207000 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning; Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
Removal chemistry for selectively etching metal hard mask
#602METHOD FOR PROTECTING SEMICONDUCTOR WAFER AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#603METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#604METHODS FOR PARTICLE REMOVAL DURING INTEGRATED CIRCUIT DEVICE FABRICATION
#605METHOD FOR REMOVING NATIVE OXIDE REMAINING ON A SURFACE OF A SEMICONDUCTOR DEVICE DURING MANUFACTURING
#606METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE
#607Method for fabricating metal interconnection of semiconductor device
#608LIQUID CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES
#609Wet clean compositions for CoWP and porous dielectrics
#610Cleaning solution for semiconductor device or display device, and cleaning method
#611Methods and apparatus for cleaning semiconductor wafers
#612Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device
#613METHOD FOR REMOVING ETCHING RESIDUES FROM SEMICONDUCTOR COMPONENTS
#614WET CLEAN METHOD FOR SEMICONDUCTOR DEVICE FABRICATION PROCESSES
#615METHOD FOR REMOVING ETCHING RESIDUES FROM SEMICONDUCTOR COMPONENTS
#616METHOD FOR MANUFACTURING IMAGE SENSOR
#617Integrated process for thin film resistors with silicides
#618Etching solution
#619METHOD OF FORMING METAL WIRING OF SEMICONDUCTOR DEVICE
#620Methods for removing a metal oxide from a substrate
#621APPARATUS FOR IN-SITU SUBSTRATE PROCESSING
#622SUBSTRATE MOUNTING TABLE, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TREATING SURFACE OF SUBSTRATE MOUNTING TABLE
#623Electroless deposition process on a silicon contact
#624COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS
#625CLEANING SOLUTION AND SEMICONDCUTOR PROCESS USING THE SAME
#626Semiconductor device and method for manufacturing the same
#627SEMICONDUCTOR DEVICE CLEANING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
#628GENERATION AND DISTRIBUTION OF A FLUORINE GAS
#629Method and apparatus for manufacturing semiconductor integrated circuit device
#630LIQUID CLEANING COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR DEVICES
#631Method for forming cobalt tungsten cap layers
#632Method for forming cobalt nitride cap layers
#633METHOD FOR FORMING RUTHENIUM METAL CAP LAYERS
#634Integration of ALD tantalum nitride for copper metallization
#635Semiconductor device and fabrication method thereof
#636Method of manufacturing semiconductor device and cleaning apparatus
#637Compositions for processing of semiconductor substrates
#638Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process
#639Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
#640Substrate processing method and substrate processing apparatus
#641METHOD OF FORMING METAL LINE OF INDUCTOR
#642Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#643METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND STORAGE MEDIUM
#644Cleaning composition and process for producing semiconductor device
#645METHOD FOR FABRICATING CMOS IMAGE SENSOR
#646Apparatus for removing material from one or more substrates
#647CLEANING COMPOSITIONS WITH VERY LOW DIELECTRIC ETCH RATES
#648Materials and systems for advanced substrate cleaning
#649Integrated circuit hard mask processing system
#650SEMICONDUCTOR DEVICE HAVING CONTACT PLUG FORMED IN DOUBLE STRUCTURE BY USING EPITAXIAL STACK AND METAL LAYER AND METHOD FOR FABRICATING THE SAME
#651Polishing of small composite semiconductor materials
#652Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device
#653Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed
#654Semiconductor device
#655Contact clean by remote plasma and repair of silicide surface
#656METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE
#657FORMULATIONS FOR REMOVING COOPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES
#658Method for clearing native oxide
#659METHOD FOR REDUCING METAL IRREGULARITIES IN ADVANCED METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES
#660Substrate Processing Method and Storage Medium
#661SEMICONDUCTOR DEVICE FABRICATION METHOD
#662Cleaning composition comprising a chelant and quaternary ammonium hydroxide mixture
#663Semiconductor device and method for fabricating the same
#664Plasma treatment method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
#665Thermal annealing method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
#666Display device with touch panel
#667POST-CONTACT OPENING ETCHANTS FOR POST-CONTACT ETCH CLEANS AND METHODS FOR FABRICATING THE SAME
#668Removing agent composition and removing/cleaning method using same
#669PHOTORESIST AND ANTIREFLECTIVE LAYER REMOVAL SOLUTION AND METHOD THEREOF
#670Semiconductor device and method for manufacturing the same
#671METHOD OF DIELECTRIC FILM TREATMENT
#672Method of cleaning and process for producing semiconductor device
#673REMOVAL OF PARTICLE CONTAMINATION ON PATTERNED SILICON/SILICON DIOXIDE USING DENSE FLUID/CHEMICAL FORMULATIONS
#674Oxidizing aqueous cleaner for the removal of post-etch residues
#675Method of post etch polymer residue removal
