Structure and method for enhancing resistance to fracture of bonding pads

Process and apparatus for wafer-level flip-chip assembly

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

Wafer-level flip-chip assembly methods

Method of assembling electronic components of an electronic system, and system thus obtained

Package-in-package using through-hole via die on saw streets

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom

Package substrate and its solder pad

Semiconductor Device

CHIP PACKAGE STRUCTURE

Integrated circuit package with top-side conduction cooling

Land grid array semiconductor package

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS

GROUNDED SHIELD FOR BLOCKING ELECTROMAGNETIC INTERFERENCE IN AN INTEGRATED CIRCUIT PACKAGE

Extended redistribution layers bumped wafer

Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

Substrate with feedthrough and method for producing the same

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD OF ELECTRONIC COMPONENT

METHOD AND APPARATUS FOR HEAT DISSIPATION

Liquid crystal display and method for manufacturing the same

Surface-mounted piezoelectric oscillators

Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same

Semiconductor device and method of manufacturing the same

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties

Semiconductor device having a sealing resin and method of manufacturing the same

Semiconductor device

Structure for electrostatic discharge in embedded wafer level packages

Semiconductor chip with post-passivation scheme formed over passivation layer

Wafer level package

WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE

Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device

Substrate with multi-layer interconnection structure and method of manufacturing the same

Structure and methods of processing for solder thermal interface materials for chip cooling

Integrated chip package structure using organic substrate and method of manufacturing the same

Chip-Stacked Package Structure and Applications Thereof

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Chip-stacked package structure

Semiconductor device

Semiconductor device having vertical MOSFET

Semiconductor device

Antenna in package with reduced electromagnetic interaction with on chip elements

Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture

Selective etch of TiW for capture pad formation

Printed circuit board and manufacturing method thereof

Electronic Device Installed in an Engine Room

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Solder interconnection array with optimal mechanical integrity

Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component

On chip transformer isolator

Circuitized substrates utilizing smooth-sided conductive layers as part thereof

Conductive heat transport cooling system and method for a multi-component electronics system

Power integrity circuits with EMI benefits

Semiconductor device

Connecting microsized devices using ablative films

Semiconductor Device and Method for Fabricating the Same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device and manufacturing method of the same

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Method of making solder pad

Macro-cell block and semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same

High Input/Output, Low Profile Package-On-Package Semiconductor System

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method for manufacturing the same

Semiconductor device

Integrated circuits and interconnect structure for integrated circuits

Integrated circuits and interconnect structure for integrated circuits

LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT

Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

COF FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

Chip package

Electromigration-Resistant Flip-Chip Solder Joints

TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Semiconductor device

Semiconductor fabrication method and system

Wafer-level package having test terminal

Substrate and method for manufacturing the same

RADIATION SHIELDING WITH POLYHEDRAL OLIGOMERIC SILSESQUIOXANES AND METALLIZED ADDITIVES

Method to create a metal pattern using a damascene-like process

Integrated circuit carrier assembly

Stack package, a method of manufacturing the stack package, and a digital device having the stack package

Top layers of metal for high performance IC's

Novel substrate design for semiconductor device

Wiring substrate and wiring substrate manufacturing method

METHOD FOR FABRICATING CONTACT PADS

Flip-chip image sensor packages and methods of fabricating the same

Semiconductor device including redistribution line structure and method of fabricating the same

Joining method and device produced by this method and joining unit

Method of manufacturing a wiring board

Method of creating contour structures to highlight inspection region

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

Flux for soldering and soldering process

INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS

Apparatus and methods for cooling semiconductor integrated circuit package structures

Gang flipping for IC packaging

Method of assembling chips

GANG FLIPPING FOR FLIP-CHIP PACKAGING

Illuminating Device

Wiring structure of laminated capacitors

Chip scale power converter package having an inductor substrate

Substrate including wiring for transmitting signal, apparatus and system including the substrate

Encapsulated wafer level package with protection against damage and manufacturing method

Multichip semiconductor device, chip therefor and method of formation thereof

Semiconductor device and method of manufacturing the same

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

Semiconductor Package and Method for Fabricating the Same

METHOD FOR FORMING CONTACT PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device and manufacturing method thereof

SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE

Thermally conductive molding compounds for heat dissipation in semiconductor packages

Microelectronic package, method of manufacturing same, and system including same

Flexible circuit electronic package with standoffs

Semiconductor device

Integrated circuit package system with heat sink spacer structures

Semiconductor device and method of manufacturing the same

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE

Composite semiconductor device

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

Integrated circuits and interconnect structure for integrated circuits

Apparatus and method for semiconductor wafer bumping via injection molded solder

Method of joining electronic package capable of prevention for brittle fracture

Power core devices and methods of making thereof

Heat sink mounted on a vehicle-transmission case

Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

METHODS OF FORMING A CORED METALLIC THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY

Wavelength Converter, Light-Emitting Device, Method of Producing Wavelength Converter and Method of Producing Light-Emitting Device

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor element connected to printed circuit board

Wafer-level stack package and method of fabricating the same

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing thereof

Method of manufacturing electronic device, substrate and semiconductor device

Copper die bumps with electromigration cap and plated solder

SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

Carbon nanotubes for active direct and indirect cooling of electronics device

Chip and wafer integration process using vertical connections

Stacked package module

Leadframe based flip chip semiconductor package and lead frame thereof

Integrated cirucit package and method for fabrication thereof

Multi-layer Package Structure for an Acoustic Microsensor

System for fabricating semiconductor components with conductive interconnects

Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic

Integrated circuit socket

Method of joining chips utilizing copper pillar

Electronic components on trenched substrates and method of forming same

Pump structures integral to a fluid filled heat transfer apparatus

Thermal pillow

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Chip structure with bumps and testing pads

