207000 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning; Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
PURGE PROCESS AFTER DRY ETCHING
#902Semiconductor device fabrication method
#903SOLVENT REMOVAL OF PHOTORESIST MASK AND GOLD IMPREGNATED RESIDUE AND PROCESS
#904HIGH-ASPECT RATIO CONTACT HOLE AND METHOD OF MAKING THE SAME
#905Aqueous cleaning composition and method for using same
#906System and method of cleaning substrates using a subambient process solution
#907Semiconductor device manufacturing method and chemical fluid used for manufacturing semiconductor device
#908Method of etching carbon-containing layer and method of fabricating semiconductor device
#909Method for forming metal wiring structure
#910Method for foming metal wiring structure
#911Treatment of low dielectric constant films using a batch processing system
#912Plural treatment step process for treating dielectric films
#913Method of removing organic contaminants from a semiconductor surface
#914Substrate processing method
#915Method of forming metal wiring in semiconductor device
#916Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system
#917Unsaturated dicarboxylic acid and ethylene urea containing formulation for cleaning semiconductor and cleaning method
#918Apparatus for the removal of a metal oxide from a substrate and methods therefor
#919Method of cleaning semiconductor surfaces
#920Plasma ashing method
#921Post-etch removal of fluorocarbon-based residues from a hybrid dielectric structure
#922Removal of post etch residues and copper contamination from low-K dielectrics using supercritical CO2 with diketone additives
#923Wafer cleaning process
#924Semiconductor device fabrication method
#925Resist removing method and resist removing apparatus
#926METHOD OF STRIPPING PHOTORESIST
#927Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
#928Metal interconnect structure and method
#929Damage-free ashing process and system for post low-k etch
#930Method of forming metal line on semiconductor device
#931METHOD OF FABRICATING A DUAL DAMASCENE INTERCONNECT STRUCTURE
#932Prevention of trench photoresist scum
#933Contact clean by remote plasma and repair of silicide surface
#934Method for forming storage node contact in semiconductor device using nitride-based hard mask
#935Manufacturing method of semiconductor device
#936Method for removing material from semiconductor wafer and apparatus for performing the same
#937Composition for removal of residue comprising cationic salts and methods using same
#938Removing agent composition and removing/cleaning method using same
#939Method of forming metal line in semiconductor device
#940Method of patterning a porous dielectric material
#941Method for forming contact hole in semiconductor device
#942Method of cleaning semiconductor surfaces
#943Integration flow to prevent delamination from copper
#944Manufacturing method of semiconductor integrated circuit device
#945Method for forming via-hole in semiconductor device
#946Cleaning solution and cleaning method of a semiconductor device
#947Electroless deposition process on a silicon contact
#948Method to address carbon incorporation in an interpoly oxide
#949Methods of etching oxide, reducing roughness, and forming capacitor constructions
#950Method of manufacturing semiconductor device
#951Method for resist strip in presence of regular low k and/or porous low k dielectric materials
#952Selective removal chemistries for semiconductor applications, methods of production and uses thereof
#953Method for removing post-etch residue from wafer surface
#954Electroless deposition processes and compositions for forming interconnects
#955In-situ silicidation metallization process
#956Contact metallization scheme using a barrier layer over a silicide layer
#957Integrated dual damascene clean apparatus and process
#958METHOD FOR FABRICATING A DUAL DAMASCENE AND POLYMER REMOVAL
#959Electroless deposition process on a silicide contact
#960Method for forming contact of semiconductor device by using solid phase epitaxy process
#961Semiconductor device having contact plug formed in double structure by using epitaxial stack and metal layer and method for fabricating the same
#962Semiconductor device using solid phase epitaxy and method for fabricating the same
#963Polymer remover
#964Composition for cleaning semiconductor device and method for cleaning semiconductor device using the same
#965Method and system for removing an oxide from a substrate
#966Method of manufacturing semiconductor device
#967Method of treating a composite spin-on glass/anti-reflective material prior to cleaning
#968Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance
#969Plasma pre-treating surfaces for atomic layer deposition
#970Method for manufacturing semiconductor device to form a via hole
#971Compositions substrate for removing etching residue and use thereof
#972Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material
#973Method of in-situ ash strip to eliminate memory effect and reduce wafer damage
#974Semiconductor device and a method of manufacturing the same
#975Plasma processing method and apparatus
#976Plasma processing method and apparatus, and method for measuring a density of fluorine in plasma
#977Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods
#978Method of processing substrate, and method of and program for manufacturing electronic device
#979Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed
#980Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
#981Post etch copper cleaning using dry plasma
#982Remover solution
#983Integrated process for thin film resistors with silicides
#984Contact structure formed using supercritical cleaning fluid and ALCVD
#985Substrate processing method and substrate processing apparatus
#986Plasmaless dry contact cleaning method using interhalogen compounds
