Patents-Review.com
ClassID:

83905 ⎘

B81B2207/092 - CPC Classification

Classification description:

Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package Buried interconnects in the substrate or in the lid

Recent Application in this class:
#1
20260097955
2026-04-09

MEMS Sensor Module

 #2
20250109972
2025-04-03

SENSOR PACKAGE AND SENSING MODULE THEREOF

 #3
20250011164
2025-01-09

SENSOR DEVICE

 #4
20240425363
2024-12-26

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

 #5
20240425362
2024-12-26

MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING

 #6
20240400374
2024-12-05

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

 #7
20240272298
2024-08-15

PMUT ARRAY WITH RESONANCE FREQUENCY TUNABLE DUE TO ADJUSTABLE EMBEDDED CAVITY

 #8
20240116752
2024-04-11

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

 #9
20230163103
2023-05-25

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

 #10
20220289560
2022-09-15

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #11
20220112075
2022-04-14

MEMS packaging structure and manufacturing method therefor

 #12
20210261404
2021-08-26

Electrical contacting and method for producing an electrical contacting

 #13
20210163283
2021-06-03

Packaged environmental sensor

 #14
20210155472
2021-05-27

Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit

 #15
20200399117
2020-12-24

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #16
20200385260
2020-12-10

Microelectromechanical device with signal routing through a protective cap

 #17
20200200791
2020-06-25

Inertial sensor, electronic device, and vehicle

 #18
20200039820
2020-02-06

Semiconductor module

 #19
20190276307
2019-09-12

Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system

 #20
20190256352
2019-08-22

Method of manufacturing semiconductor structure

 #21
20190253791
2019-08-15

Top port multi-part surface mount silicon condenser microphone

 #22
20190169020
2019-06-06

PACKAGE SUBSTRATE INTEGRATED DEVICES

 #23
20190152769
2019-05-23

Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit

 #24
20190127218
2019-05-02

Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module

 #25
20190106322
2019-04-11

LOW COST, LOW PROFILE, CERAMIC BUTTON SENSOR PACKAGING

 #26
20190047845
2019-02-14

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #27
20180249242
2018-08-30

Top port multi-part surface mount MEMS microphone

 #28
20180168034
2018-06-14

Wiring-buried glass substrate, and inertial sensor element and inertial sensor using same

 #29
20180086627
2018-03-29

Integrating MEMS structures with interconnects and vias

 #30
20180044168
2018-02-15

Process for manufacturing a semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit and corresponding semiconductor device

 #31
20180037454
2018-02-08

Microelectronic device housing bearing on the microelectronic device

 #32
20180022601
2018-01-25

Method for producing a semiconductor module

 #33
20170362079
2017-12-21

Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate

 #34
20170313579
2017-11-02

Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module

 #35
20170297906
2017-10-19

Microelectromechanical device with signal routing through a protective cap

 #36
20170297902
2017-10-19

Semiconductor structure and manufacturing method thereof

 #37
20170264997
2017-09-14

Top port multi-part surface mount silicon condenser microphone

 #38
20170257687
2017-09-07

PACKAGES AND METHODS FOR PACKAGING

 #39
20170233248
2017-08-17

MICRO SENSOR AND MANUFACTURING METHOD THEREOF

 #40
20170166435
2017-06-15

Semiconductor devices with moving members and methods for making the same

 #41
20170113924
2017-04-27

Sensor component having two sensor functions

 #42
20160241951
2016-08-18

Top port multi-part surface mount silicon condenser microphone

 #43
20160229684
2016-08-11

MEMS DEVICE INCLUDING SUPPORT STRUCTURE AND METHOD OF MANUFACTURING

 #44
20160145096
2016-05-26

Microelectromechanical device with signal routing through a protective cap

 #45
20160105737
2016-04-14

Packages and methods for packaging

 #46
20160052782
2016-02-25

Method for fabricating electronic device package

 #47
20160016789
2016-01-21

Thin film structure for hermetic sealing

 #48
20150360937
2015-12-17

Micromechanical component and method for manufacturing same

 #49
20150353348
2015-12-10

Glass wafer assembly

 #50
20150059485
2015-03-05

Micromechanical sensor system and corresponding manufacturing method

 #51
20150035387
2015-02-05

MEMS switch device and method of fabrication

 #52
20150027224
2015-01-29

Micromechanical measuring element and method for producing a micromechanical measuring element

 #53
20150001646
2015-01-01

Pre-mold for a microphone assembly and method of producing the same

 #54
20140230546
2014-08-21

Microelectromechanical device with signal routing through a protective cap

 #55
20140217523
2014-08-07

Housing for a semiconductor chip and semiconductor chip with a housing

 #56
20140199835
2014-07-17

Chip package and method for forming the same

 #57
20140199830
2014-07-17

Chip package and method for forming the same

 #58
20140124879
2014-05-08

Component and method for producing same

 #59
20140117473
2014-05-01

Packages and methods for packaging

 #60
20140117469
2014-05-01

TSV-MEMS COMBINATION

 #61
20140063580
2014-03-06

Via structure and method thereof

 #62
20140054730
2014-02-27

System and method for forming a buried lower electrode in conjunction with an encapsulated MEMS device

