Method for reducing assembly-induced stress in a semiconductor die

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Signal transmission circuit, IC package, and mounting board

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Planar microspring integrated circuit chip interconnection to next level

Semiconductor device

System for different bond pads in an integrated circuit package

Integrated circuit having memory and router disposed thereon and method of making thereof

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

HIP PACKAGE STRUCTURE

Stacked integrated circuits package system with dense routability and high thermal conductivity

Stacked device package for peripheral and center device pad layout device

Semiconductor device

PHOTO DETECTOR PACKAGE

MOSFET package

MOSFET package

CHIP STRUCTURE AND WAFER STRUCTURE

Semiconductor device and method for producing same

Capacitor parts

High frequency integrated circuits

METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES

Apparatus and method for bonding anisotropic conductive film using laser beam

Semiconductor memory device and stress testing method thereof

Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Radio frequency module and fabrication method thereof

Microelectronic assemblies having compliancy

Semiconductor flip chip package having substantially non-collapsible spacer

Electronic device, standoff member, and method of manufacturing electronic device

Integrated connection arrangements

Interconnecting substrate and semiconductor device

Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package

Method of making reinforced semiconductor package

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Method of manufacturing semiconductor device and semiconductor device

Integrated circuit package-in-package system

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Semiconductor device and manufacturing method thereof

High frequency arrangement

Package structure with chip embedded in substrate

Semiconductor device and its writing method

Semiconductor device

Module card structure

LED lamp

Heat sink, an electronic component package, and a method of manufacturing a heat sink

Thermally coupled surfaces having controlled minimum clearance

Component mounting method

Semiconductor component sealed on five sides by polymer sealing layer

Method of forming a wear-resistant dielectric layer

Flip chip ball grid array package with constraint plate

Semiconductor devices and in-process semiconductor devices having conductor filled vias

Semiconductor device

Semiconductor device and manufacturing method of the same

Heat spreader clamping mechanism for semiconductor modules

Apparatus and methods for cooling semiconductor integrated circuit chip packages

Fine pitch low cost flip chip substrate

Chip package and producing method thereof

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Magnetic shielding for magnetically sensitive semiconductor devices

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

Multilayer printed wiring board and process for producing the same

Multilayer printed wiring board and method of manufacturing the same

Package or pre-applied foamable underfill for lead-free process

Semiconductor device

Structure and method for bonding an IC chip

Consolidated flip chip BGA assembly process and apparatus

Integrated circuits and interconnect structure for integrated circuits

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit

Antenna designs for radio frequency identification tags

Compliant electrical contacts

Chip-stacked semiconductor package and method for fabricating the same

Efficient method of forming and assembling a microelectronic chip including solder bumps

Light emitting device and method of making the same

Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly

Integrated transformer structure and method of fabrication

Bump structure of semiconductor device and method of manufacturing the same

Routing design to minimize electromigration damage to solder bumps

Module structure having embedded chips

Printed wires arrangement for in-line memory (IMM) module

Semiconductor package integral heat spreader

Electronic device and method for fabricating the same

Sealed-by-resin type semiconductor device

Method and apparatus for packaging an electronic chip

Molding tool and a method of forming an electronic device package

Electronic device manufacture

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Light emitting apparatus

Semiconductor device and method of fabricating the same

Semiconductor chip electrical connection structure

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

Two-fluid spray cooling system

Method of making a compliant interconnect assembly

Method of manufacturing semiconductor device and method of treating electrical connection section

Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier

Data carrier with a module with a reinforcement strip

Interconnection structure through passive component

Semiconductor device and display module using same

Electronic device package and method of manufacturing the same

Structure for joining a semiconductor package to a substrate using a solder column

Semiconductor device, display module, and manufacturing method of semiconductor device

Semiconductor light emitting device

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

High temperature, stable SiC device interconnects and packages having low thermal resistance

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Method to manufacture a universal footprint for a package with exposed chip

On-pad broadband matching network

Enhanced reliability semiconductor package

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Electronic component assembly

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Assembly comprising functional devices and method of making same

Signal transfer film, display apparatus having the same and method of manufacturing the same

Electronic component package including heat spreading member

Thermal interface apparatus, systems, and fabrication methods

Semiconductor device having signal line and reference potential planes separated by a vertical gap

RFID tag with thermal conductive cover

Printed circuit board having reduced mounting height

Flip chip package structure

ON-CHIP COOLING

BGA package substrate and method of fabricating same

Semiconductor package having passive component disposed between semiconductor device and substrate

Multilayer board and a semiconductor device

Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same

Flexible substrate for package

On-chip circuit pad structure

Electro-optic integrated circuits with connectors and methods for the production thereof

System and method for cooling an integrated circuit device by electromagnetically pumping a fluid

Thermal interface structure with integrated liquid cooling and methods

Array optical sub-assembly

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Solder structures for out of plane connections

Semiconductor device and fabrication method thereof

Copper interconnect

Semiconductor device and fabrication method thereof

Thermal interface structure with integrated liquid cooling and methods

One step capillary underfill integration for semiconductor packages

Substrate for semiconductor devices and semiconductor device

Stacked ball grid array packages

One step capillary underfill integration for semiconductor packages

Method for wafer stacking using copper structures of substantially uniform height

