H01L2223/66 - CPC Classification Index

ClassID:

209358 ⎘

H01L2223/66 - CPC Classification

Classification description:

Details relating to semiconductor or other solid state devices covered by the group; Structural electrical arrangements for semiconductor devices not otherwise provided for; Impedance arrangements High-frequency adaptations

Sub-classes:

H01L2223/6605 » High-frequency electrical connections 84
H01L2223/6644 » Packaging aspects of high-frequency amplifiers 386
H01L2223/6661 » for passive devices 85
H01L2223/6683 » for monolithic microwave integrated circuit [MMIC] 267
H01L2223/6688 » Mixed frequency adaptations, i.e. for operation at different frequencies 108
H01L2223/6694 » Optical signal interface included within high-frequency semiconductor device housing 10

Recent Application in this class:

20240243073

2024-07-18

RADIO FREQUENCY DEVICE

20230360983

2023-11-09

MODULE

20220157646

2022-05-19

Manufacturing method of air bridge, air bridge and electronic device

20210134733

2021-05-06

Microwave device and antenna for improving heat dissipation

20190189528

2019-06-20

Fan-out semiconductor package

20170162525

2017-06-08

High frequency semiconductor amplifier