209522 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#10202Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings
#10203Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
#10204Method for fabricating circuit component
#10205Method for fabricating last level copper-to-C4 connection with interfacial cap structure
#10206Microelectronic interconnect device comprising localised conductive pins
#10207Method of manufacturing semiconductor device
#10208Semiconductor device, method of manufacturing the same, and camera module
#10209Interconnection pattern design
#10210Power configuration method for structured ASICs
#10211Interconnects with interlocks
#10212WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME
#10213Carbon nanotube circuit component structure
#10214Thermal interconnect and interface systems, methods of production and uses thereof
#10215Semiconductor package with integrated heatsink and electromagnetic shield
#10216Semiconductor chip with bond area
#10217Method for fabricating semiconductor package with build-up layers formed on chip
#10218GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES
#10219Electronic device and method of manufacturing the same
#10220Integrated circuit package-in-package system
#10221Stacked integrated circuit package-in-package system
#10222Multi-chip package system
#10223Heater, reflow apparatus, and solder bump forming method and apparatus
#10224Manufacturing method for semiconductor device and semiconductor device
#10225Methods for packaging microelectronic devices and microelectronic devices formed using such methods
#10226Connection verification technique
#10227Wafer level package having a stress relief spacer and manufacturing method thereof
#10228Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
#10229Method of fabricating passivation
#10230Compliant terminal mountings with vented spaces and methods
#10231Low temperature bumping process
#10232Chip packaging structure without leadframe
#10233Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
#10234Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#10235Flip-chip mounting substrate and flip-chip mounting method
#10236Package having exposed integrated circuit device
#10237Compliant terminal mountings with vented spaces and methods
#10238Semiconductor device
#10239Method of making circuitized substrate with split conductive layer and information handling system utilizing same
#10240Methods of fabricating interconnects for semiconductor components
#10241Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#10242RFID tag
#10243PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD
#10244Semiconductor chip, film substrate, and related semiconductor chip package
#10245Package for high power density devices
#10246PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE
#10247Semiconductor device and manufacturing method of the same
#10248Heat spreader and package structure utilizing the same
#10249Electronic device and semiconductor device
#10250Semiconductor device and manufacturing method of the same
#10251Coaxial through chip connection
#10252Methods and apparatus for packaging integrated circuit devices
#10253Integrated circuit having bond pad with improved thermal and mechanical properties
#10254METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE
#10255Semiconductor component having plate, stacked dice and conductive vias
#10256Projected contact structures for engaging bumped semiconductor devices
#10257Integrated circuit chip with external pads and process for fabricating such a chip
#10258Circuit module
#10259Integrated circuit devices including compliant material under bond pads and methods of fabrication
#10260AllnGaP LED having reduced temperature dependence
#10261Integrated Circuit With Dual Electrical Attachment Pad Configuration
#10262Adhesion by plasma conditioning of semiconductor chip surfaces
#10263Method and system for increasing yield of vertically integrated devices
#10264Semiconductor device and method of manufacturing the same
#10265Semiconductor device and method of manufacturing the same
#10266Chip package structure
#10267Semiconductor components having through wire interconnects (TWI)
#10268Semiconductor device and method for manufacturing same, and semiconductor wafer
#10269High-temperature solder, high-temperature solder paste and power semiconductor using same
#10270Circuit under pad structure and bonding pad process
#10271System and method for separating and packaging integrated circuits
#10272Bonding structure with buffer layer and method of forming the same
#10273Semiconductor device having electrostatic breakdown protection element
#10274Pin-type chip tooling
#10275Semiconductor/printed circuit board assembly, and computer system
#10276Low cost bonding pad and method of fabricating same
#10277THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS
#10278Structure of bumps forming on an under metallurgy layer and method for making the same
#10279Semiconductor device having align mark layer and method of fabricating the same
#10280Integrated heat spreader with intermetallic layer and method for making
#10281METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#10282Apparatus and method for manufacturing semiconductor device
#10283Hybrid solder pad
#10284Alloys for flip chip interconnects and bumps
#10285Fluid cooled encapsulated microelectronic package
#10286Semiconductor device having a heat spreader exposed from a seal resin
#10287Flip-chip light emitting diode device without sub-mount
#10288Buffered Thin Module System and Method
#10289Damascene patterning of barrier layer metal for C4 solder bumps
#10290Wafer redistribution structure with metallic pillar and method for fabricating the same
#10291Micro-electronic package structure and method for fabricating the same
#10292Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
#10293Silicon based package
#10294Carbon-carbon and/or metal-carbon fiber composite heat spreader
#10295Semiconductor chip having bond pads
#10296Semiconductor chip having bond pads
#10297Wafer level chip scale packaging structure and method of fabricating the same
#10298Semiconductor device
#10299Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
#10300Chip stack package and manufacturing method thereof
#10301Wafer level package having redistribution interconnection layer and method of forming the same
#10302Semiconductor chip having bond pads
#10303Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed
#10304Electrical interconnection structure formation
#10305Photosensitive composition
#10306Semiconductor device and method of manufacturing the same
#10307Composite carbon nanotube thermal interface device
#10308Semiconductor device and method of manufacturing the same
#10309RF power amplifier and method for packaging the same
#10310Semiconductor device including a particular dummy terminal
#10311Junction structure for a terminal pad and solder, and semiconductor device having the same
#10312Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same
#10313Electronic component, module, module assembling method, module identification method and module environment setting method
#10314Semiconductor device with solder balls having high reliability
#10315Contact pad structure for flip chip semiconductor die
#10316Semiconductor chip with post-passivation scheme formed over passivation layer
#10317Structure and self-locating method of making capped chips
#10318Structure and method of making capped chips having vertical interconnects
#10319Back-face and edge interconnects for lidded package
#10320Implantable microelectronic device and method of manufacture
#10321Stacked wafer or die packaging with enhanced thermal and device performance
#10322Semiconductor component and method for production of a semiconductor component
#10323Semiconductor device and method for producing the same
#10324Semiconductor package with controlled solder bump wetting
#10325Integrated chip device in a package
#10326Radio frequency power semiconductor device package comprising dielectric platform and shielding plate
#10327Light emitting diode chip with reflective layer thereon
#10328Method for forming solder contacts on mounted substrates
#10329Method for forming improved bump structure
#10330METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT
#10331Semiconductor device with multiple designation marks
#10332Chip packaging process
#10333Semiconductor chip and method of manufacturing semiconductor chip
#10334Semiconductor device and fabrication method thereof
#10335Method and apparatus for manufacturing IC chip packaged device
#10336Low stress conductive polymer bump
#10337Manufacturing method for semiconductor device
#10338SEMICONDUCTORS AND METHODS OF MAKING
#10339Semiconductor module having a coupling substrate, and methods for its production
#10340Semiconductor device and a method of manufacturing the same
#10341Microelectronic packages and methods therefor
#10342Relay board and semiconductor device having the relay board
#10343Semiconductor device with pad electrode for testing and manufacturing method of the same
#10344Semiconductor chip and semiconductor device
#10345Semiconductor element with conductive bumps and fabrication method thereof
#10346Semiconductor device and radiation detector employing it
#10347Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#10348Method for reducing loadline impedance in a system
#10349Semiconductor device and method for manufacturing the same
#10350Depopulation of a ball grid array to allow via placement
#10351PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
#10352Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
#10353Modular bonding pad structure and method
#10354Stacked die semiconductor package
#10355Packaged die on PCB with heat sink encapsulant and methods
#10356Semiconductor IC-embedded substrate and method for manufacturing same
#10357Integrated circuit solder bumping system
#10358INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION
#10359Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
#10360Method for producing a solid-state imaging device
#10361Semiconductor device with a resin-sealed optical semiconductor element
#10362Electric contact and method for producing the same and connector using the electric contacts
#10363Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#10364Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#10365Routing under bond pad for the replacement of an interconnect layer
#10366Display device and manufacturing method of the same
#10367Method for forming component mounting hole in semiconductor substrate
#10368QFN/SON compatible package with SMT land pads
#10369Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#10370Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#10371Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#10372Electronic assembly that includes pads having a bowl shaped upper section
#10373Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#10374Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#10375Fan out type wafer level package structure and method of the same
#10376Multiple chip semiconductor package
#10377Semiconductor chip having bond pads
#10378Integrated circuit die configuration for packaging
#10379Semiconductor chip having bond pads and multi-chip package
#10380Power semiconductor device and method therefor
#10381Component mounting method and component-mounted body
#10382Semiconductor device and automotive AC generator
#10383Bonding structure with buffer layer and method of forming the same
#10384Chip structure and chip package structure
#10385Integrated circuit chip and manufacturing process thereof
#10386Protective barrier layer for semiconductor device electrodes
#10387Semiconductor device and manufacturing method thereof
#10388Semiconductor device having a probing region
#10389Semiconductor device and method of packaging the same
#10390Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#10391Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
#10392Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#10393Methods for forming through-wafer interconnects and structures resulting therefrom
#10394Stacked chip package using photosensitive polymer and manufacturing method thereof
#10395Multi-chip package type semiconductor device
#10396Microfeature workpieces, carriers, and associated methods
#10397Conductive through via process for electronic device carriers
