Peekskill, New York
United States
68
2010-12-23
The entities that hold a legal rights for patent applications filed by inventor Philipp Jan Boris:
Jan Boris Philipp from Peekskill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for fabricating an integrated circuit including resistivity changing material having a planarized surface
#2 | 2010-12-23Memory including vertical bipolar select device and resistive memory element
#3 | 2010-08-05Current constricting phase change memory element structure
#4 | 2009-11-26Phase change memory with tapered heater
#5 | 2009-10-08Memory cell having improved mechanical stability
#6 | 2009-01-22Integrated circuit including force-filled resistivity changing material
#7 | 2009-01-15Current constricting phase change memory element structure
#8 | 2009-01-01Program method with locally optimized write parameters
#9 | 2009-01-01Conditioning operations for memory cells
#10 | 2009-01-01Multiple write configurations for a memory cell
#11 | 2009-01-01Integrated circuit including resistivity changing material having a planarized surface
#12 | 2009-01-01Phase change memory with tapered heater
#13 | 2008-12-25Memory device having drift compensated read operation and associated method
#14 | 2008-12-25Mushroom phase change memory having a multilayer electrode
#15 | 2008-12-25INTEGRATED CIRCUIT INCLUDING CONTACT CONTACTING BOTTOM AND SIDEWALL OF ELECTRODE
#16 | 2008-12-25Circuit for programming a memory element
#17 | 2008-12-25Integrated circuit including vertical diode
#18 | 2008-12-25Integrated circuit having multilayer electrode
#19 | 2008-12-25Integrated circuit including vertical diode
#20 | 2008-12-25INTEGRATED CIRCUIT INCLUDING VERTICAL DIODE
#21 | 2008-12-11Integrated circuit including logic portion and memory portion
#22 | 2008-12-11Memory having shared storage material
#23 | 2008-12-11MEMORY HAVING SHARED STORAGE MATERIAL
#24 | 2008-12-11Integrated circuit including spacer defined electrode
#25 | 2008-12-04Integrated circuit having contact including material between sidewalls
#26 | 2008-11-06Multi-level resistive memory cell using different crystallization speeds
#27 | 2008-11-06Memory including write circuit for providing multiple reset pulses
#28 | 2008-10-30Circuit for programming a memory element
#29 | 2008-10-30INTEGRATED CIRCUIT INCLUDING SPACER MATERIAL LAYER
#30 | 2008-10-23Stacked SONOS memory
#31 | 2008-09-11Method to prevent overreset
#32 | 2008-08-14Method for manufacturing a phase change memory device with pillar bottom electrode
#33 | 2008-08-07Resistive memory including buried word lines
#34 | 2008-07-10Resistance Limited Phase Change Memory Material
#35 | 2008-06-26Pillar phase change memory cell
#36 | 2008-06-12Memory that limits power consumption
#37 | 2008-06-12Spin glass memory cell
#38 | 2008-05-29Memory cell with trigger element
#39 | 2008-05-22Resistive memory including selective refresh operation
#40 | 2008-05-22System that prevents reduction in data retention
#41 | 2008-05-22Resistive memory including refresh operation
#42 | 2008-04-10Semiconductor device including multi-bit memory cells and a temperature budget sensor
#43 | 2008-04-03Resistive memory having shunted memory cells
#44 | 2008-03-20Resistive memory having shunted memory cells
#45 | 2008-01-31Integrated circuit to identify read disturb condition in memory cell
#46 | 2008-01-24INTEGRATED CIRCUIT WITH RESISTIVITY CHANGING MATERIAL HAVING A STEP-LIKE PROGRAMMING CHARACTERISTITIC
#47 | 2008-01-24Integrated circuit having memory having a step-like programming characteristic
#48 | 2008-01-24Integrated circuit with memory having a step-like programming characteristic
#49 | 2008-01-24Phase change memory cell including nanocomposite insulator
#50 | 2008-01-10Integrated circuit having a phase change memory cell including a narrow active region width
#51 | 2007-12-27Memory cell programmed using a temperature controlled set pulse
#52 | 2007-12-13Integrated circuit having a precharging circuit
#53 | 2007-12-06Phase change memory having temperature budget sensor
#54 | 2007-10-25Transitioning the state of phase change material by annealing
#55 | 2007-10-25Phase-change memory cell adapted to prevent over-etching or under-etching
#56 | 2007-10-25Phase change memory
#57 | 2007-10-25Memory having storage locations within a common volume of phase change material
#58 | 2007-10-25Integrated circuit including sidewall spacer
#59 | 2007-10-25Phase change memory cell with limited switchable volume
#60 | 2007-08-09Thermal isolation of phase change memory cells
#61 | 2007-05-03Integrated circuit having resistive memory cells
#62 | 2007-05-03Phase change memory cell including multiple phase change material portions
#63 | 2007-05-03Integrated circuit having an insulated memory
#64 | 2007-05-03Phase change memory having multilayer thermal insulation
#65 | 2007-03-01Integrated circuit having resistive memory
#66 | 2007-03-01Integrated circuit having a switch
#67 | 2007-03-01Integrated circuit having a switch
#68 | 2006-11-23Low power phase change memory cell with large read signal
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