Gyeonggi-do
South Korea
6
2009-01-22
The entities that hold a legal rights for patent applications filed by inventor SIM Sung-Min:
Sung-Min SIM from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#2 | 2008-02-14Interconnection structure of integrated circuit chip
#3 | 2007-07-19WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME
#4 | 2006-06-08Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
#5 | 2006-03-23Interconnection structure of integrated circuit chip
#6 | 2006-01-26Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
3860489 ⎘