ClassID:

84089

B81C2201/0138 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for removing material; Etching; Controlling etch progression Monitoring physical parameters in the etching chamber, e.g. pressure, temperature or gas composition

Recent Application in this class:
#1
20230375474
2023-11-23

Methods and systems for transmission and detection of free radicals

#2
20230071505
2023-03-09

Cryogenic atomic layer etch with noble gases

#3
20210398815
2021-12-23

Cryogenic atomic layer etch with noble gases

#4
20210020404
2021-01-21

Methods for tuning plasma potential using variable mode plasma chamber

#5
20200081160
2020-03-12

Method for producing a reflection-reducing layer system

#6
20180247798
2018-08-30

System implementing machine learning in complex multivariate wafer processing equipment

#7
20180082826
2018-03-22

Method and process of implementing machine learning in complex multivariate wafer processing equipment

#8
20180045645
2018-02-15

Methods and systems for transmission and detection of free radicals

#9
20180005854
2018-01-04

Chemical liquid treatment apparatus and chemical liquid treatment method

#10
20170341934
2017-11-30

Selective patterning of titanium encapsulation layers

#11
20170267521
2017-09-21

Selective patterning of an integrated fluxgate device

#12
20160378064
2016-12-29

Silicon-based component with at least one chamfer and its fabrication method

#13
20160376147
2016-12-29

Micromechanical component with a reduced contact surface and its fabrication method

#14
20150200116
2015-07-16

Chemical liquid treatment apparatus and chemical liquid treatment method

#15
20100267242
2010-10-21

Selective etching of semiconductor substrate(s) that preserves underlying dielectric layers

#16
20100203739
2010-08-12

Method for etching a layer on a silicon semiconductor substrate

#17
20090200547
2009-08-13

Trench depth monitor for semiconductor manufacturing

#18
20080318344
2008-12-25

Methods of making a MEMS device by monitoring a process parameter

#19
20080147229
2008-06-19

Method and apparatus for monitoring a microstructure etching process

#20
20080134757
2008-06-12

Method And Apparatus For Monitoring Plasma Conditions In An Etching Plasma Processing Facility

#21
20070134829
2007-06-14

Wet etch processing

#22
20070119814
2007-05-31

APPARATUS AND METHOD FOR DETECTING AN ENDPOINT IN A VAPOR PHASE ETCH

#23
20060211253
2006-09-21

Method and apparatus for monitoring plasma conditions in an etching plasma processing facility

#24
20050070104
2005-03-31

Method and processing system for monitoring status of system components

#25
20050003673
2005-01-06

Thin film resistor etch

#26
16244501
2023-01-10

Enhanced microfabrication using electrochemical techniques