ClassID:

84067

B81C2201/0107 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Surface micromachining; Sacrificial layer Sacrificial metal

Recent Application in this class:
#1
20250326629
2025-10-23

Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators

#2
20250233327
2025-07-17

ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES

#3
20240417240
2024-12-19

ATTACHABLE MICROPHONE AND MANUFACTURING METHOD THEREFOR

#4
20240405454
2024-12-05

Electrical contacts using an array of micromachined flexures

#5
20230040320
2023-02-09

Microelectromechanical infrared sensing device and fabrication method thereof

#6
20220155025
2022-05-19

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

#7
20210292161
2021-09-23

Methods for forming a MEMS device layer on an active device layer and devices formed thereby

#8
20200071161
2020-03-05

Method and system for fabricating a microelectromechanical system device with a movable portion using anodic etching of a sacrificial layer

#9
20190390919
2019-12-26

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

#10
20190345029
2019-11-14

Method for fabricating MEMS device integrated with a semiconductor integrated circuit

#11
20180201503
2018-07-19

Micro-electro-mechanical system (MEMS) structures and design structures

#12
20180201502
2018-07-19

Micro-electro-mechanical system (MEMS) structures and design structures

#13
20180179052
2018-06-28

Micro-electro-mechanical system (MEMS) structures and design structures

#14
20180162725
2018-06-14

MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof

#15
20170265013
2017-09-14

PCB speaker and method for micromachining speaker diaphragm on PCB substrate

#16
20170066645
2017-03-09

Refractory seed metal for electroplated MEMS structures

#17
20160304340
2016-10-20

Method for fabricating suspended MEMS structures

#18
20160264410
2016-09-15

Micro-electro-mechanical system (MEMS) structures and design structures

#19
20160264406
2016-09-15

Micro-electro-mechanical system (MEMS) structures and design structures

#20
20160264405
2016-09-15

Micro-Electro-Mechanical System (MEMS) structures and design structures

#21
20160090292
2016-03-31

Method to improve cantilever process performance

#22
20160008849
2016-01-14

Ultrasonic transducer, method of producing same, and ultrasonic probe using same

#23
20150368090
2015-12-24

Micro-electro-mechanical system (MEMS) structures and design structures

#24
20140308771
2014-10-16

Method for forming micro-electro-mechanical system (MEMS) beam structure

#25
20140009379
2014-01-09

CAVITY LINERS FOR ELECTROMECHANICAL SYSTEMS DEVICES

#26
20130335383
2013-12-19

REMOVAL OF MOLYBDENUM

#27
20130153378
2013-06-20

Horizontal coplanar switches and methods of manufacture

#28
20130057557
2013-03-07

HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS

#29
20120025331
2012-02-02

Horizontal coplanar switches and methods of manufacture

#30
20110316383
2011-12-29

ULTRASONIC TRANSDUCER, METHOD OF PRODUCING SAME, AND ULTRASONIC PROBE USING SAME

#31
20110308957
2011-12-22

Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology

#32
20110051224
2011-03-03

Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

#33
20100264498
2010-10-21

Manufacturing a MEMS element having cantilever and cavity on a substrate

#34
20100213068
2010-08-26

Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns

#35
20100096714
2010-04-22

Method of manufacturing MEMS sensor and MEMS sensor

#36
20090315567
2009-12-24

Electrical conditioning of MEMS device and insulating layer thereof

#37
20090305010
2009-12-10

Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

#38
20090234425
2009-09-17

Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves

#39
20090165295
2009-07-02

Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates

#40
20090160028
2009-06-25

Method for forming gaps in micromechanical device and micromechanical device

#41
20090137113
2009-05-28

Method for fabricating a microstructure

#42
20080268575
2008-10-30

Orientation-dependent etching of deposited AlN for structural use and sacrificial layers in MEMS

#43
20080032501
2008-02-07

SILICON ON METAL FOR MEMS DEVICES

#44
20070298238
2007-12-27

Method for forming a hermetically sealed cavity

#45
20070199822
2007-08-30

Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns

#46
20070196944
2007-08-23

Electrical conditioning of MEMS device and insulating layer thereof

#47
20070158775
2007-07-12

Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch

#48
20060134820
2006-06-22

Process for forming microstructures

#49
20050230839
2005-10-20

Fabrication of silicon micro-mechanical structures

#50
20050194348
2005-09-08

Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates

#51
17161705
2022-05-17

Method for forming MEMS cavity structure

#52
15624928
2020-02-25

Fabrication of multilayered carbon MEMS devices