83909 ⎘
Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package; Feed-through, via through the substrate
MEMS PRESSURE TRANSDUCER WAFER-LEVEL CHIP-SCALE PACKAGE AND METHOD FOR PRODUCING THE SAME
#2MEMS ELECTROSTATIC ACTUATOR BLADE CONFIGURATIONS AND METHODS OF MANUFACTURE
#3SILICON MEMS GYROSCOPES WITH UPPER AND LOWER SENSE PLATES
#4MICROELECTROMECHANICAL SYSTEM DEVICE WITH FILLED VIA
#5SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCUITS AND FABRIC CARRIERS
#6METHODS AND SYSTEMS FOR STACKED MICROELECTROMECHANICAL SYSTEM DEVICES
#7SEMICONDUCTOR DEVICES AND RELATED METHODS
#8Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators
#9MEMBRANE AND ELECTRO-ACOUSTIC TRANSDUCER
#10PACKAGE STRUCTURE
#11WAFER-LEVEL PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR, AND SENSOR
#12MICROPHONE STRUCTURE, PACKAGING STRUCTURE, AND ELECTRONIC APPARATUS
#133D Heterogeneously Integrated Power Electronic Building Blocks
#14Dual-Layer Micro-ribbon MEMS Light Modulator
#15WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
#16MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CONTROLLER DEVICE
#17MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION POINT
#18MEMS COMPONENT WITH UPSIDE-DOWN CHIP
#19PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
#20DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
#21METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRANE, AND MEMS TRANSDUCER DEVICE
#22MEMS DIES EMBEDDED IN GLASS CORES
#23MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
#24MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
#25MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE
#26ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
#27DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#28VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
#29DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#30MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
#31Sensor devices with gas-permeable cover and associated production methods
#32MEMS MICROPHONE PACKAGE
#33COMPOSITED CARRIER FOR MICROPHONE PACKAGE
#34MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
#35PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
#36Fabrication Method of MEMS Transducer Element
#37Silicon MEMS gyroscopes with upper and lower sense plates
#38PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES
#39Dual-layer micro-ribbon MEMS light modulator
#40SEMICONDUCTOR DEVICES AND RELATED METHODS
#41INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
#42Substrate and microphone unit
#43MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF
#44MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
#45Sensor and package assembly thereof
#46Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via
#47Sensor devices with gas-permeable cover and associated production methods
#48MEMS transducing apparatus and method of fabricating the same
#49SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCUITS AND FABRIC CARRIERS
#50Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS
#51Microelectronics package with vertically stacked MEMS device and controller device
#52Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit
#53Semiconductor package and method for manufacturing the same
#54Semiconductor package structure and method for manufacturing the same
#55Semiconductor devices and related methods
#56Microelectromechanical device with signal routing through a protective cap
#57INERTIAL SENSOR
#58Semiconductor device and method of forming MEMS package
#59Semiconductor device with discharge path, and method for producing the same
#60Full symmetric multi-throw switch using conformal pinched through via
#61PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES
#62Semiconductor structure and manufacturing method thereof
#63Water proofing and water detection schemes for MEMS-based environmental sensing devices
#64Packaging a sealed cavity in an electronic device
#65Method of manufacturing semiconductor device and semiconductor device
#663D stack configuration for 6-axis motion sensor
#67Absolute and differential pressure sensors and related methods
#68Methods for fabricating silicon MEMS gyroscopes with upper and lower sense plates
#69Micro-electrical mechanical system sensor package and method of manufacture thereof
#70MEMS devices and methods of forming same
#71CMOS thermal fluid flow sensing device employing a flow sensor and a pressure sensor on a single membrane
#72Semiconductor module
#73Semiconductive structure and manufacturing method thereof
#74Apparatus having a cavity structure and method for producing same
#75Method for forming micro-electro-mechanical system (MEMS) structure
#76Semiconductor package and method for manufacturing the same
#77Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system
#78Pressure sensor, in particular a microphone with improved layout
#79Monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS and method for producing the same
#80Microelectromechanical system (MEMS) device packaging
#81Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit
#82Semiconductor sensor device and method for fabricating the same
#83Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module
#84LOW COST, LOW PROFILE, CERAMIC BUTTON SENSOR PACKAGING
#85Water proofing and water detection schemes for MEMS-based environmental sensing devices
#86Flush-mount micromachined transducers
#87Inorganic wafer having through-holes attached to semiconductor wafer
#88Packaging a sealed cavity in an electronic device
#89MEMS device package and method for manufacturing the same
#90MEMS devices and methods of forming same
#91Monolithic phase change heat sink
#92PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP
#93Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus
#94Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the same
#95Inter-poly connection for parasitic capacitor and die size improvement
#96Transducer packaging
#97MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle
#98MEMS microphone modules and wafer-level techniques for fabricating the same
#99Transducer apparatus and methods
#100Apparatus having a cavity structure and method for producing same
