Theys
France
47
2024-02-01
The entities that hold a legal rights for patent applications filed by inventor Broekaart Marcel:
Marcel Broekaart from Theys, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
HYBRID STRUCTURE FOR A SURFACE ACOUSTIC WAVE DEVICE
#2 | 2024-01-18Method of mechanical separation for a double layer transfer
#3 | 2024-01-11Method for manufacturing a substrate
#4 | 2023-11-23Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#5 | 2022-09-22SUPPORT FOR A SEMICONDUCTOR STRUCTURE
#6 | 2022-05-05Method for manufacturing a semiconductor-on-insulator substrate
#7 | 2021-12-30Process for producing a receiver substrate for a semiconductor-on-insulator structure for radiofrequency applications and process for producing such a structure
#8 | 2021-04-29Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#9 | 2021-04-22Method of mechanical separation for a double layer transfer
#10 | 2021-03-04Method for manufacturing a substrate
#11 | 2021-02-18Method for manufacturing a semiconductor on insulator type structure by layer transfer
#12 | 2020-07-16Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#13 | 2020-05-28Method for minimizing distortion of a signal in a radiofrequency circuit
#14 | 2020-05-21Method for locating devices
#15 | 2020-01-16Support for a semiconductor structure
#16 | 2019-05-30Hybrid structure for a surface acoustic wave device
#17 | 2019-03-21Method for manufacturing a substrate
#18 | 2019-01-03Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
#19 | 2018-06-28Process for the manufacture of a semiconductor element comprising a layer for trapping charges
#20 | 2018-05-10Method of fabrication of a semiconductor element comprising a highly resistive substrate
#21 | 2016-12-08Method of mechanical separation for a double layer transfer
#22 | 2016-07-07METHOD FOR LOCATING DEVICES
#23 | 2016-05-26Process for transferring circuit layer
#24 | 2016-05-19Process for transferring layers
#25 | 2015-10-01METHOD FOR BONDING SEMICONDUCTOR WAFERS USING A MOLECULAR BONDING APPARATUS
#26 | 2015-08-20Method for bonding by means of molecular adhesion
#27 | 2015-06-25Method for producing composite structure with metal/metal bonding
#28 | 2014-03-06Method for molecular adhesion bonding at low pressure
#29 | 2013-05-02METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
#30 | 2013-05-02Method and apparatus for bonding together two wafers by molecular adhesion
#31 | 2013-04-18THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAYERS OF MICROCOMPONENTS
#32 | 2013-02-28System and method for assessing inhomogeneous deformations in multilayer plates
#33 | 2013-02-07Apparatus for manufacturing semiconductor devices
#34 | 2012-06-28Method of bonding by molecular bonding
#35 | 2012-03-29Direct bonding method with reduction in overlay misalignment
#36 | 2012-03-22APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#37 | 2012-02-16Method for molecular adhesion bonding at low pressure
#38 | 2012-02-02Method of fabricating a multilayer structure with circuit layer transfer
#39 | 2011-12-22APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#40 | 2011-11-24METHODS OF FORMING SEMICONDUCTOR STRUCTURES COMPRISING DIRECT BONDING OF SUBSTRATES
#41 | 2011-11-17THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAYERS OF MICROCOMPONENTS
#42 | 2011-09-22Method of thinning a structure
#43 | 2011-08-04Surface treatment for molecular bonding
#44 | 2011-05-19MIXED TRIMMING METHOD
#45 | 2011-04-28Progressive trimming method
#46 | 2011-02-24Method of initiating molecular bonding
#47 | 2009-11-12Process for assembling wafers by means of molecular adhesion
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