Patents-Review.com
ClassID:

83908 ⎘

B81B2207/095 - CPC Classification

Classification description:

Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package; Feed-through, via through the lid

Recent Application in this class:
#1
20260048983
2026-02-19

METHODS AND SYSTEMS FOR STACKED MICROELECTROMECHANICAL SYSTEM DEVICES

 #2
20260028221
2026-01-29

SENSOR

 #3
20250388459
2025-12-25

Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature

 #4
20250178887
2025-06-05

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

 #5
20250136436
2025-05-01

MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)

 #6
20250109015
2025-04-03

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT

 #7
20240409397
2024-12-12

MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER

 #8
20240174511
2024-05-30

MEMS DEVICE

 #9
20240116753
2024-04-11

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

 #10
20230417614
2023-12-28

MEMS PRESSURE SENSOR

 #11
20230077493
2023-03-16

SENSOR

 #12
20220250902
2022-08-11

Device for supporting MEMS and/or ASIC components

 #13
20220178773
2022-06-09

PRESSURE SENSOR AND PACKAGING METHOD THEREOF

 #14
20210403317
2021-12-30

Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via

 #15
20210371273
2021-12-02

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

 #16
20210300749
2021-09-30

Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips

 #17
20210261404
2021-08-26

Electrical contacting and method for producing an electrical contacting

 #18
20210246016
2021-08-12

IR emitter with glass lid

 #19
20210156756
2021-05-27

MEMS pressure sensor

 #20
20210032097
2021-02-04

Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package

 #21
20210017018
2021-01-21

Semiconductor package structure and method for manufacturing the same

 #22
20210009405
2021-01-14

Packaged pressure sensor device

 #23
20200369514
2020-11-26

PACKAGING FOR A MEMS TRANSDUCER

 #24
20200353268
2020-11-12

Packaging structure and packaging method for retinal prosthesis implanted chip

 #25
20200331748
2020-10-22

Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package

 #26
20200290867
2020-09-17

Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process

 #27
20200270120
2020-08-27

Full symmetric multi-throw switch using conformal pinched through via

 #28
20200232860
2020-07-23

MEMS pressure sensor

 #29
20200062633
2020-02-27

Hermetic conductive feedthroughs for a semiconductor wafer

 #30
20200062588
2020-02-27

MEMS devices and methods of forming same

 #31
20200024137
2020-01-23

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #32
20200024136
2020-01-23

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #33
20200002162
2020-01-02

Semiconductor device packages and methods of manufacturing the same

 #34
20190315620
2019-10-17

Method for forming micro-electro-mechanical system (MEMS) structure

 #35
20190229703
2019-07-25

Component with a thin-layer covering and method for its production

 #36
20190169022
2019-06-06

Microelectromechanical system (MEMS) device packaging

 #37
20190161346
2019-05-30

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #38
20190144269
2019-05-16

Wafer level encapsulation for MEMS device

 #39
20190127215
2019-05-02

Semiconductor apparatus having flexible connecting members and method for manufacturing the same

 #40
20190112180
2019-04-18

Packaged pressure sensor device

 #41
20190084826
2019-03-21

Through silicon interposer wafer and method of manufacturing the same

 #42
20190047851
2019-02-14

MEMS devices and methods of forming same

 #43
20190002275
2019-01-03

Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the same

 #44
20180297838
2018-10-18

Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process

 #45
20180297834
2018-10-18

MEMS package

 #46
20180230001
2018-08-16

Semiconductor device

 #47
20180127268
2018-05-10

MEMS device and method for producing same

 #48
20180127265
2018-05-10

Package for MEMS device and process

 #49
20180097172
2018-04-05

MEMS component and method for encapsulating MEMS components

 #50
20180086627
2018-03-29

Integrating MEMS structures with interconnects and vias

 #51
20180063646
2018-03-01

MEMS microphone package

 #52
20180063645
2018-03-01

MEMS microphone package

 #53
20180029880
2018-02-01

Microelectromechanical system (MEMS) device packaging

 #54
20180013055
2018-01-11

MEMS component having a high integration density

 #55
20180002163
2018-01-04

3D MEMS device with hermetic cavity

 #56
20170362079
2017-12-21

Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate

 #57
20170320726
2017-11-09

MEMS Package

 #58
20170297898
2017-10-19

Scanning mirror device and a method for manufacturing it

 #59
20170283247
2017-10-05

SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE

 #60
20170233249
2017-08-17

Microelectromechanical systems (MEMS) devices at different pressures

 #61
20170197820
2017-07-13

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT

 #62
20170167933
2017-06-15

Pressure sensor

 #63
20170166435
2017-06-15

Semiconductor devices with moving members and methods for making the same

 #64
20170066647
2017-03-09

MEMS devices and methods of forming same

 #65
20170022049
2017-01-26

Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same

 #66
20160355395
2016-12-08

Reversible top/bottom MEMS package

 #67
20160297675
2016-10-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DEVICE