#676Interconnect structure containing non-damaged dielectric and a via gouging feature
#677SUBSTRATE PROCESSING METHOD AND APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND STORAGE MEDIUM
#678Method for manufacturing semiconductor device
#679Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture
#680High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
#681DENSE FLUID COMPOSITIONS FOR REMOVAL OF HARDENED PHOTORESIST, POST-ETCH RESIDUE AND/OR BOTTOM ANTI-REFLECTIVE COATING
#682PROCESS WITH SATURATION AT LOW ETCH AMOUNT FOR HIGH CONTACT BOTTOM CLEANING EFFICIENCY FOR CHEMICAL DRY CLEAN PROCESS
#683Substrate processing method and system
#684Method of forming bonding pad opening
#685Oxidation-free copper metallization process using in-situ baking
#686Substrate processing method, substrate processing apparatus and recording medium
#687Method for manufacturing a semiconductor device
#688Etch residue reduction by ash methodology
#689METHOD FOR FORMING METAL LINE IN SEMICONDUCTOR DEVICE
#690METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#691Cleaning method following opening etch
#692Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device
#693METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#694METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS
#695Compositions for Removal of Metal Hard Mask Etching Residues from a Semiconductor Substrate
#696CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE
#697Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant
#698Ammonia-based plasma treatment for metal fill in narrow features
#699Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
#700Composition for removing photoresist layer and method for using it
#701Aqueous fluoride compositions for cleaning semiconductor devices
#702METHOD OF SUBSTRATE TREATMENT, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE TREATING APPARATUS, AND RECORDING MEDIUM
#703METHOD OF MINIMIZING VIA SIDEWALL DAMAGES DURING DUAL DAMASCENE TRENCH REACTIVE ION ETCHING IN A VIA FIRST SCHEME
#704METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#705Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium
#706Methods to mitigate plasma damage in organosilicate dielectrics
#707Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom
#708METHOD OF FORMING ELECTRICAL CONNECTION STRUCTURE
#709Enhanced stripping of low-K films using downstream gas mixing
#710Semiconductor device having silicon carbide and conductive pathway interface
#711COPPER RE-DEPOSITION PREVENTING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE PROCESSING APPARATUS
#712METHOD OF CLEANING A SEMICONDUCTOR SUBSTRATE
#713Semiconductor device manufacturing method and target substrate processing system
#714Surface contamination analyzer for semiconductor wafers
#715Methods for forming ultra thin structures on a substrate
#716Method of manufacturing semiconductor device
#717Cleaning process for microelectronic dielectric and metal structures
#718SEMICONDUCTOR DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SAME
#719Methods for coating a substrate with an amphiphilic compound
#720Method of manufacturing semiconductor device
#721Method of fabricating a semiconductor device
#722Oxidant and passivant composition and method for use in treating a microelectronic structure
#723PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS
#724GENERATION AND DISTRIBUTION OF A FLUORINE GAS
#725SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
#726Composition for etching a metal hard mask material in semiconductor processing
#727Photoresist residue remover composition and semiconductor circuit element production process employing the same
#728METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#729Method and apparatus for manufacturing semiconductor device, and storage medium
#730Method for fabricating low-k dielectric and Cu interconnect
#731Pore sealing and cleaning porous low dielectric constant structures
#732Method for recovering damage of low dielectric insulating film for manufacturing semiconductor device
#733Substrate processing apparatus, substrate processing method and storage medium
#734Resist removing method and resist removing apparatus
#735Method for fabricating an inductor structure or a dual damascene structure
#736Integrated circuit manufacturing method using hard mask
#737Hydrogen ashing enhanced with water vapor and diluent gas
#738APPARATUS AND METHOD FOR PRE AND POST TREATMENT OF ATOMIC LAYER DEPOSITION
#739Method of controlled low-k via etch for Cu interconnections
#740Method for etching organic hardmasks
#741METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
#742Methods for stripping photoresist and/or cleaning metal regions
#743Chemistry for removal of photo resist, organic sacrificial fill material and etch polymer
#744SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#745Use of dilute hydrochloric acid in advanced interconnect contact clean in nickel semiconductor technologies
#746Dual damascene process
#747Chemical oxide removal of plasma damaged SiCOH low k dielectrics
#748Manufacturing method for semiconductor device
