84068 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Surface micromachining; Sacrificial layer Sacrificial polymer, ashing of organics
METHOD FOR MANUFACTURING MEMS DEVICE INCLUDING COIL STRUCTURE
#2PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
#3MEMS DEVICE WITH MEMBRANE AND UPRIGHT NANOSTRUCTURES
#4MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM (MEMS)
#6METHODS AND APPARATUS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICES
#7Microfluidic film and method for fabricating the microfluidic film
#8Microfluidic module and method of fabricating the microfluidic module
#9Methods for forming a MEMS device layer on an active device layer and devices formed thereby
#10Capless semiconductor package with a micro-electromechanical system (MEMS)
#11Using sacrificial polymer materials in semiconductor processing
#12Electrically functional polymer microneedle array
#13Process for fabricating a device for detecting electromagnetic radiation having an improved encapsulation structure
#14Using sacrificial polymer materials in semiconductor processing
#15Using sacrificial polymer materials in semiconductor processing
#16PACKAGE SUBSTRATE INTEGRATED DEVICES
#17Methods of achieving universal interfacing using suspended and/or freestanding structures
#18Hermetically sealed MEMS device and its fabrication
#19MEMS double-layer suspension microstructure manufacturing method, and MEMS infrared detector
#20Method of manufacturing a microfluidic device
#21ELECTROOPTICAL DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE
#22Hermetically sealed MEMS device and its fabrication
#23Substrate structure, semiconductor structure and method for fabricating the same
#24Method of encapsulating a microelectronic component
#25Use of metal native oxide to control stress gradient and bending moment of a released MEMS structure
#26Method for Manufacturing Hollow Structure
#27Method for manufacturing thin-film support beam
#28Method for achieving good adhesion between dielectric and organic material
#29Polymer-based microfabricated thermal ground plane
#30Method of making a corrugated deflection diaphragm
#31Method for manufacturing micro-structure
#32Photosensitive sacrificial polymer with low residue
#33Packaging compatible wafer level capping of MEMS devices
#34Semiconductor structure
#35Elimination of silicon residues from MEMS cavity floor
#36Photosensitive sacrificial polymer with low residue
#37METHOD OF MANUFACTURING INERTIAL SENSOR
#38Method for making microchannels on a substrate, and substrate including such microchannels
#39Method for manufacturing micro-structure
#40Polymers, methods of use thereof, and methods of decomposition thereof
#41METHOD FOR THE PRODUCTION OF MICRO/NANOFLUIDIC DEVICES FOR FLOW CONTROL AND RESULTING DEVICE
#42Packaging for micro electro-mechanical systems and methods of fabricating thereof
#43Semiconductor device and method of manufacturing the same
#44Method of creating MEMS device cavities by a non-etching process
#45MEMS device with reduced stress in the membrane and manufacturing method
#46Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
#47Fabrication method for hollow microneedles for drug delivery
#48Manufacturing method of three-dimensional structure
#49Process for Producing Air Gaps in Microstructures, Especially of the Air Gap Interconnect Structure Type for Integrated Circuits
#50Process for producing air gaps in microstructures, especially of the air gap interconnect structure type for integrated circuits
#51Adjustable solubility in sacrificial layers for microfabrication
#52METHOD OF FABRICATING A POLYMER-BASED CAPACITIVE ULTRASONIC TRANSDUCER
#53Sacrificial compositions and methods of fabricating a structure using sacrificial compositions
#54Sacrificial compositions and methods of fabricating a structure using sacrificial compositions
#55METHOD OF REMOVING PHOTORESIST
#56Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
#57Method of fabricating microstructures
#58Forming a sacrificial layer in order to realise a suspended element
#59Electronic devices having air gaps
#60Method of fabricating suspended structure
#61Packaging for micro electro-mechanical systems and methods of fabricating thereof
#62Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch
#63Method of creating MEMS device cavities by a non-etching process
#64Polymers, methods of use thereof, and methods of decomposition thereof
#65Method of fabricating a polymer-based capacitive ultrasonic transducer
#66Micromechanical component and method for production thereof
#67Sacrificial compositions and methods of fabricating a structure using sacrificial compositions
#68Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
#69Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
#70Systems and methods for three-dimensional lithography and nano-indentation
#71Method for integrating micro and nanoparticles into MEMS and apparatus including the same
#72Three-dimensional structure element and method of manufacturing the element, optical switch, and micro device
#73Method for manufacturing MEMS structures
#74Method for removing a sacrificial material with a compressed fluid
#75Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#76Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#77Forming tool for forming a contoured microelectronic spring mold
#78Method for forming MEMS cavity structure
#79Substrate structure, semiconductor structure and method for fabricating the same