207503 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Dual damascene wiring and method
#1502Top layers of metal for high performance IC's
#1503Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#1504Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#1505Method of manufacturing semiconductor integrated circuit device having polymetal gate electrode
#1506Processing for overcoming extreme topography
#1507Method of forming wiring pattern
#1508Semiconductor device and a method of manufacturing the semiconductor device
#1509Method and system for providing a thin film with a controlled crystal orientation using pulsed laser induced melting and nucleation-initiated crystallization
#1510Hermetic low dielectric constant layer for barrier applications
#1511Method of manufacturing electronic device
#1512Method of fabricating thin film transistor using metal induced lateral crystallization by etch-stopper layer patterns
#1513Nano-structure and method of fabricating nano-structures
#1514Nitride and polysilicon interface with titanium layer
#1515Semiconductor device having a metal wiring structure
#1516Method for forming metal line in semiconductor memory device having word line strapping structure
#1517Manufacturing method of nanowire array
#1518Interconnect junction providing reduced current crowding and method of manufacturing same
#1519Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks
#1520Conductive material patterning methods
#1521Method of making a semiconductor device having improved contacts
#1522Method of making a semiconductor device having improved contacts
#1523Methods of making electromechanical three-trace junction devices
#1524Removal of metal oxidation
#1525Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits
#1526Semiconductor device with scattering bars adjacent conductive lines
#1527Method to form a conductive structure
#1528Manufacturing method of wiring substrate and semiconductor device
#1529Novel semiconductor device design
#1530Crosspoint structure semiconductor memory device, and manufacturing method thereof
#1531Transistor having soluble layers
#1532Reduction of spontaneous metal whisker formation
#1533Method suitable for batch ion etching of copper
#1534Method of pitch dimension shrinkage
#1535Method for depositing and etching ruthenium layers
#1536Method of making photolithographically-patterned out-of-plane coil structures
#1537Semiconductor device
#1538Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#1539Semiconductor device and method capable of scribing chips with high yield
#1540Semiconductor device and fabrication method thereof
#1541Method of patterning a film
#1542Semiconductor device and method of manufacturing the same
#1543Top layers of metal for high performance IC's
#1544Multiple stage electroless deposition of a metal layer
#1545Method for pattern metalization of substrates
#1546Chip structure and process for forming the same
#1547Integrated circuitry
#1548Top layers of metal for high performance IC's
#1549Method of manufacturing semiconductor device
#1550Multiple stage electroless deposition of a metal layer
#1551Semiconductor device and method for fabricating the same
#1552Manufacturing apparatus of semiconductor device and pattern-forming method
#1553Sputtering target, Al wiring film and electronic component
#1554Apparatus and a method for forming an alloy layer over a substrate
#1555Selective dry etching of tantalum and tantalum nitride
#1556Method for preventing Cu contamination and oxidation in semiconductor device manufacturing
#1557Fabrication method of semiconductor integrated circuit device
#1558Superlattice nanopatterning of wires and complex patterns
#1559Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
#1560Semiconductor device having a dummy conductive via and a method of manufacture therefor
#1561Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
#1562Transistor constructions and electronic devices
#1563Memory device having shielded access lines
#1564Integrated circuit devices including a capacitor
#1565Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece
#1566Method for BARC over-etch time adjust with real-time process feedback
#1567Method for forming pattern using printing method
#1568Top layers of metal for high performance IC's
#1569Semiconductor device and method for manufacturing the same
#1570Method of forming suspended transmission line structures in back end of line processing
#1571Pattern formation substrate and method for pattern formation
#1572Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer
#1573Process for producing a multilayer arrangement having a metal layer
#1574Method for conductive film quality evaluation
#1575Metal nanoline process and applications on growth of aligned nanostructure thereof
#1576Adhesion of a metal layer to a substrate by utilizing an organic acid material
#1577Method of making a tantalum layer and apparatus using a tantalum layer
#1578Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
#1579Three-level unitary interconnect structure
#1580Wiring substrate and method using the same
#1581Forming self-aligned nano-electrodes
#1582Anisotropic dry etching of Cu-containing layers
#1583Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure
#1584Method to fabricate high reliable metal capacitor within copper back-end process
#1585Back end IC wiring with improved electro-migration resistance
#1586Liquid discharge head
#1587Fabrication and use of superlattice
#1588Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
#1589Process for producing integrated circuits including reduction using gaseous organic compounds
#1590Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
#1591Pattern formation method
#1592Method for forming film pattern, method for manufacturing semiconductor device, liquid crystal television, and EL television
#1593Semiconductor device having a multilayer interconnection structure and fabrication method thereof
#1594Semiconductor device comprising metal insulator metal (MIM) capacitor
#1595Conductive lines buried in insulating areas
#1596Top layers of metal for high performance IC's
#1597Method for pattern metalization of substrates