#987Method for cleaning substrate surface
#988Stripping and cleaning compositions for microelectronics
#989Low-pressure removal of photoresist and etch residue
#990Method of manufacturing a semiconductor device and an apparatus for use in such a method
#991Method of fabricating semiconductor device
#992Integration of ALD tantalum nitride for copper metallization
#993METHOD FOR FABRICATING A DUAL DAMASCENE AND POLYMER REMOVAL
#994Method of manufacturing a semiconductor device
#995Low-pressure removal of photoresist and etch residue
#996Method of degasification in semiconductor cleaning
#997Method of manufacturing a semiconductor device
#998Method of forming electrical connections in a semiconductor structure
#999Removing solution
#1000Cleaning apparatus and method for electronic device
#1001Method for manufacturing semiconductor device
#1002Method of removing etch residues
#1003Method for removing photoresist layer and method for forming metal line in semiconductor device using the same
#1004Compositions and methods for high-efficiency cleaning of semiconductor wafers
#1005Planarization with reduced dishing
#1006Etching composition and use thereof with feedback control of HF in BEOL clean
#1007Compositions and processes for photoresist stripping and residue removal in wafer level packaging
#1008Method and system for metal barrier and seed integration
#1009Method for selective plasma etch of an oxide layer
#1010Via reactive ion etching process
#1011METHOD FOR TREATING A SUBSTRATE WITH A HIGH PRESSURE FLUID USING A PREOXIDE-BASED PROCESS CHEMISTRY
#1012Method for removing a residue from a substrate using supercritical carbon dioxide processing
#1013Post-etch treatment to remove residues
#1014De-fluorination after via etch to preserve passivation
#1015Non-corrosive cleaning composition for removing plasma etching residues
#1016Compositions and processes for photoresist stripping and residue removal in wafer level packaging
#1017Solution and method for removing ashing residue in Cu/low-k multilevel interconnection structure
#1018Method for removing polymer as etching residue
#1019Method of forming an element isolation film of a semiconductor device
#1020Copper processing using an ozone-solvent solution
#1021Dense fluid compositions and processes using same for article treatment and residue removal
#1022Method to restore hydrophobicity in dielectric films and materials
#1023Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
#1024Using ozone to process wafer like objects
#1025Method for etch-stop layer etching during damascene dielectric etching with low polymerization
#1026Method to address carbon incorporation in an interpoly oxide
#1027Method for photoresist stripping and treatment of low-k dielectric material
#1028Method for cleaning semiconductor device having dual damascene structure
#1029Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs
#1030Etchant composition and the use thereof
#1031Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
#1032Method for manufacturing a semiconductor device
#1033Methods of downstream microwave photoresist removal and via clean, particularly following Stop-On TiN etching
#1034Method of forming contact hole
#1035Cleaning submicron structures on a semiconductor wafer surface
#1036Cleaning liquid and cleaning method
#1037Encapsulation of post-etch halogenic residue
#1038Methods of processing substrates during semiconductor manufacturing processes
#1039Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer
#1040Removal of particle contamination on a patterned silicon/silicon dioxide using dense fluid/chemical formulations
#1041Method for manufacturing a semiconductor device
#1042Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
#1043Composition for removing photoresist and/or etching residue from a substrate and use thereof
#1044Composition for stripping and cleaning and use thereof
#1045Method for post-treatment of semi-finished product after dry etching process
#1046Novel barrier integration scheme for high-reliability vias
#1047Semiconductor device and fabrication method thereof
#1048Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization
#1049Method of manufacturing electronic device
#1050Forming a passivating aluminum fluoride layer and removing same for use in semiconductor manufacture
#1051Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
#1052Semiconductor device and method for fabricating a semicondutor device including first and second hydrogen diffusion preventing films
#1053Method of manufacturing electronic device
#1054Wafer clean process
#1055Method for forming contact plug of semiconductor device
#1056Remover compositions for dual damascene system
#1057Formation of low resistance via contacts in interconnect structures
#1058Semiconductor device having silicon carbide and conductive pathway interface
#1059Device and method to eliminate shorting induced by via to metal misalignment
#1060Etching and cleaning methods and etching and cleaning apparatuses used therefor
#1061Reducing oxide loss when using fluoride chemistries to remove post-etch residues in semiconductor processing
#1062Passivation for cleaning a material
#1063Process for removing organic materials during formation of a metal interconnect
#1064Method for forming contact plug of semiconductor device
#1065Method for manufacturing a complementary metal-oxide semiconductor sensor
#1066Substrate processing apparatus and substrate processing method
#1067Microelectronic cleaning compositions containing oxidizers and organic solvents
#1068Trench photolithography rework for removal of photoresist residue
#1069TWO-STEP STRIPPING METHOD FOR REMOVING VIA PHOTORESIST DURING THE FABRICATION OF PARTIAL-VIA DUAL DAMASCENE FEATURES
#1070Deposit removing apparatus and deposit removing method
#1071Cleaning solution and manufacturing method for semiconductor device