 #68
20160297674
2016-10-13

Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof

 #69
20160272488
2016-09-22

THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE

 #70
20160244325
2016-08-25

Multi-pressure MEMS package

 #71
20160229685
2016-08-11

MEMS components and method of wafer-level manufacturing thereof

 #72
20160221824
2016-08-04

Method of wafer-level hermetic packaging with vertical feedthroughs

 #73
20160214856
2016-07-28

Electronic device, pressure sensor, altimeter, electronic apparatus, and moving object

 #74
20160207758
2016-07-21

Thin capping for MEMS devices

 #75
20160169758
2016-06-16

Stress isolated differential pressure sensor

 #76
20160145094
2016-05-26

MICRO-ELELCTRO-MECHANICAL SYSTEM DEVICE AND METHOD FOR FABRICATING THE SAME

 #77
20160137491
2016-05-19

Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same

 #78
20160130137
2016-05-12

Microelectromechanical systems (MEMS) devices at different pressures

 #79
20160122180
2016-05-05

Method of making a semiconductor device having a functional capping

 #80
20160090296
2016-03-31

Encapsulation structure provided with a cap and a substrate to connect at least one nano-object onto a face of the substrate and to resume contact through the cap and method of manufacturing the structure

 #81
20160016789
2016-01-21

Thin film structure for hermetic sealing

 #82
20160002027
2016-01-07

Semiconductor device with through molding vias and method of making the same

 #83
20150375996
2015-12-31

Method of making a system-in-package device, and a system-in-package device

 #84
20150375989
2015-12-31

Microelectromechanical systems devices with improved lateral sensitivity

 #85
20150353348
2015-12-10

Glass wafer assembly

 #86
20150325780
2015-11-12

MEMS component and method for encapsulating MEMS components

 #87
20150311175
2015-10-29

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

 #88
20150232330
2015-08-20

Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

 #89
20150217992
2015-08-06

MEMS device and method for manufacturing the same

 #90
20150191346
2015-07-09

Reversible top/bottom MEMS package

 #91
20150191345
2015-07-09

3D MEMS device and method of manufacturing

 #92
20150175406
2015-06-25

Semiconductor device and method of manufacturing

 #93
20150122042
2015-05-07

Pressure sensor with deformable membrane and method of manufacture

 #94
20150115376
2015-04-30

MEMs device with outgassing shield

 #95
20150102433
2015-04-16

Package structure having MEMS element

 #96
20150101841
2015-04-16

Hermetic conductive feedthroughs for a semiconductor wafer

 #97
20150053003
2015-02-26

Method and apparatus for fabricating electrostatic capacitance-type acceleration sensor and electrostatic capacitance-type acceleration sensor

 #98
20150033878
2015-02-05

Method for producing a pressure sensor and corresponding sensor

 #99
20150028438
2015-01-29

Process for fabricating MEMS device

 #100
20150008542
2015-01-08

Micromechanical component and manufacturing method for a micromechanical component

 #101
20140374854
2014-12-25

Vertical mount package and wafer level packaging therefor

 #102
20140361387
2014-12-11

Chip arrangement and method for manufacturing a chip arrangement

 #103
20140353775
2014-12-04

Wafer-level packaging of integrated devices, and manufacturing method thereof

 #104
20140197713
2014-07-17

Out-of-plane spacer defined electrode

 #105
20140111062
2014-04-24

Wafer-level package and method for production thereof

 #106
20140063580
2014-03-06

Via structure and method thereof

 #107
20140054730
2014-02-27

System and method for forming a buried lower electrode in conjunction with an encapsulated MEMS device