#749Wafer Cleaning After Via-Etching
#750METHOD OF MAKING HIGH-ASPECT RATIO CONTACT HOLE
#751METHODS OF FORMING TRANSISTOR CONTACTS AND VIA OPENINGS
#752Wet cleaning process and method for fabricating semiconductor device using the same
#753High yield plasma etch process for interlayer dielectrics
#754Method to remove beol sacrificial materials and chemical residues by irradiation
#755Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
#756Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
#757Process for wafer backside polymer removal and wafer front side photoresist removal
#758PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH WAFER FRONT SIDE GAS PURGE
#759Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution
#760METHOD FOR FORMING CONTACT HOLE
#761Manufacturing method of semiconductor device
#762SEMICONDUCTOR DEVICE AND METHOD OF FORMING METAL PAD OF SEMICONDUCTOR DEVICE
#763REMOVAL OF ETCHING PROCESS RESIDUAL IN SEMICONDUCTOR FABRICATION
#764Method of producing semiconductor device
#765Two step process for post ash cleaning for Cu/low-k dual damascene structure with metal hard mask
#766TWO STEP PROCESS FOR POST ASH CLEANING FOR CU/LOW-K DUAL DAMASCENE STRUCTURE WITH METAL HARD MASK
#767METHOD FOR FABRICATING A MICROELECTRONIC CONDUCTOR STRUCTURE
#768METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#769Method for forming self aligned contacts for integrated circuit devices
#770Soluble hard mask for interlayer dielectric patterning
#771METHOD FOR PREPARING A METAL FEATURE SURFACE
#772Method for Manufacturing Semiconductor Device
#773METHOD OF PROCESSING SUBSTRATE AND CHEMICAL USED IN THE SAME
#774Semiconductor manufacturing process
#775METHOD OF PROCESSING SUBSTRATE AND CHEMICAL USED IN THE SAME
#776Method for selective removal of damaged multi-stack bilayer films
#777Two step etching of a bottom anti-reflective coating layer in dual damascene application
#778SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#779Method and apparatus for ashing a substrate using carbon dioxide
#780Method for fabricating a dual damascene structure
#781Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device
#782Cleaning processes in the formation of integrated circuit interconnect structures
#783Method of cleaning wafer after etching process
#784Processing apparatus and processing method
#785Method for forming a roughened contact in a semiconductor device
#786By-product collecting processes for cleaning processes
#787METHOD OF INTEGRATED SUBSTRATED PROCESSING USING A HOT FILAMENT HYDROGEN RADICAL SOUCE
#788Arc layer having a reduced flaking tendency and a method of manufacturing the same
#789Pre-cleaning tool and semiconductor processing apparatus using the same
#790PROCESSING SYSTEM CONTAINING A HOT FILAMENT HYDROGEN RADICAL SOURCE FOR INTEGRATED SUBSTRATE PROCESSING
#791Copper passivating post-chemical mechanical polishing cleaning composition and method of use
#792METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM
#793Separation-material composition for photo-resist and manufacturing method of semiconductor device
#794Processing apparatus and processing method
#795Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layers
#796WORKPIECE PROCESSING WITH PREHEAT
#797Method for using a modified post-etch clean rinsing agent
#798Apparatus for manufacturing a semiconductor device
#799SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#800Reduction of punch-thru defects in damascene processing
#801MEHTOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#802Method for barrier interface preparation of copper interconnect
#803Cleaning compositions for microelectronic substrates
#804Substrate Processing Method and Apparatus
#805Substrate processing method, substrate processing system and storage medium
#806SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#807Method for manufacturing semiconductor device
#808Method for Fabricating A Semiconductor Device Comprising Surface Cleaning
#809Device for Treating Object and Process Therefor
#810METHOD OF FABRICATING SEMICONDUCTOR DEVICE
#811Method of forming inductor in semiconductor device
#812Integrated process for thin film resistors with silicides
#813Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture
#814Resist, barc and gap fill material stripping chemical and method
#815Cleaning formulation for removing residues on surfaces
#816Method for forming contact plug in semiconductor device
#817Method for manufacturing semiconductor device free from layer-lifting between insulating layers
#818Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
#819Processes and systems for engineering a copper surface for selective metal deposition
#820Processes and systems for engineering a barrier surface for copper deposition
#821Substrate Processing Apparatus
#822Preventing damage to low-k materials during resist stripping
#823Method of processing metal surface in dual damascene manufacturing
#824Fabrication method of semiconductor integrated circuit device
#825METHODS AND APPARATUS FOR E-BEAM TREATMENT USED TO FABRICATE INTEGRATED CIRCUIT DEVICES
