209522 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
Stacked semiconductor multi-chip package
#11102Fan out type wafer level package structure and method of the same
#11103Chip-on-board package having flip chip assembly structure and manufacturing method thereof
#11104Ceramic thin film on base metal electrode
#11105Manufacturing method of solid-state image sensing device
#11106Thermally conductive channel between a semiconductor chip and an external thermal interface
#11107Integrated inductor and method of fabrication
#11108Electronic component with cavity fillers made from thermoplast and method for production thereof
#11109Method for flip chip bonding by utilizing an interposer with embedded bumps
#11110Anti-tamper module
#11111Integrated structure with CPU and north bridge chip
#11112Semiconductor device and manufacturing method of the same
#11113Semiconductor device and method of manufacturing the same
#11114UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE
#11115Molded high density electronic packaging structure for high performance applications
#11116Array capacitor with resistive structure
#11117Semiconductor device and method for producing the same
#11118Multi-layer integrated semiconductor structure having an electrical shielding portion
#11119Thermally enhanced molded package for semiconductors
#11120System to control effective series resistance of power delivery circuit
#11121Cavity-down multiple-chip package
#11122Light emitting module
#11123Solderable top metal for SiC device
#11124Method of forming folded-stack packaged device using vertical progression folding tool
#11125Device for bonding a metal on a surface of a substrate
#11126Circuit carrier and production thereof
#11127Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
#11128Semiconductor device and method of manufacturing the same
#11129Plating method, semiconductor device fabrication method and circuit board fabrication method
#11130Processing method during a package process
#11131Wafer-level diamond spreader
#11132Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#11133Liquid crystal display
#11134Ceramic multilayer substrate
#11135Package structure module of bump posited type lead frame
#11136Method and process of contact to a heat softened solder ball array
#11137Plating apparatus and plating method
#11138Flexible circuit board processing method
#11139Semiconductor device and its manufacturing method
#11140Method of manufacturing electric device
#11141Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
#11142Semiconductor device and manufacturing method for the same
#11143Folded substrate with interposer package for integrated circuit devices
#11144Semiconductor package with flash-absorbing mechanism and fabrication method thereof
#11145Chip bond layout for chip carrier for flip chip applications
#11146Non-Circular via holes for bumping pads and related structures
#11147Resist sidewall spacer for C4 BLM undercut control
#111483D interconnect with protruding contacts
#11149Electro-optical device and electronic apparatus
#11150Flip chip bonding tool
#11151Contour structures to highlight inspection regions
#11152Semiconductor device and method of manufacturing thereof
#11153Die handling system
#11154Inverter and vehicle drive unit using the same
#11155Reducing the coupling between LC-oscillator-based phase-locked loops in flip-chip ASICs
#11156Structure and method for fabricating a bond pad structure
#11157Copper interposer for reducing warping of integrated circuit packages and method of making IC packages
#11158Semiconductor device and method of manufacturing semiconductor device
#11159Array capacitor apparatuses to filter input/output signal
#11160Methods to deposit metal alloy barrier layers
#11161Copper interconnect
#11162Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device
#11163Construction to improve thermal performance and reduce die backside warpage
#11164Semiconductor device and electronic apparatus
#11165Methods for manufacturing semiconductor device, semiconductor device and metal mold
#11166Cavity-down stacked multi-chip package
#11167Memory card
#11168Method forming split thin film capacitors with multiple voltages
#11169Semiconductor substrate thinning method for manufacturing thinned die
#11170Method of forming electrode for semiconductor device
#11171Semiconductor device manufacturing method
#11172Integrated circuit package
#11173Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method
#11174Photoelectric composite interconnection assembly and electronics device using same
#11175Array capacitor with IC contacts and applications
#11176Production method of anisotropic conductive sheet
#11177Semiconductor device
#11178Semiconductor element including a wet prevention film
#11179Reliable printed wiring board assembly employing packages with solder joints
#11180Input/output routing on an electronic device
#11181Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor
#11182Electronic device
#11183Chip package
#11184COF flexible printed wiring board and method of producing the wiring board
#11185Bonding tool for ultrasonic bonding and method of ultrasonic bonding
#11186Electronic assemblies and methods of making the same
#11187Top layers of metal for integrated circuits
#11188Top layers of metal for integrated circuits
#11189Semiconductor device and method for manufacturing the same
#11190Semiconductor package having a heat slug and manufacturing method thereof
#11191Packaging method, packaging structure and package substrate for electronic parts
#11192Structural design for flip-chip assembly
#11193Solder foil, semiconductor device and electronic device
#11194High performance amine based no-flow underfill materials for flip chip applications
#11195IC PACKAGE HAVING GROUND IC CHIP AND METHOD OF MANUFACTURING SAME
#11196Interconnection structure of integrated circuit chip
#11197Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#11198Heat dissipation for chip-on-chip IC packages
