Grid array connection device and method

Semiconductor integrated circuit device

Mechanical integrity evaluation of low-k devices with bump shear

Post passivation structure for a semiconductor device and packaging process for same

MEMORY ELEMENT CONDUCTING STRUCTURE

Lead-free semiconductor package

Reliable integrated circuit and package

Conductive interconnect structures and formation methods using supercritical fluids

Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board

Semiconductor wafer package and manufacturing method thereof

Method of manufacturing a semiconductor device

Semiconductor packages and methods of manufacturing thereof

Wireless local area network communications module and integrated chip package

Method for making a pre-laminated inlet

Split thin film capacitor for multiple voltages

Module with built-in component

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Method of soldering or brazing articles having surfaces that are difficult to bond

Positioning flowable solder for bonding integrated circuit elements

Wiring board, method for manufacturing same, and semiconductor package

Coaxial through chip connection

Post-attachment chip-to-chip connection

Rigid-backed, membrane-based chip tooling

Through chip connection

Method of removing the growth substrate of a semiconductor light emitting device

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

Protected chip stack

Substrate for pre-soldering material and fabrication method thereof

Inverse chip connector

Chip connector

Stack circuit member and method

Profiled contact

Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump

Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump

Patterned contact

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Laminated semiconductor package

Contact-based encapsulation

Plastic integrated circuit package, leadframe and method for use in making the package

Membrane-based chip tooling

Nickel bonding cap over copper metalized bondpads

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Planar array contact memory cards

Electronic circuit protection device

Electronic apparatus with thermal module

Driver IC package with improved heat dissipation

Electronic circuit protection device

FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM

Semiconductor device and method of manufacturing a semiconductor device

Electronic packaging including die with through silicon via

Semiconductor package and fabrication method thereof

Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method

Stacked chip security

Semiconductor device and the manufacturing method for the same

Semiconductor device

Heating apparatus

Wiring board and manufacturing method of wiring board

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

System and method for polymer encapsulated solder lid attach

Semiconductor device and manufacturing method thereof

Wireless device enclosure using piezoelectric cooling structures

Inductive filters and methods of fabrication therefor

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Method of making an electronic device using an electrically conductive polymer, and associated products

HIGH PERFORMANCE INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING THE SAME

Integrated circuit device

Semiconductor device having capacitive insulation means and communication terminal using the device

Memory module with improved mechanical strength of chips

Package and method for attaching an integrated heat spreader

Redistribution layer with microstrips

System for assembling electronic components of an electronic system

Tab package connecting host device element

Electronic component including a shielding metal film disposed on a resin layer

Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming

Optical die-down quad flat non-leaded package

Die-wafer package and method of fabricating same

Method and apparatus for RFID device assembly

Semiconductor device

System and method for die attach using a backside heat spreader

Stacked module systems and method

Interposer, method of fabricating the same, and semiconductor device using the same

Method of bonding a microelectronic die to a substrate and arrangement to carry out method

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Systems and arrangements to assess thermal performance

Semiconductor chip with coil element over passivation layer

Memory module and memory system

Semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Microelectronic assemblies having compliant layers

Wafer level pre-packaged flip chip

Multilayer module and method of manufacturing the same

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Sealing membrane for thermal interface material

Chip package having chip extension and method

Flexible core for enhancement of package interconnect reliability

Micromodule, particularly for chip card

Backside method for fabricating semiconductor components with conductive interconnects

Base structure for light emitting device and light emitting device using the same

Semiconductor device including an on-chip coil antenna formed on a device layer which is formed on an oxide film layer

Method of manufacturing component-embedded printed wiring board

Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof

Method for manufacturing electronic component-embedded printed circuit board

Wafer level pre-packaged flip chip

Method of bonding solder pads of flip-chip package

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Semiconductor device and method of fabricating the same

Wafer-level electro-optical semiconductor manufacture fabrication method

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

CIS Package and Method Thereof

Wafer level pre-packaged flip chip system

Flip chip interconnect solder mask

Semiconductor device chip and semiconductor device chip package

Semiconductor device and method of manufacturing the same

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Multi-chip electronic package with reduced line skew and circuitized substrate for use therein

Stacked modules and method

Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

Shielding noisy conductors in integrated passive devices

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Fabrication method of under bump metallurgy structure

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Method and apparatus for creating RFID devices

Method of fabricating wafer level package

Method and apparatus for electronically aligning capacitively coupled mini-bars

Surface protection film and method for producing the same

System component interposer

Bond pad structure comprising multiple bond pads with metal overlap

Metrology system and method for stacked wafer alignment

Device with area array pads for test probing

Flip-chip semiconductor device

Terminal pad structures and methods of fabricating same

Method of making the semiconductor device, circuit board, and electronic instrument

Semiconductor device with substrate having penetrating hole having a protrusion

Wirebonded device packages for semiconductor devices having elongated electrodes

Stacked package semiconductor module having packages stacked in a cavity in the module substrate

Method and apparatus for forming stacked die and substrate structures for increased packing density