#1598Microelectronic device fabricating method, integrated circuit, and intermediate construction
#1599Top layers of metal for high performance IC's
#1600Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices
#1601Shields usable with an inductively coupled plasma reactor
#1602Method of manufacturing semiconductor device
#1603Nanotube films and articles
#1604Capacitor and semiconductor device having a ferroelectric material
#1605Dual damascene interconnect structure with improved electro migration lifetimes
#1606Method for reducing defects after a metal etching in semiconductor devices
#1607Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance
#1608Methods and apparatuses promoting adhesion of dielectric barrier film to copper
#1609Ferroelectric memory devices including protection adhesion layers and methods of forming the same
#1610High performance system-on-chip using post passivation process
#1611Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
#1612Polymer film metalization
#1613Semiconductor integrated circuit device
#1614Method for fabricating contact-making connections
#1615Interconnect structure and method for its fabricating
#1616Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
#1617Method of fabricating semiconductor device having multilayer wiring structure
#1618Use of supercritical fluid for low effective dielectric constant metallization
#1619Semiconductor device including a transistor and a capacitor having an aligned transistor and capacitive element
#1620Semiconductor device and dram integrated circuit device
#1621Technique for forming embedded metal lines having increased resistance against stress-induced material transport
#1622Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same
#1623Semiconductor device for use in a solid state imaging device
#1624Multi-step plasma treatment method to improve CU interconnect electrical performance
#1625Etch stop layer in poly-metal structures
#1626Fabrication process for a semiconductor integrated circuit device
#1627Interconnection structure for a semiconductor device and a method of forming the same
#1628Method for integrating thermistor
#1629Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
#1630Method of manufacturing a semiconductor device using a wet process
#1631Pattern formation method and substrate manufacturing apparatus
#1632Single layer configurable logic
#1633Selective heating using flash anneal
#1634Method of forming a conductive via plug
#1635Method for forming aluminum interconnect
#1636Method for forming contact hole for dual damascene interconnection in semiconductor device
#1637Methods for preventing copper oxidation in a dual damascene process
#1638Method of forming plug of semiconductor device
#1639Method for forming metallic interconnects in semiconductor devices
#1640Method for forming metal pattern to reduce contact resistivity with interconnection contact
#1641Method of manufactuing inductor in semiconductor device
#1642Lateral phase change memory and method therefor
#1643Method for the printing of homogeneous electronic material with a multi-ejector print head
#1644Contact plug in semiconductor device and method of forming the same
#1645Method for fabricating semiconductor device
#1646Multiple stage electroless deposition of a metal layer
#1647Pin-deposition of conductive inks for microelectrodes and contact via filling
#1648Metal article intended for at least partially coating with a substance and a method for producing the same
#1649Methods of bridging lateral nanowires and device using same
#1650Method for reducing corrosion of metal surfaces during semiconductor processing
#1651Method of forming metal line in semiconductor device
#1652Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same
#1653Electroplated CoWP composite structures as copper barrier layers
#1654Small viatops for thick copper connectors
#1655Semiconductor device
#1656Semiconductor device having via connecting between interconnects
#1657Semiconductor device including multi-layered interconnection and method of manufacturing the device
#1658Semiconductor device manufactured by the damascene process having improved stress migration resistance
#1659Method of cleaning surface of semiconductor substrate, method of manufacturing thin film, method of manufacturing semiconductor device, and semiconductor device
#1660Methods of forming particle-containing materials
#1661Support structure for low-k dielectrics
#1662Semiconductor device with organic compound layer
#1663Semiconductor device having an interconnect that increases in impurity concentration as width increases
#1664Semiconductor device manufacturing method and semiconductor device manufactured by such manufacturing method
#1665Method of manufacturing semiconductor device
#1666Method for simultaneous patterning of features with nanometer scales gaps
#1667Reducing apparatus and method
#1668Electroplated CoWP composite structures as copper barrier layers
#1669Methods of nanotubes films and articles
#1670Semiconductor device and the fabricating method thereof
#1671Method for forming patterned conductive film, electrooptical device, and electronic appliance
#1672Method of fabricating semiconductor device
#1673Method for manufacturing semiconductor device
#1674Methods for forming resistors for integrated circuit devices
#1675Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
#1676Ferroelectric memory devices including protection adhesion layers and methods of forming the same
#1677Semiconductor device and method for fabricating the same
#1678Tungsten plug corrosion prevention method using ionized air
#1679Tungsten plug corrosion prevention method using gas sparged water
#1680Coated fullerenes, composites and dielectrics made therefrom
#1681Pattern forming method, conductive thin film, electro-optic device, and electronic equipment
#1682Logic device having vertically extending metal-insulator-metal capacitor between interconnect layers and method of fabricating the same
#1683Chip structure and process for forming the same
#1684System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
#1685Method for manufacturing word line of semiconductor device
