G03F7/0212 - CPC Classification Index

ClassID:

176987 ⎘

G03F7/0212 - CPC Classification

Classification description:

Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor; Photosensitive materials; Diazonium salts or compounds; Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds

Sub-classes:

G03F7/0215 » {Natural gums; Proteins, e.g. gelatins; Macromolecular carbohydrates, e.g. cellulose; Polyvinyl alcohol and derivatives thereof, e.g. polyvinylacetals} 2
G03F7/0217 » {Polyurethanes; Epoxy resins} 9

Recent Application in this class:

20250155803

2025-05-15

CURABLE COMPOSITION, CURED FILM, AND DISPLAY DEVICE

20250123559

2025-04-17

Resist Material And Patterning Process

20250085628

2025-03-13

PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

20210333710

2021-10-28

Photoresist composition, its manufacturing method, and manufacturing methods of metal pattern and array substrate

20200272050

2020-08-27

Enhanced EUV photoresist materials, formulations and processes

20200064736

2020-02-27

Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition

20180079864

2018-03-22

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

20170329220

2017-11-16

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE