liquid crystal, screen operating in reflective mode and method for manufacturing this screen
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