#1686Method to deposit an impermeable film on porous low-k dielectric film
#1687Measurement techniques for controlling aspects of a electroless deposition process
#1688Semiconductor device and manufacturing method of the same
#1689Apparatus for electroless deposition
#1690Method for producing an electrically conductive contact
#1691Method of producing a capacitor in a dielectric layer
#1692Variable rotational assignment of interconnect levels in integrated circuit fabrication
#1693Selective heating using flash anneal
#1694Semiconductor device and method for fabricating the same
#1695Microelectromechanical system and method for fabricating the same
#1696Method for producing thin metal-containing layers having a low electrical resistance
#1697Film pattern formation method, device and method for manufacturing the same, electro-optical device, electronic device, and method for manufacturing active matrix substrate
#1698Production of elemental films using a boron-containing reducing agent
#1699Method for manufacturing display device
#1700MIM multilayer capacitor
#1701Semiconductor device and method for fabricating the same
#1702Method and system for controlling the presence of fluorine in refractory metal layers
#1703Process for forming metal damascene structure to prevent dielectric layer peeling
#1704Nanotube films and articles
#1705Semiconductor device
#1706Method for simultaneous degas and baking in copper damascene process
#1707Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#1708Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#1709Nonvolatile semiconductor memory and method for fabricating the same
#1710[CLEANING METHOD USED IN INTERCONNECT PROCESS]
#1711Variable gas conductance control for a process chamber
#1712Methods of manufacturing semiconductor devices having capacitors
#1713Electrochemical fabrication process using directly patterned masks
#1714Reconfigurable logic through deposition of organic pathways
#1715Method for forming pattern and drop discharge apparatus
#1716Semiconductor device having electrical contact from opposite sides including a via with an end formed at a bottom surface of the diffusion region
#1717Localized slots for stress relieve in copper
#1718Method for fabricating a metal-insulator-metal capacitor in a semiconductor device
#1719Semiconductor device and method for manufacturing the same
#1720Semiconductor integrated circuit device
#1721Semiconductor integrated circuit device
#1722Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof
#1723System for in situ seed layer remediation
#1724EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
#1725Semiconductor device, liquid crystal display device and method of manufacturing the semiconductor device
#1726Integrated circuitry and a semiconductor processing method of forming a series of conductive lines
#1727Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus
#1728Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#1729Semiconductor device and method of manufacturing the same
#1730Chip structure and process for forming the same
#1731Topography controlled interconnects
#1732System and method for manufacturing embedded conformal electronics
#1733Semiconductor integrated circuit device
#1734CRACK STOP FOR LOW K DIELECTRICS
#1735Method for fabricating metal wiring
#1736Conductive lines buried in insulating areas
#1737Semiconductor integrated circuit device
#1738Electrochemical reaction cell for a combined barrier layer and seed layer
#1739Electrochemical fabrication methods using transfer plating of masks
#1740Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
#1741Method of modifying conductive wiring
#1742Protecting metal conductors with sacrificial organic monolayers
#1743Etch stop layer in poly-metal structures
#1744Semiconductor element and method for its production
#1745Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
#1746Semiconductor devices including buried digit lines that are laterally offset from corresponding active-device regions
#1747Substrate temperature control in an ALD reactor
#1748Integrated semiconductor product with metal-insulator-metal capacitor
#1749Manufacturing method for wiring
#1750Controlling the temperature of a substrate in a film deposition apparatus
#1751Metal deposition apparatus used in fabrication of semiconductor devices and methods of forming metal layers using the same
#1752Integrated circuitry and a semiconductor processing method of forming a series of conductive lines
#1753Method for forming a bonding pad of a semiconductor device including a plasma treatment
#1754Hillock-free aluminum layer and method of forming the same
#1755Semiconductor device manufactured with auxillary mask and method for producing the same
#1756Semiconductor device including a MIM capacitor
#1757Semiconductor device and method for manufacturing the same
#1758Arrangement comprising a capacitor
#1759High density plasma chemical vapor deposition process
#1760Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus
#1761Semiconductor device and method of manufacturing thereof
#1762Temperature control system in an ALD chamber
#1763Semiconductor device including interconnect structure with metal bridge pattern connecting adjacent metal lines
#1764Anti-fuse structure
#1765Semiconductor structure and method for manufacturing the same
#1766Molded cavity fanout package without using a carrier and method of manufacturing the same
#1767Self-aligned contact with CMP stop layer
#1768Interconnect structure for electrical connecting a pair of microwave transmission lines formed on a pair of spaced structure members
#1769Semiconductor die with backside protection
#1770Epitaxial semiconductor fuse for FinFET structure
#1771Integrated circuit with sewn interconnects
#1772Integrated circuit system with external resistor to provide constant current bias and method of manufacture thereof
#1773Methods of forming gate structures by a gate-cut-last process and the resulting structures
#1774Methods and apparatus for reducing crosstalk and twist region height in routing wires
#1775Random local metal cap layer formation for improved integrated circuit reliability