METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

METHODS OF PREPARING METAL SHEETS FOR A DCB / DAB SUBSTRATE BONDING PROCESS

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE

COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION

COPPER-CERAMIC SUBSTRATE

COMPOSITE SHEET AND METHOD FOR PRODUCING SAME, AND MULTILAYER BODY AND METHOD FOR PRODUCING SAME, AND POWER DEVICE

COMPOSITE SHEET, LAMINATE, AND EVALUATION METHOD FOR ESTIMATING ADHESIVENESS OF COMPOSITE SHEET

COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND MANUFACTURING METHOD THEREOF

Joined body, holding device, and electrostatic chuck

Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate

High optical power light conversion device using a phosphor element with solder attachment

COMPOSITE BODY AND LAYERED BODY

Bonded assembly, and ceramic circuit substrate and semiconductor device using the same

COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE

Support substrate and method for producing a support substrate

Process for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate Produced Using Such Method

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND COPPER-GRAPHENE BONDED STRUCTURE

Method for producing a metal-ceramic substrate with electrically conductive vias

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER-CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD

Metal ceramic substrate and method for manufacturing such metal ceramic substrate

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

Copper/ceramic joined body and insulating circuit substrate

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

ELECTRICALLY CONDUCTIVE CERAMIC CONDUCTOR FOR DOWNHOLE APPLICATIONS

BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY

Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method

High optical power light conversion device using a phosphor element with solder attachment

Production method for copper/ceramic joined body, production method for insulated circuit board, copper/ceramic joined body, and insulated circuit board

Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module

Method for manufacturing active metal-brazed nitride ceramic substrate with excellent joining strength

Ceramic sintered body and substrate for semiconductor device

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

Metal-ceramic substrate and method for producing a metal-ceramic substrate

COPPER-CERAMIC COMPOSITE

Ceramic circuit board and module using same

Direct bonded copper ceramic substrate

High optical power light conversion device using a phosphor element with solder attachment

COPPER-CERAMIC SUBSTRATE

Method for producing a metal-ceramic substrate with at least one via

Method for producing a semi-finished metal product, method for producing a metal-ceramic substrate, and metal-ceramic substrate

Copper/ceramic composite

Composite component for horology or jewellery with a ceramic structure and inserts

Composite green sheet and ceramic member

LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

Method for manufacturing ceramic circuit board

Hard PZT ceramic, piezoelectric multilayer component and method for producing a piezoelectric multilayer component

Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board

Ceramic-metal substrate with low amorphous phase

Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board

Ceramic copper circuit board and semiconductor device based on the same

Method of metallizing ferrite ceramics and component comprising a metallized ferrite ceramic

Ceramic circuit substrate and method for producing ceramic circuit substrate

Copper-ceramic bonded body and insulation circuit substrate

Gallium nitride sintered body or gallium nitride molded article, and method for producing same

Copper-ceramic composite

Copper-ceramic composite

Copper-ceramic composite

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

Brazeable Zirconia Ceramics, Methods Of Brazing Zirconia Ceramics, And Brazed Zirconia Ceramics

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate

Producing metal/ceramic circuit board by removing residual silver

Method for producing a composite material

Ceramic metal circuit board and semiconductor device using the same

Substrate structures and methods of manufacture

Method for producing a metal-ceramic substrate

Method for manufacturing substrate for power module with heat sink

Method for producing a metal-ceramic substrate with at least one via

Method of Joining Metal-Ceramic Substrates to Metal Bodies

High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same

Bonded substrate and method for manufacturing bonded substrate

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

Ceramic circuit board and method for producing same

Substrate structures and methods of manufacture

Metal-on-ceramic substrates

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Target material for sputtering and method for manufacturing same

MANUFACTURING METHOD FOR THREE-DIMENSIONAL FORMED OBJECT AND MANUFACTURING APPARATUS FOR THREE-DIMENSIONAL FORMED OBJECT

High optical power light conversion device using a phosphor element with solder attachment

Bonded body, power module substrate, power module and method for producing bonded body

Power-module substrate unit and power module

Process for producing bonded body and process for producing power module substrate

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Ceramic circuit board

Copper-ceramic bonded body and power module substrate

Ceramic wavelength converter having a high reflectivity reflector

Heating module of electronic cigarette atomizer

Substrate structures and methods of manufacture

Method for producing a metal-ceramic substrate

3D infiltration method

Bonded body and power module substrate

Converter-cooling element assembly with metallic solder connection

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

Method for producing ceramic circuit board

Method of producing bonded body and method of producing power module substrate

Ceramic circuit board and electronic device

Oxide sintered body and sputtering target, and method for producing same

Semiconductor module

Li-containing oxide target assembly

Sintered body comprising a plurality of materials and pressure measuring instrument comprising such a sintered body

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

Method for manufacturing power module substrate

Method for manufacturing bonded body and method for manufacturing power-module substrate

Manufacturing method of power-module substrate

Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly

Manufacturing method of power-module substrate

Metal/ceramic bonding substrate and method for producing same

NbO2 sintered compact, sputtering target comprising the sintered compact, and method of producing NbO2 sintered compact

Metal-ceramic substrate and method for producing a metal-ceramic substrate

Ceramic circuit substrate and its production method

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Circuit board and electronic apparatus including the same

Sodium niobate powder, method for producing the same, method for producing ceramic, and piezoelectric element

