209399 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body not in direct contact with the bonding area Flow barrier
Method for packaging stacking flip chip
#2CHIP STRUCTURE
#3Method of soldering a semiconductor chip to a chip carrier
#4Barrier structures between external electrical connectors
#5Chip with chip pad and associated solder flux outgassing trench
#6Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#7Semiconductor package
#8Chip structure and method for forming the same
#9Barrier structures between external electrical connectors
#10Package structure and manufacturing method thereof
#11Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#12Electronic substrate and electronic apparatus
#13Packaged semiconductor devices and methods of packaging thereof
#14Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#15Semiconductor device
#16Barrier structures between external electrical connectors
#17Packaging device having plural microstructures disposed proximate to die mounting region
#18Optimized solder pads for microelectronic components
#19Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#20Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#21Packaging device having plural microstructures disposed proximate to die mounting region
#22Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#23Barrier structures between external electrical connectors
#24Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#25Semiconductor device and method for producing the same
#26Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#27Bond pad and passivation layer having a gap and method for forming