#1072Waferless automatic cleaning after barrier removal
#1073Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects
#1074Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device
#1075Method for cleaning the surface of a substrate
#1076Ionic fluid in supercritical fluid for semiconductor processing
#1077Fluid assisted cryogenic cleaning
#1078Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#1079Method and system for treating a dielectric film
#1080Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
#1081Photoresist residue remover composition and semiconductor circuit element production process employing the same
#1082Compositions for cleaning organic and plasma etched residues for semiconductor devices
#1083Method for ashing
#1084System and method for removal of photoresist and residues following contact etch with a stop layer present
#1085Treatment of a dielectric layer using supercritical CO
#1086Using supercritical fluids and/or dense fluids in semiconductor applications
#1087Method for manufacturing semiconductor device
#1088Process and apparatus for removing residues from semiconductor substrates
#1089Method to form a contact hole
#1090Method of forming interconnection lines for semiconductor device
#1091Method of manufacturing semiconductor device
#1092Solvent free photoresist strip and residue removal processing for post etching of low-k films
#1093Method for removing mottled etch in semiconductor fabricating process
#1094Processing apparatus and processing method
#1095Cleaning solutions and etchants and methods for using same
#1096Method for forming a contact in semiconductor device
#1097Fabrication method of semiconductor integrated circuit device
#1098Cleaning solution and method of cleaning a semiconductor device using the same
#1099Method for fabricating semiconductor device without damaging hard mask during contact formation process
#1100Wet cleaning method to eliminate copper corrosion
#1101Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
#1102Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
#1103Semiconductor device and method of manufacturing the same
#1104Apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system
#1105Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#1106Method for fabricating semiconductor device
#1107Method for removing photoresist
#1108Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#1109Manufacturing method of semiconductor device
#1110System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing
#1111Method for fabricating semiconductor device
#1112Removal of post etch residues and copper contamination from low-k dielectrics using supercritical CO2 with diketone additives
#1113Method of preventing photoresist residues
#1114Method of in-situ damage removal - post O2 dry process
#1115Integration of ALD tantalum nitride for copper metallization
#1116Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
#1117Method to improve post wafer etch cleaning process
#1118Post plasma clean process for a hardmask
#1119Method for fabricating semiconductor device with fine patterns
#1120Fabrication method of semiconductor integrated circuit device
#1121Method of fabricating copper metallization on backside of gallium arsenide devices
#1122Method of forming a low K dielectric in a semiconductor manufacturing process
#1123Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing
#1124Method for treating a dielectric film
#1125Method of cleaning semiconductor surfaces
#1126Semiconductor integrated circuit device and manufacturing method thereof
#1127Formation of low resistance via contacts in interconnect structures
#1128Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs
#1129Method of processing substrate and chemical used in the same
#1130Method of fabricating a dual damascene interconnect structure
#1131Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization
#1132Detergent composition
#1133Interconnect process and method for removing metal silicide
#1134[CLEANING METHOD USED IN INTERCONNECT PROCESS]
#1135Semiconductor device including a capacitor having improved structural stability and enhanced capacitance, and method of manufacturing the semiconductor device
#1136Rinse solution and methods for forming and cleaning a semiconductor device
#1137Use of silyating agents
#1138Method and apparatus for manufacturing semiconductor devices
#1139Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing
#1140Method for forming flowable dielectric layer in semiconductor device
#1141Aqueous fluoride compositions for cleaning semiconductor devices
#1142Method for cleaning substrate surface
#1143Micellar technology for post-etch residues
#1144Methods of removing resistive remnants from contact holes using silicidation
#1145Method of fabricating semiconductor memory device and semiconductor memory device driver
#1146Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#1147Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
#1148Integration of materials removal and surface treatment in semiconductor device fabrication
#1149Method for removing damaged layer embedded in a dielectric layer
#1150Semiconductor structure and manufacturing method thereof
#1151Manufacturing method of semiconductor structure
#1152Semiconductor device
#1153Method of cleaning post-etch residues on a copper line
#1154Via and chamfer control for advanced interconnects
#1155Polysilicon residue removal in nanosheet MOSFETs
#1156Self-sufficient chip with photovoltaic power supply on back of wafer
#1157Fabricating method of fin field effect transistor (FinFET)
#1158Method of forming memory cell film
#1159Method of preventing trench distortion
#1160Semiconductor device and fabrication method thereof
#1161Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch
#1162Directional pre-clean in silicide and contact formation
#1163Semiconductor device and method of fabricating the same