84067 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Surface micromachining; Sacrificial layer Sacrificial metal
Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators
#2ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES
#3ATTACHABLE MICROPHONE AND MANUFACTURING METHOD THEREFOR
#4Electrical contacts using an array of micromachined flexures
#5Microelectromechanical infrared sensing device and fabrication method thereof
#6POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
#7Methods for forming a MEMS device layer on an active device layer and devices formed thereby
#8Method and system for fabricating a microelectromechanical system device with a movable portion using anodic etching of a sacrificial layer
#9POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
#10Method for fabricating MEMS device integrated with a semiconductor integrated circuit
#11Micro-electro-mechanical system (MEMS) structures and design structures
#12Micro-electro-mechanical system (MEMS) structures and design structures
#13Micro-electro-mechanical system (MEMS) structures and design structures
#14MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof
#15PCB speaker and method for micromachining speaker diaphragm on PCB substrate
#16Refractory seed metal for electroplated MEMS structures
#17Method for fabricating suspended MEMS structures
#18Micro-electro-mechanical system (MEMS) structures and design structures
#19Micro-electro-mechanical system (MEMS) structures and design structures
#20Micro-Electro-Mechanical System (MEMS) structures and design structures
#21Method to improve cantilever process performance
#22Ultrasonic transducer, method of producing same, and ultrasonic probe using same
#23Micro-electro-mechanical system (MEMS) structures and design structures
#24Method for forming micro-electro-mechanical system (MEMS) beam structure
#25CAVITY LINERS FOR ELECTROMECHANICAL SYSTEMS DEVICES
#26REMOVAL OF MOLYBDENUM
#27Horizontal coplanar switches and methods of manufacture
#28HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS
#29Horizontal coplanar switches and methods of manufacture
#30ULTRASONIC TRANSDUCER, METHOD OF PRODUCING SAME, AND ULTRASONIC PROBE USING SAME
#31Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology
#32Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
#33Manufacturing a MEMS element having cantilever and cavity on a substrate
#34Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
#35Method of manufacturing MEMS sensor and MEMS sensor
#36Electrical conditioning of MEMS device and insulating layer thereof
#37Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
#38Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves
#39Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#40Method for forming gaps in micromechanical device and micromechanical device
#41Method for fabricating a microstructure
#42Orientation-dependent etching of deposited AlN for structural use and sacrificial layers in MEMS
#43SILICON ON METAL FOR MEMS DEVICES
#44Method for forming a hermetically sealed cavity
#45Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
#46Electrical conditioning of MEMS device and insulating layer thereof
#47Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch
#48Process for forming microstructures
#49Fabrication of silicon micro-mechanical structures
#50Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#51Method for forming MEMS cavity structure
#52Fabrication of multilayered carbon MEMS devices