#11199Semiconductor device
#11200Assembly for stacked BGA packages
#11201Materials, structures and methods for microelectronic packaging
#11202Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
#11203Heat spreader for non-uniform power dissipation
#11204Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
#11205Light emitting device
#11206Solder interconnection array with optimal mechanical integrity
#11207Integrated radio frequency module
#11208Microelectronic packaging and components
#11209Method of stacking thin substrates by transfer bonding
#11210Semiconductor device and fabrication process thereof
#11211Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
#11212Wafer level packages and methods of fabrication
#11213Thin glass chip for an electronic component and manufacturing method
#11214Antennae for radio frequency identification tags in the form of artwork such as a logo, brand name, graphics, trademark, or the like
#11215Semiconductor package having flash-free contacts and techniques for manufacturing the same
#11216Semiconductor device and a method of assembling a semiconductor device
#11217Copper interconnect
#11218Copper interconnect
#11219Copper interconnect
#11220Copper interconnect for semiconductor device
#11221Semiconductor packages
#11222Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
#11223Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#11224Methods of forming semiconductor packages
#11225Semiconductor device with temperature control mechanism
#11226Wiring board, method of manufacturing the same, and semiconductor device
#11227Chip package assembly produced thereby
#11228Semiconductor packages
#11229Using special visibility materials proximate candidate component locations to enhance recognition
#11230Top layers of metal for high performance IC's
#11231Module assembly and method for stacked BGA packages
#11232Method of manufacturing a semiconductor device
#11233Technique for attaching die to leads
#11234Method for manufacturing electronic component-mounted board
#11235Chip assembly reinforcement
#11236Buffered thin module system and method
#11237High capacity thin module system and method
#11238Post passivation interconnection structures
#11239Post passivation interconnection process and structures
#11240Semiconductor device mounting structure for reducing thermal stress and warpage
#11241Semiconductor device and method for manufacturing the same
#11242Semiconductor device with reduced contact resistance
#11243Thin module system and method with thermal management
#11244Thin module system and method with skew reduction
#11245Module assembly for stacked BGA packages
#11246Semiconductor device
#11247Lead frame and semiconductor device having the lead frame
#11248Semiconductor device and method for fabricating the same
#11249Post passivation interconnection process and structures
#11250Methods for forming vias varying lateral dimensions
#11251Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#11252Substrate grooves to reduce underfill fillet bridging
#11253Underfill injection mold
#11254Optical semiconductor module and semiconductor device including the same
#11255Electronic module with conductive polymer
#11256Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
#11257Integrated package inductor for integrated circuit devices
#11258Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
#11259Underfill and mold compounds including siloxane-based aromatic diamines
#11260Low stress conductive polymer bump
#11261Semiconductor device
#11262Low temperature PB-free processing for semiconductor devices
#11263Flip chip ball grid array package with constraint plate
#11264Top layers of metal for high performance IC's
#11265Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#11266Semiconductor device having a heat-dissipation member
#11267IC package with power and signal lines on opposing sides
#11268Transistor performance enhancement using engineered strains
#11269Semiconductor device having heat sink
#11270Structure and process of semiconductor package with an exposed heatsink
#11271Circuit device and manufacture method for circuit device
#11272Stacked packaging methods and structures
#11273Chip package having a heat spreader and method for packaging the same
#11274Micro-electronic package structure and method for fabricating the same
#11275Semiconductor device having stiffener
#11276Interposers for chip-scale packages and intermediates thereof
#11277Light emitting device and light emitting element having predetermined optical form
#11278High power light emitting diode package
#11279Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#11280Chip card module
#11281Dense intermetallic compound layer
#11282Cooling of substrate using interposer channels
#11283Compressible films surrounding solder connectors
#11284Method and apparatus for heat dissipation
#11285Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#11286Electrode structure of a semiconductor device and method of manufacturing the same
#11287Fluid cooled encapsulated microelectronic package
#11288Integrated circuit with increased heat transfer
#11289Multiple power density chip structure
#11290System-on-a-chip with multi-layered metallized through-hole interconnection
#11291Stacked wafer scale package
#11292Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages
#11293Bonded silicon, components and a method of fabricating the same
#11294Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
#11295LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device
#11296Method of forming a solder ball on a board and the board
#11297Anisotropic conductive adhesive for fine pitch and COG packaged LCD module
#11298Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
#11299Stacked packages
#11300Semiconductor device and manufacturing method of the same
#11301Multilayered anisotropic conductive adhesive for fine pitch
#11302Power gridding scheme
#11303Fine pitch low-cost flip chip substrate
