209375 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements; High-frequency adaptations Optical signal interface included within high-frequency semiconductor device housing
SEMICONDUCTOR DEVICE
#2High Frequency Package
#3METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE
#4Dense hybrid package integration of optically programmable chip
#5SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT
#6Method for conveying high frequency module and a high-frequency module
#7Interposer and electronic package
#8Interposer circuit
#9Programmable frequency selective surfaces
#10Coaxial cable assembly, electronic package and connector
#11Electronic component housing unit, electronic module, and electronic device