 #108
20140048922
2014-02-20

Semiconductor device and method of manufacturing the same

 #109
20130341738
2013-12-26

Method for manufacturing a component having an electrical through-connection

 #110
20130320559
2013-12-05

Chip package and method for forming the same

 #111
20130307161
2013-11-21

Chip package and method for forming the same

 #112
20130293482
2013-11-07

TRANSPARENT THROUGH-GLASS VIA

 #113
20130292825
2013-11-07

Chip package and method for forming the same

 #114
20130265730
2013-10-10

Photostructured magnetic devices and methods for making same

 #115
20130256896
2013-10-03

Vertical mount package and wafer level packaging therefor

 #116
20130215585
2013-08-22

Package

 #117
20130206465
2013-08-15

Electronic device, method for manufacturing thereof, and electronic apparatus

 #118
20130193527
2013-08-01

Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same

 #119
20130168852
2013-07-04

MEMS devices and methods of forming same

 #120
20130147040
2013-06-13

MEMS CHIP SCALE PACKAGE

 #121
20130147020
2013-06-13

Component having a via and method for manufacturing it

 #122
20130135317
2013-05-30

Thin back glass interconnect

 #123
20130083381
2013-04-04

Optical deflector apparatus including optical deflector chip sandwhiched by two substrates

 #124
20130068020
2013-03-21

Combined sensor and method for manufacturing the same

 #125
20130061674
2013-03-14

METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR

 #126
20130050227
2013-02-28

GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES

 #127
20130050226
2013-02-28

DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

 #128
20130050155
2013-02-28

GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES

 #129
20130032385
2013-02-07

METAL THIN SHIELD ON ELECTRICAL DEVICE

 #130
20120319304
2012-12-20

Semiconductor device and manufacturing method

 #131
20120313235
2012-12-13

Semiconductor devices with moving members and methods for making the same

 #132
20120267773
2012-10-25

Method of making a semiconductor device having a functional capping

 #133
20120261822
2012-10-18

Out-of-plane spacer defined electrode

 #134
20120261774
2012-10-18

MEMS package or sensor package with intra-cap electrical via and method thereof

 #135
20120241901
2012-09-27

Package interconnects

 #136
20120235256
2012-09-20

MEMS component having a diaphragm structure

 #137
20120235253
2012-09-20

Vertical mount package for MEMS sensors

 #138
20120223410
2012-09-06

Region-divided substrate, semiconductor device having region-divided substrate, and method for manufacturing the same

 #139
20120142144
2012-06-07

Wafer level structures and methods for fabricating and packaging MEMS

 #140
20120142136
2012-06-07

WAFER LEVEL PACKAGING PROCESS FOR MEMS DEVICES

 #141
20120139100
2012-06-07

Laminated transferable interconnect for microelectronic package

 #142
20120139068
2012-06-07

Multi-chip package

 #143
20120126348
2012-05-24

Systems and methods for a four-layer chip-scale MEMS device

 #144
20120104629
2012-05-03

Reversible top/bottom MEMS package

 #145
20120080762
2012-04-05

Plating process and apparatus for through wafer features

 #146
20120032283
2012-02-09

Sensor module

 #147
20120025333
2012-02-02

MEMS element and method for manufacturing same

 #148
20120018898
2012-01-26

Via structure and method thereof

 #149
20120013020
2012-01-19

MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obtained Thereof

 #150
20110298140
2011-12-08

Component having a through-contact

 #151
20110233739
2011-09-29

Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device

 #152
20110227174
2011-09-22

Semiconductor physical quantity sensor

 #153
20110221455
2011-09-15

MICROMECHANICAL COMPONENT AND METHOD FOR ITS PRODUCTION

 #154
20110221056
2011-09-15

ELECTRODE STRUCTURE AND MICRODEVICE PACKAGE PROVIDED THEREWITH

 #155
20110180887
2011-07-28

Encapsulation, MEMS and encapsulation method

 #156
20110177643
2011-07-21

Fabrication method of package structure having MEMS element

 #157
20110175179
2011-07-21

Package structure having MEMS element

 #158
20110170273
2011-07-14

Method of making an embedded electromagnetic device

 #159
20110165717
2011-07-07

Method for forming micro-electro-mechanical system (MEMS) package

 #160
20110155548
2011-06-30

Dual substrate MEMS plate switch and method of manufacture

 #161
20110147859
2011-06-23

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #162
20110101474
2011-05-05

METHOD FOR PROTECTING ENCAPSULATED SENSOR STRUCTURES USING STACK PACKAGING

 #163
20110068421
2011-03-24

Integrated MEMS and ESD protection devices

 #164
20110062573
2011-03-17

Double-side mountable MEMS package

 #165
20110012248
2011-01-20

Method for producing a capping wafer for a sensor

 #166
20100290199
2010-11-18

Encapsulation module method for production and use thereof

 #167
20100290102
2010-11-18

Encapsulated electromechanical devices

 #168
20100176468
2010-07-15

Microelectromechanical apparatus and method for producing the same

 #169
20100176466
2010-07-15

Semiconductor device including sensor member and cap member and method of making the same