 #63
20140042596
2014-02-13

Bonded wafer structures

 #64
20130341739
2013-12-26

Package structure having micro-electro-mechanical system element and method of fabrication the same

 #65
20130292825
2013-11-07

Chip package and method for forming the same

 #66
20130285170
2013-10-31

Multiple bonding in wafer level packaging

 #67
20130265730
2013-10-10

Photostructured magnetic devices and methods for making same

 #68
20130223031
2013-08-29

Sensor comprising a multi-layered ceramic substrate and method for its production

 #69
20130135317
2013-05-30

Thin back glass interconnect

 #70
20130032905
2013-02-07

Semiconductor package configured to electrically couple to a printed circuit board and method of providing same

 #71
20130020713
2013-01-24

Wafer level package and a method of forming a wafer level package

 #72
20130003160
2013-01-03

Methods of fabricating MEMS with spacers between plates and devices formed by same

 #73
20120319304
2012-12-20

Semiconductor device and manufacturing method

 #74
20120313235
2012-12-13

Semiconductor devices with moving members and methods for making the same

 #75
20120261774
2012-10-18

MEMS package or sensor package with intra-cap electrical via and method thereof

 #76
20120224726
2012-09-06

MEMS-microphone

 #77
20120142144
2012-06-07

Wafer level structures and methods for fabricating and packaging MEMS

 #78
20120139100
2012-06-07

Laminated transferable interconnect for microelectronic package

 #79
20120080762
2012-04-05

Plating process and apparatus for through wafer features

 #80
20120074590
2012-03-29

Multiple bonding in wafer level packaging

 #81
20120043629
2012-02-23

Surface mount silicon condenser microphone package

 #82
20120018898
2012-01-26

Via structure and method thereof

 #83
20110298064
2011-12-08

Sensor module and method for producing sensor modules

 #84
20110278735
2011-11-17

Chip package

 #85
20110278734
2011-11-17

Chip package

 #86
20110230068
2011-09-22

Component comprising a chip in a cavity and a stress-reduced attachment

 #87
20110210409
2011-09-01

Surface mount silicon condenser microphone package

 #88
20110170273
2011-07-14

Method of making an embedded electromagnetic device

 #89
20110156106
2011-06-30

Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device

 #90
20110006434
2011-01-13

Under land routing

 #91
20100221860
2010-09-02

PRECISION MICRO-ELECTROMECHANICAL SENSOR (MEMS) MOUNTING IN ORGANIC PACKAGING

 #92
20100182675
2010-07-22

Methods of fabricating MEMS with spacers between plates and devices formed by same

 #93
20100176468
2010-07-15

Microelectromechanical apparatus and method for producing the same

 #94
20100176466
2010-07-15

Semiconductor device including sensor member and cap member and method of making the same

 #95
20100171189
2010-07-08

Electronic device package and fabrication method thereof

 #96
20100139239
2010-06-10

Method of manufacturing a nozzle arrangement and method for in-situ repairing a nozzle arrangement

 #97
20100127340
2010-05-27

MEMS package and method of manufacturing the MEMS package

 #98
20100117767
2010-05-13

Three dimensional integrated passive device and method of fabrication

 #99
20100087024
2010-04-08

DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME

 #100
20100019370
2010-01-28

Semiconductor device and manufacturing method

 #101
20100018764
2010-01-28

Substrate-penetrating electrical connections

 #102
20090146227
2009-06-11

Capacitive sensor and manufacturing method therefor

 #103
20090091018
2009-04-09

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

 #104
20080279498
2008-11-13

MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same

 #105
20080122560
2008-05-29

Three dimensional integrated passive device and method of fabrication

 #106
20080116534
2008-05-22

Substrate contact for a MEMS device

 #107
20080113164
2008-05-15

Method for manufacturing electronic component, and electronic component

 #108
20080079120
2008-04-03

Interconnect structure using through wafer vias and method of fabrication

 #109
20070202627
2007-08-30

Silicon condenser microphone and manufacturing method

 #110
20070201715
2007-08-30

Silicon condenser microphone and manufacturing method

 #111
20070087462
2007-04-19

Method of forming a device package having edge interconnect pad

 #112
20060267178
2006-11-30

Electrical component and production thereof

 #113
20060234476
2006-10-19

Electronic component and method for its production

 #114
20050250238
2005-11-10

Method of making electrical connections to hermetically sealed MEMS devices

 #115
20050167047
2005-08-04

Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

 #116
20050161753
2005-07-28

Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

 #117
20050121735
2005-06-09

Hermetically sealed silicon micro-machined electromechanical system (MEMS) device having diffused conductors

 #118
20050018864
2005-01-27

Method of manufacturing a microphone

 #119
17719045
2024-03-12

Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication

 #120
15897893
2020-04-21

Thin MEMS die

 #121
14834498
2017-01-24

Integrated MEMS pressure sensor and MEMS inertial sensor

 #122
14155025
2015-04-14

Top port multi-part surface mount silicon condenser microphone