Grenoble
France
51
2012-03-08
The entities that hold a legal rights for patent applications filed by inventor Rayssac Olivier:
Olivier Rayssac from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#2 | 2012-03-01Substrate cutting device and method
#3 | 2012-01-19Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#4 | 2011-09-29METHOD OF FABRICATING A RELEASE SUBSTRATE
#5 | 2011-07-14Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#6 | 2011-03-08Detachable substrate with controlled mechanical strength and method of producing same
#7 | 2011-02-17Methods for making substrates and substrates formed therefrom
#8 | 2010-01-21Transfer method with a treatment of a surface to be bonded
#9 | 2009-11-26Methods for making substrates and substrates formed therefrom
#10 | 2009-07-16Method of fabricating a release substrate
#11 | 2009-03-03Embrittled substrate and method for making same
#12 | 2008-10-23Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer
#13 | 2008-01-17Method of fabricating a hybrid substrate
#14 | 2008-01-17Method for direct bonding two semiconductor substrates
#15 | 2007-12-13Methods for making substrates and substrates formed therefrom
#16 | 2007-11-22Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#17 | 2007-09-04Fabrication of substrates with a useful layer of monocrystalline semiconductor material
#18 | 2007-06-28Device and method for cutting an assembly
#19 | 2007-06-26Method for bonding semiconductor structures together
#20 | 2007-05-31Substrate layer cutting device and method
#21 | 2007-05-31Substrate cutting device and method
#22 | 2007-05-10Methods for producing a semiconductor entity
#23 | 2007-04-05Method of fabricating a release substrate
#24 | 2007-03-13Substrate layer cutting device and method
#25 | 2006-11-30Transfer method with a treatment of a surface to be bonded
#26 | 2006-10-19Methods for forming an assembly for transfer of a useful layer
#27 | 2006-10-17Methods for forming an assembly for transfer of a useful layer
#28 | 2006-09-28Substrate for stressed systems and method of making same
#29 | 2006-08-31Substrate assembly for stressed systems
#30 | 2006-06-13Layer transfer method
#31 | 2006-06-06Method for ion treating a semiconductor material for subsequent bonding
#32 | 2006-04-27Semiconductor structure and method of making same
#33 | 2006-04-13Substrate for stressed systems and method of making same
#34 | 2006-04-13Substrate for stressed systems and method of making same
#35 | 2006-01-24Semiconductor structure and method of making same
#36 | 2006-01-19Thermal treatment of a semiconductor layer
#37 | 2005-11-03Atomic implantation and thermal treatment of a semiconductor layer
#38 | 2005-10-27Method of fabricating chips and an associated support
#39 | 2005-09-08Methods for forming a semiconductor structure
#40 | 2005-09-01Methods for producing a semiconductor entity
#41 | 2005-08-18Method for transferring elements between substrates
#42 | 2005-07-05Layer transfer methods
#43 | 2005-06-16Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
#44 | 2005-05-26Process for manufacturing a substrate and associated substrate
#45 | 2005-02-10Detachable substrate or detachable structure and method for the production thereof
#46 | 2005-02-03Preventive treatment method for a multilayer semiconductor structure
#47 | 2005-02-03Semiconductor-on-insulator structure having high-temperature elastic constraints
#48 | 2005-01-27Methods for preparing a semiconductor assembly
#49 | 2005-01-13Device and method for cutting an assembly
#50 | 2005-01-13Substrate assembly for stressed systems
#51 | 2005-01-06Substrate cutting device and method
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