 #170
20100155865
2010-06-24

Semiconductor device and method of making the same

 #171
20100078739
2010-04-01

Vertical mount package for MEMS sensors

 #172
20100072626
2010-03-25

Wafer level packaged MEMS integrated circuit

 #173
20100072562
2010-03-25

Functional element package and fabrication method therefor

 #174
20100052082
2010-03-04

Micro-electro-mechanical systems (MEMS) package

 #175
20100019393
2010-01-28

PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME

 #176
20100019370
2010-01-28

Semiconductor device and manufacturing method

 #177
20100014146
2010-01-21

Encapsulation methods for interferometric modulator and MEMS devices

 #178
20090218668
2009-09-03

Double-side mountable MEMS package

 #179
20090091018
2009-04-09

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

 #180
20090071807
2009-03-19

MEMS SWITCH AND METHOD OF FABRICATING THE SAME

 #181
20080237826
2008-10-02

Method for protecting encapsulated sensor structures using stack packaging

 #182
20080067664
2008-03-20

Cap wafer, semiconductor chip having the same, and fabrication method thereof

 #183
20080064142
2008-03-13

Method for fabricating a wafer level package having through wafer vias for external package connectivity

 #184
20080032457
2008-02-07

Structure and method of making sealed capped chips

 #185
20080029879
2008-02-07

Structure and method of making lidded chips

 #186
20080029863
2008-02-07

Methods of fabrication of wafer-level vacuum packaged devices

 #187
20080009091
2008-01-10

Wafer level capped sensor

 #188
20080002460
2008-01-03

Structure and method of making lidded chips

 #189
20080001241
2008-01-03

Structure and method of making lidded chips

 #190
20070164410
2007-07-19

Wafer level packaging cap and fabrication method thereof

 #191
20070145564
2007-06-28

Sequential fabrication of vertical conductive interconnects in capped chips

 #192
20070138644
2007-06-21

Structure and method of making capped chip having discrete article assembled into vertical interconnect

 #193
20070096312
2007-05-03

Structure and self-locating method of making capped chips

 #194
20070096311
2007-05-03

Structure and method of making capped chips having vertical interconnects

 #195
20070096295
2007-05-03

Back-face and edge interconnects for lidded package

 #196
20070087465
2007-04-19

Micromechanical component having an anodically bonded cap and a manufacturing method

 #197
20070085195
2007-04-19

Wafer level packaging cap and fabrication method thereof

 #198
20070015341
2007-01-18

Method of making MEMS wafers

 #199
20060286798
2006-12-21

Cap for semiconductor device package, and manufacturing method thereof

 #200
20060211233
2006-09-21

Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure

 #201
20060175707
2006-08-10

Wafer level packaging cap and fabrication method thereof

 #202
20060166480
2006-07-27

Interconnection of through-wafer vias using bridge structures

 #203
20060001114
2006-01-05

Apparatus and method of wafer level package

 #204
20050262929
2005-12-01

Wafer level capped sensor

 #205
20050241135
2005-11-03

Method of forming an assembly to house one or more micro components

 #206
20050230708
2005-10-20

Sensor with at least one micromechanical structure, and method for producing it

 #207
20050170609
2005-08-04

Conductive bond for through-wafer interconnect

 #208
20050167047
2005-08-04

Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

 #209
20050161753
2005-07-28

Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

 #210
20050156260
2005-07-21

Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

 #211
20050095835
2005-05-05

Structure and method of making capped chips having vertical interconnects

 #212
20050087861
2005-04-28

Back-face and edge interconnects for lidded package

 #213
20050085016
2005-04-21

Structure and method of making capped chips using sacrificial layer

 #214
20050082654
2005-04-21

Structure and self-locating method of making capped chips

 #215
20050082653
2005-04-21

Structure and method of making sealed capped chips

 #216
20050067688
2005-03-31

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

 #217
17719045
2024-03-12

Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication

 #218
16415491
2020-06-30

Waterproof MEMS chip package structure

 #219
15071882
2017-08-08

Semiconductor device including a MEMS die and a conductive layer

 #220
14710361
2016-05-24

Molded cavity substrate MEMS package fabrication method and structure