Mario Hennig

Method of Patterning a Substrate, Photosensitive Layer Stack and System for Lithography

Mask Structure for Manufacturing an Integrated Circuit by Photolithographic Patterning

Set of masks including a first mask and a second trimming mask with a semitransparent region having a transparency between 20% and 80% to control diffraction effects and obtain maximum depth of focus for the projection of structure patterns onto a semiconductor wafer

Set of at least two masks for the projection of structure patterns

Transistor arrangement, sense-amplifier arrangement and methods of manufacturing the same via a phase shift mask

Mask arrangement, optical projection system and method for obtaining grating parameters and absorption properties of a diffractive optical element

Method for producing a mask for the lithographic projection of a pattern onto a substrate

Method and system for photolithography

Imaging system and method for producing semiconductor structures on a wafer by imaging a mask on the wafer with a dipole diaphragm

Apparatus for projecting a pattern into an image plane

Method for producing semiconductor patterns on a wafer

Mask with programmed defects and method for the fabrication thereof

Method for transferring a layout of an integrated circuit level to a semiconductor substrate

Method for reducing an overlay error and measurement mark for carrying out the same

Photolithographic mask and methods for producing a structure and of exposing a wafer in a projection apparatus