METHOD OF MANUFACTURE AND ASSEMBLY OF XY FLEXURE MECHANISM ASSEMBLY

ACOUSTIC DEVICES WITH INCREASED ACOUSTIC RESISTANCE

Ultrasonic sensor and manufacturing method thereof

Method for manufacturing variable radio frequency micro-electromechanical switch

Stretchable substrate and method of manufacturing the same

Mirror assembly for light steering with reduced finger thickness

Micromachined multi-axis gyroscopes with reduced stress sensitivity

Micromechanical component and method for producing a micromechanical component

MEMS structure including a cap with a via

Supply system for an extreme ultraviolet light source

Systems and methods for fabricating 3D soft microstructures

Electronic device including a capacitor

Fabrication process for a symmetrical MEMS accelerometer

MEMS device stress-reducing structure

Method of manufacturing a remote-controlled micro-scale three-dimensional self-assembly

MEMS devices with an element having varying widths

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Micromachined multi-axis gyroscopes with reduced stress sensitivity

MEMS device and electronic apparatus

Versatile, flexible and biocompatible elastomeric microtubes

Method of manufacturing MEMS device and MEMS device

Proof mass and polysilicon electrode integrated thereon

Supply system for an extreme ultraviolet light source

Device including micromechanical components in cavities having different pressures and method for its manufacture

MEMS integrated pressure sensor devices and methods of forming same

MEMS DEVICE PACKAGE AND METHOD FOR PACKAGING MEMS DEVICE

Microelectromechanical system device

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Fabrication process for a symmetrical MEMS accelerometer

Method and structure of MEMS PLCSP fabrication

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Microphone and method for producing a microphone

Refractory seed metal for electroplated MEMS structures

Release hole plus contact via for fine pitch ultrasound transducer integration

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

MEMS integrated pressure sensor devices and methods of forming same

MEMS capacitive pressure sensors

CMOS integrated moving-gate transducer with silicon as a functional layer

Capacitive pressure sensors

Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring

Device with electrode connected to through wire, and method for manufacturing the same

Micromechanical sensor device

Etch release residue removal using anhydrous solution

MEMS and method for forming the same

Capacitive microelectronic and/or nanoelectronic device with increased compactness

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

MEMS integrated pressure sensor devices and methods of forming same

Multi-state interferometric modulator with large stable range of motion

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

Capacitive pressure sensors and fabrication methods thereof

INTEGRATED MEMS PRESSURE SENSOR WITH MECHANICAL ELECTRICAL ISOLATION

Micromechanical sensor and method for manufacturing a micromechanical sensor

MEMS devices and methods of forming the same

Two degree of freedom dithering platform for MEMS sensor calibration

Physical quantity sensor having an elongated groove, and manufacturing method thereof

MEMS capacitive pressure sensors and fabrication method thereof

Method for fabricating multiple types of MEMS devices

MEMS structure with improved shielding and method

MEMS scanning micromirror

Multigate resonant channel transistor

Inhibiting propagation of surface cracks in a MEMS Device

Composite micro-electro-mechanical-system apparatus and manufacturing method thereof

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

MEMS integrated pressure sensor devices and methods of forming same

METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED STRUCTURES

Microelectromechanical system and method

MEMS device with a capping substrate

Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

MEMS device with stress relief structures

LOW-COST PACKAGE FOR INTEGRATED MEMS SENSORS

Integration of laminate MEMS in BBUL coreless package

Method and structure for adding mass with stress isolation to MEMS structures

MEMS tunneling micro seismic sensor

Method, apparatus and system for providing metering of acceleration

MEMS device with multiple electrodes and fabricating method thereof

CMOS integrated moving-gate transducer with silicon as a functional layer

WAFER BONDING AND RELATED METHODS AND APPARATUS

Micromechanical sensor device with movable gate and corresponding production method

MEMS DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF MEMS DEVICE

Integrated circuit with MEMS element and manufacturing method thereof

Triple-axis MEMS accelerometer

Microfabrication of high quality three dimensional structures using wafer-level glassblowing of fused quartz and ultra low expansion glasses

Nano resonator and manufacturing method thereof

Microelectromechanical load sensor and methods of manufacturing the same

Method for manufacturing a component having an electrical through-connection

Electronic device, method of manufacturing the electronic device, and method of driving the electronic device

Micromechanical device and method for manufacturing a micromechanical device

Micromechanical inertial sensor and method for manufacturing same

Environment-resistant module, micropackage and methods of manufacturing same

Method for producing an optical window device for a MEMS device

MEMS inertial sensor and method for manufacturing the same

Hybrid integrated component and method for the manufacture thereof

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMS devices and methods of forming the same

Method for producing a structure comprising at least one active part having zones of different thicknesses

Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices

MICROELECTRONIC SUBSTRATE COMPRISING A LAYER OF BURIED ORGANIC MATERIAL

Method of making semiconductor device

Fluid pressure sensor and measurement probe

MEMS multi-axis gyroscope Z-axis electrode structure

MEMS multi-axis gyroscope with central suspension and gimbal structure

Two degree of freedom dithering platform for MEMS sensor calibration

Systems and methods for an encoder and control scheme

Environment-resistant module, micropackage and methods of manufacturing same

Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

Methods and apparatuses for integrated packaging of microelectromechanical devices

Triple-axis MEMS accelerometer

Semiconductor device and method of making the same

Environment-resistant module, micropackage and methods of manufacturing same

Method of manufacture and assembly of XY flexure mechanism assembly

Method of making acoustic devices with edge corrugation

Method and structure of MEMS PLCSP fabrication

Resonator assembly comprising a silicon resonator and a quartz resonator

Method and apparatus for controlling Q losses through force distributions