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing semiconductor device

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Semiconductor package and fabricating method thereof

Semiconductor module having deflecting conductive layer over a spacer structure

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Apparatus comprising a device and method for producing it

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Leadframe-based semiconductor package and fabrication method thereof

Semiconductor device and method of manufacturing the same

Image sensor module having build-in package cavity and the method of the same

Packaging methods for imager devices

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Method for manufacturing hybrid printed circuit board

Electronic components on trenched substrates and method of forming same

Method and structure for connecting, stacking, and cooling chips on a flexible carrier

Method and structure to improve thermal dissipation from semiconductor devices

Semiconductor device and method of manufacturing the same

Substrate with feedthrough and method for producing the same

Semiconductor device manufacturing method and semiconductor device

Mounting configuration of electronic component

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Stacked-Chip Semiconductor Device

Package substrate strip, metal surface treatment method thereof and chip package structure

LOW COST AND LOW COEFFICIENT OF THERMAL EXPANSION PACKAGING STRUCTURES AND PROCESSES

Conductive ball mounting apparatus and conductive ball mounting method

Elliptic C4 with optimal orientation for enhanced reliability in electronic packages

Electropolishing metal features on a semiconductor wafer

Resin filling apparatus, filling method, and method of manufacturing an electronic device

Method for manufacturing the BGA package board

Designs and methods for conductive bumps

Resin encapsulation molding method for semiconductor device

Method for fabricating semiconductor device and carrier applied therein

Electronic part mounting board and method of mounting the same

Wafer level packaging

Integrated circuit package system with underfill

Semiconductor apparatus and mobile apparatus

Method of assembling chips

High temperature, stable SiC device interconnects and packages having low thermal resistance

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Planar multi semiconductor chip package and method of manufacturing the same

Heat dissipation methods and structures for semiconductor device

Semiconductor device

Direct attach optical receiver module and method of testing

Method and apparatus for electronically aligning capacitively coupled mini-bars

Method and apparatus for ultra thin wafer backside processing

Methods for fabricating semiconductor components with conductive interconnects

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

REWORKABLE CHIP STACK

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Layer sequence and method of manufacturing a layer sequence

Electronic components on trenched substrates and method of forming same

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME

Electronic apparatus and mounting method

Clocking architecture in stacked and bonded dice

Stacked semiconductor chip package with shared DLL signal and method for fabricating stacked semiconductor chip package with shared DLL signal

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor package and fabrication method thereof

Circuit device, a method for manufacturing a circuit device, and a semiconductor module

Semiconductor device and manufacturing method thereof

Stress buffer layer for packaging process

Semiconductor device and method of manufacturing the same

Semiconductor chip on film package with dummy patterns and manufacturing method thereof

Semiconductor components with conductive interconnects

Semiconductor device equipped with thin-film circuit elements

Method for manufacturing a circuit board structure

Flexible wiring cable

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

Method of manufacturing wiring substrate and method of manufacturing electronic component device

Mask and substrate alignment for solder bump process

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Conductive pattern formation method

Method and apparatus for manufacturing electronic integrated circuit chip

Method of manufacturing a semiconductor integrated circuit device

HIGH-FREQUENCY SIGNAL PROCESSING MODULE AND ELECTRONIC DEVICE

Semiconductor device and method for manufacturing the same

CHIP PACKAGE

Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate

Integrated circuit including conductive bumps

Conductive structure for a semiconductor integrated circuit and method for forming the same

Bowed wafer hybridization compensation

Semiconductor device with resin layers and wirings and method for manufacturing the same

Module comprising a semiconductor chip comprising a movable element

Semiconductor module, portable device and method for manufacturing semiconductor module

Integrated package circuit with stiffener

SEMICONDUCTOR DEVICE

Packaging conductive structure for a semiconductor substrate having a metallic layer

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MOS transistor device in common source configuration

LIGHT EMITTING DEVICE

Bond quality indication by bump structure on substrate

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Method for mounting electronic components

Undercut-free BLM process for Pb-free and Pb-reduced C4

Method and apparatus for creating RFID devices

Method for manufacturing passive device and semiconductor package using thin metal piece

ELECTRIC CIRCUIT PACKAGE

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

Electronic device manufacturing system and electronic device manufacturing method

Illumination System Comprising a Red-Emitting Ceramic Luminescence Converter

Bumping process and bump structure

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Semiconductor device comprising electromigration prevention film and manufacturing method thereof

Circuitized substrate with continuous thermoplastic support film dielectric layers

Semiconductor device with magnetic powder mixed therein and manufacturing method thereof

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

Bump structure and manufacturing method thereof

Integrated circuit package system with bump over via

Surface-mount type optical semiconductor device and method for manufacturing the same

Memory configured on a common substrate

Low fabrication cost, fine pitch and high reliability solder bump

Integrated circuit edge protection method and apparatus

Method of room temperature covalent bonding

Versatile Si-based packaging with integrated passive components for mmWave applications

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Dynamic pad size to reduce solder fatigue

Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

Aluminum-based interconnection in bond pad layer

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Bump structure having a reinforcement member

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND PROCESS THEREOF

Stackable semiconductor package having metal pin within through hole of package