ClassID:

84088

B81C2201/0136 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for removing material; Etching; Controlling etch progression by doping limited material regions

Recent Application in this class:
#1
20210202259
2021-07-01

Semiconductor device manufacturing method

#2
20180001582
2018-01-04

Method for creating patterns

#3
20170362082
2017-12-21

Microstructure processing method and microstructure processing apparatus

#4
20170150277
2017-05-25

MEMS microphone having improved sensitivity and method for the production thereof

#5
20160332873
2016-11-17

DEVICES WITH THINNED WAFER

#6
20160332871
2016-11-17

Process for manufacturing a microelectromechanical interaction system for a storage medium

#7
20130062738
2013-03-14

Single crystal silicon membrane with a suspension layer, method for fabricating the same, and a micro-heater

#8
20120264307
2012-10-18

Etching trenches in a substrate

#9
20120126346
2012-05-24

Method for creating a micromechanical membrane structure and MEMS component

#10
20120018779
2012-01-26

Method for producing micromechanical patterns having a relief-like sidewall outline shape or an adjustable angle of inclination

#11
20110250397
2011-10-13

Method of forming an undercut microstructure

#12
20110147864
2011-06-23

Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate

#13
20100029031
2010-02-04

Method of fabricating a MEMS/NEMS electromechanical component

#14
20090176370
2009-07-09

Single SOI wafer accelerometer fabrication process

#15
20090127640
2009-05-21

Micromechanical semiconductor sensor

#16
20090026559
2009-01-29

Boron doped shell for MEMS device

#17
20080233752
2008-09-25

Method for manufacturing floating structure of microelectromechanical system

#18
20080164576
2008-07-10

Process for manufacturing a microelectromechanical interaction system for a storage medium

#19
20080093694
2008-04-24

Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensor

#20
20070137989
2007-06-21

Optical components and production thereof

#21
20070019922
2007-01-25

Support structure for MEMS device and methods therefor

#22
20060141398
2006-06-29

Method of producing semiconductor device

#23
20050181529
2005-08-18

Method for manufacturing a membrane sensor

#24
20050098855
2005-05-12

Semiconductor device and method of producing the same