Grenoble
France
24
2009-01-22
The entities that hold a legal rights for patent applications filed by inventor Aulnette Cecile:
Cecile Aulnette from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of reducing roughness of a thick insulating layer
#2 | 2008-06-19Semiconductor heterostructure
#3 | 2008-06-05Method of manufacturing a semiconductor heterostructure
#4 | 2007-02-01Film taking-off method
#5 | 2007-01-25Method of reducing roughness of a thick insulating layer
#6 | 2006-12-21Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
#7 | 2006-10-03Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
#8 | 2006-04-27Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
#9 | 2006-04-25Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means
#10 | 2006-04-13Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
#11 | 2006-03-28Transfer of a thin layer from a wafer comprising a buffer layer
#12 | 2006-03-07Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
#13 | 2006-02-07Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
#14 | 2006-01-31Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer
#15 | 2005-10-18Semiconductor structure and methods for fabricating same
#16 | 2005-09-01Methods for transferring a thin layer from a wafer having a buffer layer
#17 | 2005-09-01Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
#18 | 2005-08-04Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
#19 | 2005-08-04Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
#20 | 2005-07-14Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
#21 | 2005-06-21Method and apparatus for adjusting the thickness of a thin layer of semiconductor material
#22 | 2005-03-31Indirect bonding with disappearance of bonding layer
#23 | 2005-03-31Method of fabrication of a substrate for an epitaxial growth
#24 | 2005-02-03Semiconductor-on-insulator structure having high-temperature elastic constraints
3862533 ⎘