Espoo
Finland
26
2019-08-29
The entities that hold a legal rights for patent applications filed by inventor Li Wei-Min:
Wei-Min Li from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:
Enhanced thin film deposition
#2 | 2019-02-14Substrate loading in an ALD reactor
#3 | 2018-05-10Enhanced thin film deposition
#4 | 2018-04-12Atomic Layer Deposition with Plasma Source
#5 | 2017-11-30ALD method and apparatus
#6 | 2017-07-13Etch resistant alumina based coatings
#7 | 2017-03-09ATOMIC LAYER DEPOSITION OF GERMANIUM OR GERMANIUM OXIDE
#8 | 2016-04-28Enhanced thin film deposition
#9 | 2015-11-12Atomic layer deposition with plasma source
#10 | 2015-10-22Substrate loading in an ALD reactor
#11 | 2014-05-08Atomic layer deposition of metal carbide films using aluminum hydrocarbon compounds
#12 | 2014-03-27Deposition reactor with plasma source
#13 | 2014-01-23Atomic layer deposition with plasma source
#14 | 2013-07-18Enhanced thin film deposition
#15 | 2013-06-06Etch resistant alumina based coatings
#16 | 2011-10-20THIN FILMS
#17 | 2009-12-24ATOMIC LAYER DEPOSITION OF METAL CARBIDE FILMS USING ALUMINUM HYDROCARBON COMPOUNDS
#18 | 2009-03-12Thin films
#19 | 2008-12-25Low resistivity metal carbonitride thin film deposition by atomic layer deposition
#20 | 2007-06-28Enhanced thin film deposition
#21 | 2006-04-13Metal nitride carbide deposition by ALD
#22 | 2006-01-26Methods of metallization for microelectronic devices utilizing metal oxide
#23 | 2006-01-17Metal nitride deposition by ALD with reduction pulse
#24 | 2005-10-18Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits
#25 | 2005-08-18Thin films
#26 | 2005-05-05Atomic layer deposition reactor
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