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Inventor profile of:

Ismail Emesh

City:

Gilbert, Arizona

Country:

United States

Published Applications:

Last publication date:

2009-03-12

Top Assignees for applications by Ismail Emesh

The entities that hold a legal rights for patent applications filed by inventor Emesh Ismail:

SPEEDFAM-IPEC CORPORATION 4 Chandler, AZ United States
Novellus Systems Inc. 3 San Jose, CA United States
ASM NUTOOL, INC. 2 Phoenix, AZ United States
ASM NuTool, Inc. 1 Phoeniz, AZ United States

Recent patent applications by Emesh Ismail

Ismail Emesh from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-03-12

US20090065365A1

Chemistry; metallurgy

METHOD AND APPARATUS FOR COPPER ELECTROPLATING

#2 | 2008-10-02

US20080237048A1

Chemistry; metallurgy

METHOD AND APPARATUS FOR SELECTIVE ELECTROFILLING OF THROUGH-WAFER VIAS

#3 | 2007-12-20

US20070293040A1

Electricity

Filling deep features with conductors in semiconductor manufacturing

#4 | 2007-05-17

US20070111523A1

Electricity

Process for conditioning conductive surfaces after electropolishing

#5 | 2007-04-10

US10758752

Planar plating apparatus

#6 | 2007-01-25

US20070017818A1

Performing operations; transporting

Solution for electrochemical mechanical polishing

#7 | 2006-11-16

US20060255016A1

Performing operations; transporting

Method for polishing copper on a workpiece surface

#8 | 2006-04-25

US10305860

Apparatus for electrochemically depositing a material onto a workpiece surface

#9 | 2006-04-20

US20060081460A1

Performing operations; transporting

Method and apparatus for electrochemical planarization of a workpiece

#10 | 2006-01-05

US20060003566A1

Electricity

Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects

#11 | 2005-12-13

US10709598

Method and apparatus for electrochemical planarization of a workpiece

#12 | 2005-06-09

US20050121969A1

Performing operations; transporting

Lubricant for wafer polishing using a fixed abrasive pad

#13 | 2005-02-01

US9826674

Apparatus and process for polishing a workpiece

#14 | 2005-01-27

US20050016681A1

Chemistry; metallurgy

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

InventorID:

3898500 ⎘