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Power core devices

Light emitting diode package and process of making the same

Connection ball positioning method and device for integrated circuits

Hot-Melt Underfill Composition and Methos of Application

Wafer structure, chip structure, and fabricating process thereof

Integrated circuit packaging using electrochemically fabricated structures

Methods of forming semiconductor packages

Semiconductor package with a controlled impedance bus

Light emitting module

Ball limiting metallurgy split into segments

Semiconductor device and manufacturing method therefor

Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip

Integrated circuit coolant microchannel with movable portion

Semiconductor package having connecting bumps

Repairable three-dimensional semiconductor subsystem

System for implementing a configurable integrated circuit

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

System for coupling wire to semiconductor region

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

RFID tag and method of manufacturing the same

Method of manufacturing a semiconductor device

Thermal attach and detach methods and system for surface-mounted components

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Wired circuit board

Method for re-routing lithography-free microelectronic devices

Methods of using sonication to couple a heat sink to a heat-generating component

Protection of an integrated capacitor

Display, method of manufacturing display and apparatus for manufacturing display

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip chip package with anti-floating structure

Apparatus and method for manufacturing semiconductor device

Method for solder bumping, and solder-bumping structures produced thereby

Semiconductor apparatus

Semiconductor device and manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Semiconductor device comprising a memory portion and a peripheral circuit portion

Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer

Forming of high aspect ratio conductive structure using injection molded solder

Method of packaging flip chip and method of forming pre-solders on substrate thereof

Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same

Chain extension for thermal materials

Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure

Three-dimensional device fabrication method

Thermal management of surface-mount circuit devices

Circuit component module, electronic circuit device, and method for manufacturing the circuit component module

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Integrated circuit cooling system and method

Thermal expansion compensating flip chip ball grid array package structure

Method for fabricating semiconductor package having conductive bumps on chip

Stacked electronics for sensors

Multi-level semiconductor module and method for fabricating the same

Stackable frames for packaging microelectronic devices

Ball assignment schemes for integrated circuit packages

Liquid metal thermal interface material system

Bi-directional power switch

Light emitting device package

Epoxy-solder thermally conductive structure for an integrated circuit

Spray cooling with spray deflection

Semiconductor package substrate with embedded chip and fabrication method thereof

Attachment of flip chips to substrates

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Microelectronic packages with solder interconnections

Semiconductor device and manufacturing method of semiconductor device

Substrate package structure and packaging method thereof

Method and apparatus for polymer dielectric surface recovery by ion implantation

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Wiring board manufacturing method

High surface area aluminum bond pad for through-wafer connections to an electronic package

Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

Electronic device and manufacturing method of the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Structure of embedded active components and manufacturing method thereof

Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical interconnects and manufacturing methods thereof

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Apparatus and methods for cooling semiconductor integrated circuit package structures

Microelectronic assemblies and methods of making microelectronic assemblies

Semiconductor device with penetrating electrode

Integrated circuit package and assembly thereof

Probe arrays and method for making

Multi-chip package and method of fabricating the same

Semiconductor device and method of fabricating the same

Stacked module systems and methods

Circuit board with embedded component and method of manufacturing same

Techniques for microchannel cooling

Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips

Method of removing integrated circuit chip package and detachment jig therefor

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Assembly process

Process for fabricating chip embedded package structure

Edge plated printed wiring boards

Heat-dissipating device

Fluidic cooling systems and methods for electronic components

Die attach material for TBGA or flexible circuitry

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

Heat dissipating packages structure and method for fabricating the same

Semiconductor integrated circuit chip packages having integrated microchannel cooling modules

Substrate design to improve chip package reliability

Wiring board having connecting wiring between electrode plane and connecting pad

Flip-chip component

Multi-chip package

Integrated circuit package system with leadframe substrate

Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Semiconductor chip heat transfer device

Integrated thermoelectric cooling devices and methods for fabricating same

Adhesion apparatus

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Injection molded metal bonding tray for integrated circuit device fabrication

Electronic device and method of manufacturing same

Flip chip underfilling

CPU power delivery system

RFID tag

Semiconductor package device and method for fabricating the same

No-flow underfill materials for flip chips

Semiconductor device having flip-chip package and method for fabricating the same

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Chip package with grease heat sink

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Semiconductor device having through electrode and method of manufacturing the same

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

Bumping process and structure thereof

Integrated circuit die configuration for packaging

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Structure of mounting electronic component

Stacked module systems

Method of creating an RFID tag with substantially protected rigid electronic component

Variation of conductive cross section and/or material to enhance performance and/or reduce material consumption of electronic assemblies

Flip chip BGA process and package with stiffener ring

Wiring board and method for producing same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Semiconductor device, circuit board, electro-optic device, electronic device

Bond pad structure with stress-buffering layer capping interconnection metal layer

High heat dissipation flip chip package structure

Semiconductor package with heat sink and method for fabricating same