#11304Liquid metal thermal interface for an integrated circuit device
#11305Power gridding scheme
#11306Electronic module with form in-place pedestal
#11307Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#11308Rugged CSP module system and method
#11309System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack
#11310Radio frequency identification (RFID) tag and manufacturing method thereof
#11311Apparatus and method for printing micro metal structures
#11312Selectively coating bond pads
#11313Methods of forming lead free solder bumps
#11314Method for fabricating semiconductor package with circuit side polymer layer
#11315Semiconductor device
#11316Method for processing a base that includes connecting a first base to a second base with an insulating film
#11317Packaging structure and method of an image sensor module
#11318Package structure for light emitting diode and method thereof
#11319Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#11320Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#11321Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
#11322Mechanism and process for compressing chips
#11323Package structure for light emitting diode and method thereof
#11324Light emitting diode package
#11325Helical microelectronic contact and method for fabricating same
#11326Manufacturing method of semiconductor device
#11327Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein
#11328Semiconductor device and method for manufacturing the same, package for LCD driver
#11329Interconnects with interlocks
#11330Semiconductor chip-embedded substrate and method of manufacturing same
#11331Semiconductor package with flip chip on leadless leadframe
#11332Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
#11333Semiconductor device and a manufacturing method of the same
#11334Metal bond pad for integrated circuits allowing improved probing ability of small pads
#11335Apparatus and method for printing micro metal structures
#11336GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF
#11337Method for fabricating pad redistribution layer
#11338Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#11339Layered board, and apparatus incorporated such layered board
#11340Liquid crystal display and method for manufacturing the same having particular pad unit
#11341Collars, support structures, and forms for protruding conductive structures
#11342Semiconductor device
#11343Flip-chip semiconductor package with lead frame and method for fabricating the same
#11344Formation method and structure of conductive bumps
#11345Device having contact pad with a conductive layer and a conductive passivation layer
#11346Structure and formation method of conductive bumps
#11347Semiconductor device and method of manufacturing a semiconductor device
#11348Flip chip package capable of measuring bond line thickness of thermal interface material
#11349Heterogeneous organic laminate stack ups for high frequency applications
#11350BGA package board and method for manufacturing the same
#11351Solid-state imaging apparatus and manufacturing method thereof
#11352Damascene patterning of barrier layer metal for C4 solder bumps
#11353Reducing loadline impedance in a system
#11354Resin encapsulation molding method for semiconductor device
#11355Method of manufacturing semiconductor device
#11356Temporary chip attach method using reworkable conductive adhesive interconnections
#11357Electronic apparatus
#11358Semiconductor chip resin encapsulation method
#11359Top layers of metal for high performance IC's
#11360Connection between a semiconductor chip and a circuit component with a large contact area
#11361Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#11362Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#11363Methods of bonding two semiconductor devices
#11364Semiconductor device and manufacturing method therefor
#11365Integrated circuit die with pedestal
#11366Semiconductor device and method of manufacturing the same
#11367Method of fabricating a semiconductor device and mounting equipment
#11368Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#11369Method of manufacturing a wiring board
#11370Method of fabricating wiring board
#11371Methods of forming electronic structures including conductive shunt layers and related structures
#11372Integrated circuit stacking system and method
#11373Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
#11374Electronic device package
#11375Semiconductor device and semiconductor module employing thereof
#11376BGA package with concave shaped bonding pads
#11377Flip-chip without bumps and polymer for board assembly
#11378Stacked semiconductor device and semiconductor memory module
#11379Silicon building block architecture with flex tape
#11380Semiconductor integrated circuit device
#11381Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
#11382Special contact points for accessing internal circuitry of an intergrated circuit
#11383Method for ultra thinning bumped wafers for flip chip
#11384Highly compliant plate for wafer bonding
#11385Method for fabricating an electronic component embedded substrate
#11386Stacked package electronic device
#11387Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions
#11388Electronic assembly having multi-material interconnects
#11389Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
#11390Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
#11391Multi-component integrated circuit contacts
#11392Package Structure
#11393LED with substrate modifications for enhanced light extraction and method of making same
#11394LED with substrate modifications for enhanced light extraction and method of making same
#11395Circular wire-bond pad, package made therewith, and method of assembling same
#11396Laser metallization for ceramic device
#11397Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
#11398Wafer-level diamond spreader
#11399Electronic device package
#11400Electrostatic discharge (ESD) protection for integrated circuit packages