83909 ⎘
Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package; Feed-through, via through the substrate
Method and apparatus for microjoining dissimilar materials
#302Methods and apparatus having an integrated circuit attached to fused silica
#303Wafer level packaging process
#304MEMS device trench plating process and apparatus for through hole vias
#305Electronic parts packaging structure and method of manufacturing the same
#306Method for containing a device and a corresponding device
#307Interconnection device including one or more embedded vias and method of producing the same
#308Silicon wafer having through-wafer vias
#309Electrical component and production thereof
#310Structure and process for packaging RF MEMS and other devices
#311Method of fabricating a package for a micro component
#312Method of manufacturing a hermetic chamber with electrical feedthroughs
#313Hermetic chamber with electrical feedthroughs
#314Process for producing microelectromechanical components and a housed microelectromechanical component
#315Method of forming an assembly to house one or more micro components
#316Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#317Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#318Wafer-level package and its manufacturing method
#319Process for producing microelectromechanical components and a housed microelectromechanical component
#320Method of packaging RF MEMS
#321Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication
#322Method for making vias using a doped substrate
#323MEMS packaging techniques