#101Semiconductive structure and manufacturing method thereof
#102Electronic systems with through-substrate interconnects and MEMS device
#103Microelectromechanical systems package structure
#104Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#105Wiring-buried glass substrate, and inertial sensor element and inertial sensor using same
#106Signal transmitting device
#107Semiconductor package with a through port for sensor applications
#108Semiconductor structure and method of manufacturing the same
#109MEMS MICROPHONE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE MEMS MICROPHONE PACKAGE STRUCTURES
#110ARRANGEMENT WITH A MEMS DEVICE AND METHOD OF MANUFACTURING
#111SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#112Filter including bulk acoustic wave resonator
#113Semiconductor structure and manufacturing method thereof
#114Through silicon via (TSV) formation in integrated circuits
#115Two-port SRAM connection structure
#116Wafer-level package with enhanced performance
#117Process for manufacturing a semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit and corresponding semiconductor device
#118MEMS capacitive shear sensor system having an interface circuit
#119Vacuum sealed MEMS and CMOS package
#120Microelectromechanical system (MEMS) device packaging
#121Method for producing a semiconductor module
#122Inorganic wafer having through-holes attached to semiconductor wafer
#123Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate
#124Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module
#125Microelectromechanical device with signal routing through a protective cap
#126Semiconductor device and method of forming MEMS package
#127Die with integrated microphone device using through-silicon vias (TSVs)
#128Microelectromechanical systems (MEMS) devices at different pressures
#129Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#130Integrated MEMS transducers
#131ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
#132Semiconductor devices with moving members and methods for making the same
#133Method for fabricating a micro-well of a biosensor
#134MEMS device structure with a capping structure
#135Sensor component having two sensor functions
#136Inter-poly connection for parasitic capacitor and die size improvement
#137Device for connecting at least one nano-object associated with a chip enabling a connection to at least one external electrical system and method of fabrication thereof
#138MEMS electrostatic actuator device for RF varactor applications
#139INTERPOSER FOR MOUNTING A VERTICALLY INTEGRATED HYBRID COMPONENT ON A COMPONENT CARRIER
#140Semiconductor device package including a wall and a grounding ring exposed from the wall
#141MEMS devices and methods of forming same
#142Strain Reduction and Sensing on Package Substrates
#143Electronic systems with through-substrate interconnects and MEMS device
#144Two-port SRAM connection structure
#145Method of forming capacitive MEMS sensor devices
#146Through silicon via including multi-material fill
#147Monolithic MEMS platform for integrated pressure, temperature, and gas sensor
#148MEMS microphone and method for forming the same
#149Capacitive micromachined ultrasonic transducer (CMUT) forming
#150Semiconductor device and method of forming MEMS package
#151Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
#152Method of selectively removing an anti-stiction layer on a eutectic bonding area
#153MEMS electrostatic actuator device for RF varactor applications
#154Environment-resistant module, micropackage and methods of manufacturing same
#155Microelectromechanical device with signal routing through a protective cap
#156Microelectromechanical systems (MEMS) devices at different pressures
#157MEMS device with a capping substrate
#158MEMS microphone modules and wafer-level techniques for fabricating the same
#159Cap and substrate electrical connection at wafer level
#160MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE WITH LOW SUBSTRATE CAPACITIVE COUPLING EFFECT
#161Chip package and method of manufacturing the same
#162Thin film structure for hermetic sealing
#163MEMS device structure and methods of forming same
#164Glass wafer assembly
#165Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
#166Vacuum sealed MEMS and CMOS package
#167Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#168MEMS DEVICE HAVING CONDUCTIVE MICROSTRUCTURES LATERALLY SURROUNDED BY OXIDE MATERIAL
#169Method for forming chip package
#170MEMS device and formation method thereof
#171Through-silicon via (TSV)-based devices and associated techniques and configurations
#172Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof
#1733D MEMS device and method of manufacturing
#174Stress-controlled formation of TiN hard mask
#175Micro electromechanical system sensor and method of forming the same
#176MEMS devices and methods of forming same
#177Micromechanical sensor device
#178Reduced stress pressure sensor
#179Method and apparatus for fabricating electrostatic capacitance-type acceleration sensor and electrostatic capacitance-type acceleration sensor
#180Method for producing a pressure sensor and corresponding sensor
#181Encapsulation structure including a mechanically reinforced cap and with a getter effect
#182Micromechanical measuring element and method for producing a micromechanical measuring element
#183Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
#184Pre-mold for a microphone assembly and method of producing the same
#185Vertical mount package and wafer level packaging therefor
#186TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC LOSSES
#187MEMS sensor packaging and method thereof
#188Hermetic packaging of integrated circuit components having a capacitor for transfer of electrical signals
#189Microphone
#190MEMS device with a capping substrate
#191Capacitive MEMS sensor devices
#192Electronic component
#193Microelectromechanical device with signal routing through a protective cap
#194Housing for a semiconductor chip and semiconductor chip with a housing
#195Ultrasonic transducer and method of manufacturing the same
#196Component and method for producing same
#197Micromechanical component