#826Method for manufacturing semiconductor device
#827Method of manufacturing semiconductor device
#828System and method for removal of photoresist and stop layer following contact dielectric etch
#829Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects
#830Method and apparatus for copper corrosion prevention during wet clean
#831Method for forming Ti film and TiN film, contact structure, computer readable storing medium and computer program
#832Protective layer for a low k dielectric film and methods of forming the same
#833Cleaning porous low-k material in the formation of an interconnect structure
#834Chemical oxide removal of plasma damaged SiCOH low k dielectrics
#835Method for forming dual damascenes with supercritical fluid treatments
#836METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A SILICON OXYNITRIDE FILM
#837Sequential oxide removal using fluorine and hydrogen
#838Method and system for patterning a dielectric film
#839Composition for etching a metal hard mask material in semiconductor processing
#840Method for removing damaged dielectric material
#841Microelectronic cleaning compositions containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
#842Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device
#843Method of manufacturing a semiconductor element
#844Semiconductor device and manufacturing method of the same
#845Processing Liquid and Processing Method for Semiconductor Device, and Semiconductor Manufacturing Apparatus
#846Cleaning solution for substrate for use in semiconductor device and cleaning method using the same
#847Substrate processing method and apparatus fabrication process of a semiconductor device
#848Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same
#849Method for removing polymer from wafer and method for removing polymer in interconnect process
#850Cleaning compositions and methods of use thereof
#851Apparatus and methods for selective removal of material from wafer alignment marks
#852Structure and method for metal integration
#853Integration scheme for Cu/low-k interconnects
#854Process for forming cobalt-containing materials
#855Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing
#856REMOVAL OF SILICA BASED ETCH RESIDUE USING AQUEOUS CHEMISTRY
#857Device and method to eliminate shorting induced by via to metal misalignment
#858Method to restore hydrophobicity in dielectric films and materials
#859Water vapor passivation of a wall facing a plasma
#860Method of fabricating semiconductor memory device and semiconductor memory device driver
#861Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing
#862Method of removing residue left after plasma process
#863Method for removing residue containing an embedded metal
#864Cleaning solution and cleaning method of a semiconductor device
#865Cleaning formulations
#866Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same
#867Semiconductor manufacturing method for removing residue generated by dry etching
#868Method of manufacturing semiconductor device and cleaning apparatus
#869Methods and apparatus for in-situ substrate processing
#870Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution
#871Method of manufacturing a semiconductor device and method of etching an insulating film
#872Planarization with reduced dishing
#873Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same
#874pH buffered aqueous cleaning composition and method for removing photoresist residue
#875Process for removing material from substrates
#876Aqueous solution for removing post-etch residue
#877Semiconductor Device and Method of Manufacturing the Same
#878Method of manufacturing a semiconductor device
#879METHOD AND APPARATUS FOR DEPOSITING COPPER WIRING
#880Selective removal of sacrificial light absorbing material over porous dielectric
#881Method for forming contact hole in semiconductor device
#882Method for fabricating semiconductor device
#883Contact structure of semiconductor device and method for fabricating the same
#884METHOD OF FABRICATING A METAL LINE IN A SEMICONDUCTOR DEVICE
#885Manufacture method for semiconductor device using damascene method
#886WAFERLESS AUTOMATIC CLEANING AFTER BARRIER REMOVAL
#887Manufacturing method of semiconductor wafer having a trench structure and epitaxial layer
#888METHOD FOR FORMING FEATURE DEFINITIONS
#889METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE
#890Method for manufacturing semiconductor silicon substrate and apparatus for manufacturing the same
#891Remote plasma pre-clean with low hydrogen pressure
#892Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
#893Apparatus and a method for cleaning a dielectric film
#894Method of cleaning semiconductor substrate conductive layer surface
#895INTEGRATED ELECTROLESS DEPOSITION SYSTEM
#896Reducing damage to ulk dielectric during cross-linked polymer removal
#897METHOD OF SELECTIVELY DEPOSITING A THIN FILM MATERIAL AT A SEMICONDUCTOR INTERFACE
#898Method of manufacturing semiconductor device
#899Composition and method for selectively removing native oxide from silicon-containing surfaces
#900Semiconductor device and method of manufacturing the same