#10398Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#10399Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#10400Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#10401Stacked microelectronic devices and methods for manufacturing microelectronic devices
#10402Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#10403Method for forming a double embossing structure
#10404Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
#10405Ball grid array interface structure and method
#10406Stacked chip package using warp preventing insulative material and manufacturing method thereof
#10407Microelectronic devices and methods for manufacturing microelectronic devices
#10408Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#10409Semiconductor device with reduced thickness of the semiconductor substrate
#10410Methods of forming blind wafer interconnects
#10411Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure
#10412Semiconductor device and method of manufacturing the same
#10413Semiconductor device and method of manufacturing the same
#10414Integrated circuit device
#10415Method of packaging and interconnection of integrated circuits
#10416Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
#10417Bumpless chip package
#10418Semiconductor device
#10419MOSFET package
#10420MOSFET package
#10421Integrated circuit device
#104223D IC method and device
#10423Multichip packages with exposed dice
#10424System and method for optically interconnecting memory devices
#10425Bonded structure and bonding method
#10426Semiconductor device with improved contacts
#10427Semiconductor module
#10428Semiconductor device electronic component, circuit board, and electronic device
#10429Method for fabricating wafer level semiconductor package with build-up layer
#10430Chip-scale Schottky device
#10431Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#10432Apparatuses and methods facilitating functional block deposition
#10433Solder composition for electronic devices
#10434Method for fabricating semiconductor package with heat sink
#10435Chip packaging structure without leadframe
#10436Integrated circuit with low-stress under-bump metallurgy
#10437Power plane design and jumper wire bond for voltage drop minimization
#10438Semiconductor device
#10439Metal pad or metal bump over pad exposed by passivation layer
#10440System and method for optically interconnecting memory devices
#10441Liquid crystal display and method for manufacturing the same having particular pad unit
#10442Liquid crystal display and method for manufacturing the same
#10443Connection unit, a board for mounting a device under test, a probe card and a device interfacing part
#10444Technique for efficiently patterning an underbump metallization layer using a dry etch process
#10445Semiconductor device
#10446Bonding pad on IC substrate and method for making the same
#10447Technique for forming a copper-based contact layer without a terminal metal
#10448Method of fabricating self-assembled electrical interconnections
#10449Self-assembled interconnection particles
#10450Microelectronic bond pad
#10451Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#10452Semiconductor device having capacitors for reducing power source noise
#10453Integrated circuit cooling system and method
#10454Semiconductor device and manufacturing method thereof
#10455METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#10456Method of forming solder bump with reduced surface defects
#10457Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#10458Self alignment features for an electronic assembly
#10459Method for forming high reliability bump structure
#10460Manufacturing process for chip package without core
#10461Fabrication of inductors in transformer based tank circuitry
#10462Stress and force management techniques for a semiconductor die
#10463Wafer level package and its manufacturing method
#10464Multi-component integrated circuit contacts
#10465Wiring board and manufacturing method for wiring board
#10466Electronic component assembly
#10467Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#10468Process for making a semiconductor device having a roughened surface
#10469Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#10470Method for mounting electronic element on a circuit board
#10471Method for fabricating a light-emitting device
#10472Bumped die and wire bonded board-on-chip package
#10473Method and structure for reduction of soft error rates in integrated circuits
#10474Electronic component unit
#10475Semiconductor device
#10476Semiconductor device and electronic apparatus of multi-chip packaging
#10477Self alignment features for an electronic assembly
#10478Method of making an electronic device using an electrically conductive polymer, and associated products
#10479Micro-package, multi-stack micro-package, and manufacturing method therefor
#10480Structure and method for producing multiple size interconnections
#10481SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME
#10482Semiconductor package having dual interconnection form and manufacturing method thereof
#10483Semiconductor device
#10484Seedless wirebond pad plating
#10485Stack package and semiconductor module implementing the same
#10486Ball grid array package enhanced with a thermal and electrical connector
#10487Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#10488Electronic assembly and method for producing an electronic assembly
#10489Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#10490Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#10491Under bump metallization design to reduce dielectric layer delamination
#10492Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#10493Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
#10494Semiconductor components and assemblies including vias of varying lateral dimensions
#10495Circuitry component and method for forming the same
#10496Ultrathin semiconductor circuit having contact bumps
#10497Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#10498Standoffs for centralizing internals in packaging process
#10499Manufacturing method for packaged semiconductor device
#10500Heat-dissipating semiconductor package and fabrication method thereof