83907 ⎘
Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package Feed-through, via
Sub-classes:MEMS COMPONENT COMPRISING A MEMS ELEMENT HAVING A CAVITY AND COMPRISING AN ASIC COMPONENT
#2Stacked-die MEMS resonator
#3MICROELECTROMECHANICAL SYSTEM DEVICE WITH OFFSET MIRROR
#4MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATOR ROTOR
#5STACKED-DIE MEMS RESONATOR
#6UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR FORMING THE SAME
#7MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
#8MEMS resonator system
#9STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
#10Stacked-die MEMS resonator
#11Undercut-free patterned aluminum nitride structure and methods for forming the same
#12Undercut-free patterned aluminum nitride structure and methods for forming the same
#13Stacked-die MEMS resonator
#14Methods for packaging a microelectromechanical systems device
#15Manufacturing of integrated circuit resonator
#16Microelectromechanical systems packages and methods for packaging a microelectromechanical systems device
#17Package structure for micromechanical resonator
#18Fluidic microelectromechanical sensors/devices and fabrication methods thereof
#19Low-profile stacked-die MEMS resonator system
#20BONDLINE FOR MM-WAVE APPLICATIONS
#21Integrating MEMS structures with interconnects and vias
#22METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM
#23Multi-pressure MEMS package
#24Pressure sensor
#25Various stress free sensor packages using wafer level supporting die and air gap technique
#26SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
#27Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
#28MEMS-CMOS device that minimizes outgassing and methods of manufacture
#29Semiconductor structure and manufacturing method thereof
#30Stacked-die MEMS resonator system
#31Packaged sensor assembly
#32Silicon-on-sapphire device with minimal thermal strain preload and enhanced stability at high temperature
#33MEMS device and fabrication method
#34Micromachined monolithic 3-axis gyroscope with single drive
#35MEMS-CMOS device that minimizes outgassing and methods of manufacture
#36Methods and structures of integrated MEMS-CMOS devices
#37Integration of pressure sensors into integrated circuit fabrication and packaging
#38PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS
#39Integrated CMOS and MEMS devices with air dieletrics
#40Semiconductor device with through molding vias and method of making the same
#41Methods and devices for microelectromechanical pressure sensors
#42Pressure sensor and manufacture method thereof
#43Magnet placement for integrated sensor packages
#44Integration of pressure or inertial sensors into integrated circuit fabrication and packaging
#45Semiconductor device with through molding vias
#46Low-profile stacked-die MEMS resonator system
#47Fabricating polysilicon MOS devices and passive ESD devices
#48Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom
#49Stacked die package for MEMS resonator system
#50Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom
#51Stacked die package for MEMS resonator system
#52Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
#53Monolithic integration of MEMS and IC devices
#54Multi-pressure MEMS package
#55Semiconductor device including a MEMS die and a conductive layer
#56Integrated MEMS pressure sensor and MEMS inertial sensor
#57Micro-resonator having lid-integrated electrode