Assignee profile:

Alpha & Omega Semiconductor, LTD

City:

Hamilton

Country:

Bermuda

Published Applications:

18

Last publication date:

2014-08-28

Patent Grants:

16

Last grant date:

2015-03-17

Top Inventors for applications by Alpha & Omega Semiconductor, LTD

These are the the leading inventors for applications assigned to Alpha & Omega Semiconductor, LTD:

Recent patent applications by Alpha & Omega Semiconductor, LTD

Alpha & Omega Semiconductor, LTD based in Hamilton, BM has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-08-28 βœ… Patent 8,981,464 granted on 2015-03-17
US20140239383A1
Electricity

Wafer level chip scale package and process of manufacture

#2 | 2014-08-14 βœ… Patent 9,214,544 granted on 2015-12-15
US20140225188A1
Electricity

Source and body contact structure for trench-DMOS devices using polysilicon

#3 | 2012-01-05 βœ… Patent 8,884,406 granted on 2014-11-11
US20120001176A1
Electricity

Etch depth determination structure

#4 | 2011-12-29 βœ… Patent 8,456,141 granted on 2013-06-04
US20110316090A1
Electricity

Boost converter with integrated high power discrete FET and low voltage controller

#5 | 2011-11-17 βœ… Patent 8,853,772 granted on 2014-10-07
US20110278665A1
Electricity

High-mobility trench MOSFETs

#6 | 2011-09-22 βœ… Patent 8,304,315 granted on 2012-11-06
US20110227155A1
Electricity

Integration of a sense FET into a discrete power MOSFET

#7 | 2010-07-01 βœ… Patent 7,851,856 granted on 2010-12-14
US20100163979A1
Electricity

True CSP power MOSFET based on bottom-source LDMOS

#8 | 2009-12-31 βœ… Patent 7,948,346 granted on 2011-05-24
US20090322461A1
Electricity

Planar grooved power inductor structure and method

#9 | 2009-12-03 βœ… Patent 8,680,658 granted on 2014-03-25
US20090294934A1
Electricity

Conductive clip for semiconductor device package

#10 | 2009-10-01
US20090242973A1
Electricity

SOURCE AND BODY CONTACT STRUCTURE FOR TRENCH-DMOS DEVICES USING POLYSILICON

#11 | 2009-08-06 βœ… Patent 7,955,893 granted on 2011-06-07
US20090194880A1
Electricity

Wafer level chip scale package and process of manufacture

#12 | 2009-07-02 βœ… Patent 7,795,108 granted on 2010-09-14
US20090166621A1
Electricity

Resistance-based etch depth determination for SGT technology

#13 | 2009-06-25 βœ… Patent 8,426,960 granted on 2013-04-23
US20090160045A1
Electricity

Wafer level chip scale packaging

#14 | 2009-05-21 βœ… Patent 7,898,092 granted on 2011-03-01
US20090128968A1
Electricity

Stacked-die package for battery power management

#15 | 2009-05-07 βœ… Patent 7,994,005 granted on 2011-08-09
US20090114949A1
Electricity

High-mobility trench MOSFETs

#16 | 2009-03-05
US20090057869A1
Electricity

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

#17 | 2008-12-11 βœ… Patent 7,750,447 granted on 2010-07-06
US20080304306A1
Electricity

High voltage and high power boost converter with co-packaged Schottky diode

#18 | 2008-12-11 βœ… Patent 8,008,897 granted on 2011-08-30
US20080304305A1
Electricity

Boost converter with integrated high power discrete FET and low voltage controller

AssigneeID:

74453 ⎘