Ceramic circuit board and electronic device

Power module substrate, power module substrate with heat sink, and power module

Soldering method and method of manufacturing semiconductor device

Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

Metal-ceramic substrate

Zinc oxide sputtering target and method for producing same

Ceramic/copper circuit board and semiconductor device

Joint material, and jointed body

Silicon nitride substrate and method for producing silicon nitride substrate

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

Gallium nitride sintered body or gallium nitride molded article, and method for producing same

Metal base substrate and manufacturing method thereof

Zinc oxide sintered compact, sputtering target, and zinc oxide thin film

Composite insulating layer and manufacturing method thereof

Method for manufacturing sputtering target and method for manufacturing semiconductor device

Method for Selective Metallization on a Ceramic Substrate

Method for producing a layered material

Transparent conductive film

In-Ga-Sn oxide sinter, target, oxide semiconductor film, and semiconductor element

Method of joining metal-ceramic substrates to metal bodies

Silicon nitride substrate, circuit substrate and electronic device using the same

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

Method of manufacturing power module substrate and power module substrate

Transparent laminate structures

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

Composite articles made by process for joining bronze part and silicon carbide ceramic part

Composite articles made by process for joining brass part and silicon carbide ceramic part

Composite articles made by process for joining brass part and silicon carbide ceramic part

Process for joining brass part and silicone carbide ceramics part and composite articles made by same

Ceramic/metal composite structure

Metal-ceramic substrate and method for manufacturing such a substrate

Bonding material, method, and structure

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

Metal-Ceramic Substrate

Y-Doped Barium Strontium Titanate For Stoichiometric Thin Film Growth

METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT

Method for the manufacture of double-sided metalized ceramic substrates

Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material

Sputtering target for oxide thin film and process for producing the sputtering target

Double transition joint for the joining of ceramics to metals

Continuous or discrete metallization layer on a ceramic substrate

INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Hermetic sealing assembly and electrical device including the same

Method for making a piezoceramic device

Optical Contacting Enabled by Thin Film Dielectric Interface

Metal-ceramic substrate

Methods for making millichannel substrate, and cooling device and apparatus using the substrate

Multi-stage enamelled dial

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

Ceramic junction member, ceramic heater and gas sensor

METHOD FOR CONTROLLING AND LIMITING ADHESIVE MIGRATION USING ANTI WETTING AGENT

MODULE INCLUDING A STABLE SOLDER JOINT

Method for the refractory assembly of a carbon material and a copper alloy

Bonded metal and ceramic plates for thermal management of optical and electronic devices

Microheat exchanger for laser diode cooling

Method of producing a material composite

Ceramic metal composite and semiconductor device using the same

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

Method for the production of a metal-ceramic substrate

Package for a semiconductor light emitting device

Ceramic-Copper Foil Bonding Method

Ceramic multilayer component, method for the production thereof, and retaining device

Method for treating nanofiber material and composition of nanofiber material

CERAMIC MULTILAYER COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND RETAINING DEVICE

Power semiconductor module

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

Method for manufacturing a metal-ceramic substrate

Carbon commutator and process for producing the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Composite ceramic body

Sintered power semiconductor substrate and method of producing the substrate

METHOD OF MANUFACTURING HEAT SPREADER MODULE

LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME

Nonreducing dielectric ceramic, and manufacturing method and monolithic ceramic capacitor of the same

Method of manufacturing ceramic/metal composite structure

Joining of dissimilar materials

Method of joining members having different thermal expansion coefficients

Diamond Bonding

Ceramic material and laminated ceramic condenser comprised thereof

Metal-ceramic substrate

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

Method of Bonding Metals to Ceramics

Dielectric particle aggregate comprising a surface layer of zinc titanate, low temperature sinterable dielectric ceramic composition using same

Ceramic material

Dielectric ceramic and monolithic ceramic capacitor

Dielectric ceramic composition and monolithic ceramic capacitor

Apparatus, mold, and method for manufacturing metal-ceramic composite member

Transparent conductive thin film, process for producing the same, sintered target for producing the same, and transparent, electroconductive substrate for display panel, and organic electroluminiscence device

Dielectric ceramic composition and multilayer ceramic capacitor

Piezoceramic device

Oxide porcelain composition, ceramic multilayer substrate, and ceramic electronic component

Method of manufacturing a metal-ceramic circuit board

Dielectric ceramic composition, method of manufacturing the same, and dielectric ceramics and laminated ceramic part using the same

Ceramic multilayer component, method for the production thereof and retaining device

Transparent conductive thin film, process for producing the same, sintered target for producing the same, and transparent, electroconductive substrate for display panel, and organic electroluminescence device

Ceramic powder composition, ceramic material, and laminated ceramic condenser comprised thereof

Piezoelectric component

Game program

Dielectric material and the method of preparing the same

Multi-stage enamelled dial

Method of producing ceramic multilayer substrates, and green composite laminate

Material composite and method of producing the composite

Ceramic composition and ceramic wiring board

Multilayer ceramic capacitor and manufacturing method thereof

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

Low loss glass-ceramic materials, method of making same and electronic packages including same

Glass-ceramic materials and electronic packages including same

Laminated radiation member, power semiconductor apparatus, and method for producing the same

Transparent conductive thin film, process for producing the same, sintered target for producing the same, and transparent, electroconductive substrate for display panel, and organic electroluminescence device

Method of manufacturing multilayer ceramic device

Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same

Molded element that consists of brittle-fracture material

Method of manufacturing a metal-ceramic circuit board

Monolithic ceramic substrate and method for making the same

Composite material, wafer holding member and method for manufacturing the same

Transient eutectic phase process for ceramic-metal bonding metallization and compositing

Method of making ceramic electronic element

Package for a semiconductor light emitting device

Semiconductor device structural body and electronic device