Inventor profile of:

Daniel Bensahel

City:

Grenoble

Country:

France

Published Applications:

17

Last publication date:

2013-10-10

Top Assignees for applications by Daniel Bensahel

The entities that hold a legal rights for patent applications filed by inventor Bensahel Daniel:

Recent patent applications by Bensahel Daniel

Daniel Bensahel from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-10
US20130264678A1
Electricity

Method for making a semi-conducting substrate located on an insulation layer

#2 | 2012-04-19
US20120094470A1
Electricity

Method for forming integrated circuits on a strained semiconductor substrate

#3 | 2011-05-12
US20110108801A1
Electricity

Single-crystal semiconductor layer with heteroatomic macro-network

#4 | 2010-12-16
US20100314628A1
Electricity

Process for transferring a layer of strained semiconductor material

#5 | 2010-11-18
US20100289123A1
Electricity

Method for making a semi-conducting substrate located on an insulation layer

#6 | 2008-10-30
US20080265261A1
Electricity

Process for transferring a layer of strained semiconductor material

#7 | 2008-10-02
US20080239625A1
Electricity

Electronic component manufacturing method

#8 | 2008-07-10
US20080164492A1
Electricity

Process for transferring a layer of strained semiconductor material

#9 | 2008-06-03
US10816214
-

Heteroatomic single-crystal layers

#10 | 2007-10-25
US20070248818A1
Electricity

Single-crystal semiconductor layer with heteroatomic macronetwork

#11 | 2006-10-31
US10815473
-

Method of fabricating a semiconductor device comprising a gate dielectric made of high dielectric permittivity material

#12 | 2006-04-25
US10614675
-

Growth of a single-crystal region of a III-V compound on a single-crystal silicon substrate

#13 | 2006-01-24
US10405075
-

Strained-channel isolated-gate field effect transistor, process for making same and resulting integrated circuit

#14 | 2005-11-17
US20050255682A1
Electricity

Process for transferring a layer of strained semiconductor material

#15 | 2005-10-11
US10615259
-

Process for transferring a layer of strained semiconductor material

#16 | 2005-02-17
US20050037599A1
Electricity

Process for fabricating strained layers of silicon or of a silicon/germanium alloy

#17 | 2005-02-03
US20050026457A1
Electricity

Method for forming a localized region of a material difficult to etch

InventorID:

474220 ⎘