#198Wafer-level packaging of a MEMS integrated device and related manufacturing process
#199Through silicon via including multi-material fill
#200Cap and substrate electrical connection at wafer level
#201Method for manufacturing a component having an electrical through-connection
#202Micro-sensor package and associated method of assembling the same
#203Chip package and method for forming the same
#204Chip package and method for forming the same
#205Hybridly integrated component and method for the production thereof
#206Method for MEMS device fabrication and device formed
#207MEMS device structure and methods of forming same
#208Through silicon via with reduced shunt capacitance
#209Photostructured magnetic devices and methods for making same
#210Vertical mount package and wafer level packaging therefor
#211Sensor comprising a multi-layered ceramic substrate and method for its production
#212Electronic device, method for manufacturing thereof, and electronic apparatus
#213Module and production method
#214Semiconductor stack structure and fabrication method thereof
#215MEMS devices and methods of forming same
#216Hermetic Semiconductor Package Structure and Method for Manufacturing the same
#217MEMS acoustic transducer and method for fabricating the same
#218GLASS-ENCAPSULATED PRESSURE SENSOR
#219Sensor device manufacturing method and sensor device
#220Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough
#221Method for producing a two-chip assembly and corresponding two-chip assembly
#222GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#223GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#224Semiconductor package configured to electrically couple to a printed circuit board and method of providing same
#225Monolithic Silicon Microphone
#226BONDED DOUBLE SUBSTRATE APPROACH TO SOLVE LASER DRILLING PROBLEMS
#227Method for wafer level packaging of electronic devices
#228Semiconductor package for MEMS device and method of manufacturing same
#229Semiconductor devices with moving members and methods for making the same
#230ARRANGEMENT WITH A MEMS DEVICE AND METHOD OF MANUFACTURING
#231Package having MEMS element and fabrication method thereof
#232Sensor device and manufacturing method thereof
#233Package interconnects
#234Through substrate structure, device package having the same, and methods for manufacturing the same
#235Component support and assembly having a MEMS component on such a component support
#236Method for MEMS device fabrication and device formed
#237Wafer level structures and methods for fabricating and packaging MEMS
#238Systems and methods for a four-layer chip-scale MEMS device
#239Semi-conductor sensor fabrication
#240Package structure with micro-electromechanical element and manufacturing method thereof
#241Sealing member for piezoelectric resonator device and pieoelectric resonator device
#242MEMS MICROPHONE PACKAGE
#243Package structure having MEMS element and fabrication method thereof
#244Electronic device, electronic apparatus, and electronic device manufacturing method
#245Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough
#246Sensor module
#247MEMS element and method for manufacturing same
#248Via structure and method thereof
#249Sensor module and method for producing sensor modules
#250Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device
#251MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
#252Electronic Device Package and Methods of Manufacturing an Electronic Device Package
#253Manufacturing method of combined sensor
#254Method for making via interconnection
#255Method of making an embedded electromagnetic device
#256Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
#257Method for establishing and closing a trench of a semiconductor component
#258Method for forming micro-electro-mechanical system (MEMS) package
#259Semiconductor package and method of manufacturing the same
#260SENSOR SYSTEM AND METHOD FOR MANUFACTURING SAME
#261Double-side mountable MEMS package
#262Cap and substrate electrical connection at wafer level
#263MEMS package
#264Encapsulation module method for production and use thereof
#265MEMS device including a chip carrier
#266Wafer level packaging using flip chip mounting
#267Electronic device package and method for forming the same
#268Hermetic packaging of integrated circuit components
#269Packaged device and producing method thereof
#270MEMS device with integrated via and spacer
#271Electronic component device, and method of manufacturing the same
#272Optical module
#273SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS
#274Microelectromechanical apparatus and method for producing the same
#275Method of manufacturing a nozzle arrangement and method for in-situ repairing a nozzle arrangement
#276MEMS package and method of manufacturing the MEMS package
#277Packaging for piezoelectric resonator
#278MEMS package and packaging method thereof
#279DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME
#280Acoustic transducer unit
#281Micro-electro-mechanical systems (MEMS) package
#282Substrate-penetrating electrical connections
#283Isolation channel improving measurement accuracy of MEMS devices
#284Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level
#285Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape
#286Double-side mountable MEMS package
#287Fabrication of Compact Semiconductor Packages
#288Hermetic chamber with electrical feedthroughs
#289Electrical connection through a substrate to a microelectromechanical device
#290Method of manufacturing substrate
#291Physical sensor and method of process
#292Silicon wafer having through-wafer vias
#293Electronic component package and method of manufacturing the same, and electronic component device
#294Sensor device, sensor system and methods for manufacturing them
#295Semiconductor package substrate and methods for forming same, in particular for MEMS devices
#296Electronic component and method for manufacturing the same
#297Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape
#298Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same
#299Methods of fabrication of wafer-level vacuum packaged devices
#300Method of fabricating MEMS device