Post bump passivation for soft error protection

Flip chip method

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Stacked die package for peripheral and center device pad layout device

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

Three dimensional packaging optimized for high frequency circuitry

Method of fabricating a stacked integrated circuit package system

Conductive ball mounting apparatus

Solder deposition on wafer backside for thin-die thermal interface material

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Method of manufacturing a semiconductor apparatus

Multi-chip semiconductor package

Electronic circuit device

Chip package structure and method for manufacturing the same

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Microelectronic package interconnect and method of fabrication thereof

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Forming folded-stack packaged device using progressive folding tool

Forming folded-stack packaged device using progressive folding tool

Method of forming folded-stack packaged device using progressive folding tool

Forming folded-stack packaged device using progressive folding tool

Gap-filling in electronic assemblies including a TEC structure

Gap control between interposer and substrate in electronic assemblies

Integrated circuit package and method for producing it

Apparatus for attaching a cooling structure to an integrated circuit

Circuit device

Encapsulating method for image sensing element

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

BGA-type multilayer circuit wiring board

Semiconductor device including an under electrode and a bump electrode

Apparatus for conducting heat in a flip-chip assembly

Microelectronic assemblies having compliant layers

Electronic circuit device

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor chip with fuse unit

Cleaning method for semiconductor elements

Memory module that is capable of controlling input/output in accordance with type of memory chip

Electronic apparatus and method for manufacturing the same

Bumping process and bump structure

Thin passivation layer on 3D devices

System for providing a redistribution metal layer in an integrated circuit

Method of forming a substrateless semiconductor package

Non-cavity semiconductor packages

Semiconductor package accomplishing fan-out structure through wire bonding

Integrated circuit system for bonding

Thermally enhanced semiconductor package and fabrication method thereof

Pillar grid array package

Semiconductor device and chip-stack semiconductor device

Image sensor module package

Heater that attaches electronic component to and detaches the same from substrate

Multilayer printed wiring board

Conductive ball mounting apparatus

Capacitor with co-planar electrodes

Cooling apparatus for electronic device

Integrated heat spreader and method for using

Light emitting device with silicone resin layer formed by screen printing

Method of forming metal interconnect layers for flip chip device

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Semiconductor device and fabrication method thereof

Method of fabricating a substrate with a concave surface

Power semiconductor device and method therefor

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Transferring die(s) from an intermediate surface to a substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Integrated circuit edge protection method and apparatus

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Heat sink for multiple semiconductor modules

Stacked die package

Method of mounting an integrated circuit package in an encapsulant cavity

Semiconductor device and method of manufacturing thereof

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Thermally enhanced three-dimensional package and method for manufacturing the same

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Stacked semiconductor package

Method of forming self-passivating interconnects and resulting devices

Structure and method to control underfill

Semiconductor device and method of manufacturing the same

Wafer level package including a device wafer integrated with a passive component

IC package with prefabricated film capacitor

Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

LED package using Si substrate and fabricating method thereof

A1InGaP LED having reduced temperature dependence

COMPACT CAMERA MODULE WITH REDUCED THICKNESS

Multilayer wiring board and its manufacturing method

Liquid epoxy resin composition and semiconductor device

Method of room temperature covalent bonding

Package structure and fabrication thereof

Embedded capacitor structure

Flexible circuit substrate and method of manufacturing the same

ESD foam ground clip

Die attach methods and apparatus

Capillary underfill and mold encapsulation method and apparatus

Aluminum cap with electroless nickel/immersion gold

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Electronic assembly including multiple substrates

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device having a functional surface

Integrated circuit thermal management method and apparatus

Shield and semiconductor die assembly

Semiconductor device including substrate and upper plate having reduced warpage

Semiconductor device

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Light emitting diode package and fabrication method thereof

Epoxy resin molding material for sealing use and semiconductor device

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Flip-chip adaptor package for bare die

Package of image sensor device and formation thereof

System and method to increase die stand-off height

Semiconductor integrated circuit arrangement device and method

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Semiconductor device and manufacturing method therefor

Power amplifier circuitry having inductive networks

Apparatus and methods for packaging electronic devices for optical testing

Flip-chip-on-film package structure

Three-dimensional package

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Semiconductor device and manufacturing method for the same

Stacked semiconductor package

Light source apparatus

Forming solder balls on substrates

Method to accommodate increase in volume expansion during solder reflow

Heating element movement bonding method for semiconductor components

METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Chip heat dissipation structure and manufacturing method

Semiconductor package fabrication

Liquid epoxy resin composition and semiconductor device

Blister package with integrated electronic tag and method of manufacture

Configuration for testing the bonding positions of conductive drops and test method for using the same

Semiconductor device and method of manufacturing the same

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Heat spreader and package structure utilizing the same

Method and structure to provide balanced mechanical loading of devices in compressively loaded environments

Imaging module and method for forming the same

Radio-frequency module for communication

Semiconductor device

Wafer-level package having test terminal

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

System and method for increasing yield from semiconductor wafer electroplating

Optoelectronic package with wire-protection lid

Semiconductor package having an optical device and a method of making the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same