209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Interposer, method for fabricating the same, and semiconductor package having the same
#302Semiconductor device and method of manufacturing
#303Bonded Semiconductor Device And Method For Forming The Same
#304Semiconductor device and method of manufacturing the same
#305Semiconductor device
#306Interconnects for light emitting diode chips
#307Semiconductor device
#308Switching device and electronic circuit
#309DISPLAY MODULE
#310Multi-chip packaging
#311Semiconductor device and method
#312Display substrate and display device
#313Method for forming semiconductor package and semiconductor package
#314Electromigration resistant and profile consistent contact arrays
#315Display panel and display device including crack detection line electrically connecting first and second pins
#316Display device including anisotropic conductive film (ACF)
#317Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip
#318Method for Forming Semiconductor Package and Semiconductor Package
#319Multi-segment monolithic LED chip
#320Multi-chip packaging
#321Semiconductor device, power converter, and method of manufacturing semiconductor device
#322Electronic circuit for a hybrid molecular bonding
#323Semiconductor power device and method for producing same
#324Wrap-around source/drain method of making contacts for backside metals
#325Wrap-around source/drain method of making contacts for backside metals
#326Circuit structure
#327Semiconductor device having a metallization structure
#328SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#329Display device and method for manufacturing display device, and electronic device
#330Semiconductor package having a chip carrier with a pad offset feature
#331Semiconductor device with electrode pad having different bonding surface heights
#332Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure
#333Semiconductor chip including through electrode, and semiconductor package including the same
#334DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
#335Driving chip and display panel
#336Electronic device including conductive adhesive layer
#337Semiconductor package for improving bonding reliability
#338Test pad structure of chip
#339Display panel and manufacturing method for same
#340Chip, circuit board and electronic device comprising polygonal pads
#341Semiconductor package and method of manufacturing the same
#342Flip-chip flexible under bump metallization size
#343Packaging of a semiconductor device with a plurality of leads
#344Semiconductor device including sense insulated-gate bipolar transistor
#345Semiconductor device and method for manufacturing the same
#346SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
#347Semiconductor package and methods of manufacturing a semiconductor package
#348Semiconductor device, and method for manufacturing semiconductor device
#349Semiconductor device
#350Chip, circuit board and electronic device
#351DISPLAY DEVICE
#352Semiconductor structure and method for manufacturing the same
#353Semiconductor device and semiconductor device manufacturing method
#354Mixed under bump metallurgy (UBM) interconnect bridge structure
#355Semiconductor device and method of manufacturing the same
#356Space efficient and low parasitic half bridge
#357Semiconductor device
#358Package with metal-insulator-metal capacitor and method of manufacturing the same
#359MOSFET WITH INTEGRATED ESD PROTECTION DIODE HAVING ANODE ELECTRODE CONNECTION TO TRENCHED GATES FOR INCREASING SWITCH SPEED
#360Semiconductor device package and method of manufacturing the same
#361Semiconductor device assembly with surface-mount die support structures
#362Bond pads for low temperature hybrid bonding
#363Semiconductor package
#364Semiconductor device and method for manufacturing the same
#365Method of manufacturing a semiconductor device having a bond wire or clip bonded to a bonding pad
#366Semiconductor device
#367Semiconductor devices with package-level configurability
#368Semiconductor power module
#369Semiconductor device and method of manufacture
#370Semiconductor device assembly with die support structures
#371Method of direct bonding semiconductor components
#372Display device including a pad where a driving chip is mounted
#373Semiconductor package and manufacturing method thereof
#374Semiconductor device comprising PN junction diode and Schottky barrier diode
#375Semiconductor device having reduced capacitance between source and drain pads
#376Printed circuit board structure having pads and conductive wire
#377Shielding structures
#378Packaging of a semiconductor device with a plurality of leads
#379Chemical mechanical polishing for hybrid bonding
#380Chip package structure
#381Bridge support structure
#382Flat lead package formation method
#383Semiconductor power device and method for producing same
#384Semiconductor device, semiconductor module, and packaged semiconductor device
#385Semiconductor device, semiconductor module, and packaged semiconductor device
#386Semiconductor structure and method for manufacturing the same
#387Electromigration resistant and profile consistent contact arrays
#388Semiconductor package and manufacturing method thereof
#389Switching device and electronic circuit
#390Semiconductor device and method of manufacturing a semiconductor device
#391DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY DEVICE
#392Semiconductor device and method of manufacturing
#393Semiconductor package and method of manufacturing the same
#394Interconnects for light emitting diode chips
#395Multi-chip packaging
#396Localized high density substrate routing
#397Semiconductor device and method of manufacturing the same
#398Driving chip including bonding pads in non-display area and display panel
#399Semiconductor structure and method for forming the same
#400Discrete power transistor package having solderless DBC to leadframe attach
#401Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#402Semiconductor device and semiconductor package
#403Universal surface-mount semiconductor package
#404Die stack assembly using an edge separation structure for connectivity through a die of the stack
#405Semiconductor device and method for manufacturing the same
#406Power module and motor drive circuit
#407High speed, efficient sic power module
#408Semiconductor device and a method of manufacturing the same
#409Multi-purpose non-linear semiconductor package assembly line
#410Chip package structure and method for forming the same
#411Semiconductor with external electrode
#412Interconnects for light emitting diode chips
#413Semiconductor die package including a one-body clip
#414Semiconductor package with elastic coupler and related methods
#415Semiconductor power module
#416High speed, efficient SiC power module
#417Shielding structures
#418Semiconductor power device and method for producing same
#419Semiconductor devices with package-level configurability
#420Semiconductor device comprising PN junction diode and schottky barrier diode
#421Semiconductor structure and manufacturing method thereof
#422Semiconductor device and method of manufacture
#423Method of manufacturing semiconductor module and semiconductor module
#424Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#425Semiconductor device manufacturing method and soldering support jig
#426Semiconductor device
#427Semiconductor device and method of manufacturing the same
#428Connector formation methods and packaged semiconductor devices
#429Semiconductor device
#430Semiconductor device including sense insulated-gate bipolar transistor
#431SEMICONDUCTOR DEVICE
#432Semiconductor device
#433Heterojunction semiconductor device for reducing parasitic capacitance
#434Package with metal-insulator-metal capacitor and method of manufacturing the same
#435Power module, power converter and manufacturing method of power module
#436Semiconductor device and power conversion apparatus
#437Bond pads for low temperature hybrid bonding
#438Semiconductor devices
#439Electromigration resistant and profile consistent contact arrays
#440Semiconductor device having reduced capacitance between source and drain pads
#441Micro-transfer-printable flip-chip structures and methods
#442Semiconductor device
#443Electronic device and connection body
#444Multi-chip packaging
#445Display device
#446Method of manufacturing semiconductor device
#447Communicating across galvanic isolation
#448Semiconductor device and manufacturing method thereof
#449Semiconductor device and method for manufacturing the same
#450Semiconductor device and method of manufacturing thereof
#451Device substrate, display panel and tiled display comprising arrangement of power lines and pads
#452Semiconductor device with encapsulating resin
#453Integrated RF front end system
#454Electronic device and connector
#455Semiconductor device
#456Electronic device with common electrode
#457Power semiconductor module with low gate path inductance
#458Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit
#459Semiconductor packages
#460Semiconductor power module
#461Semiconductor device having electrode pad and electrode layer intervening semiconductor layer inbetween and manufacturing method thereof
#462Power semiconductor module
#463Semiconductor device including bonding pad and bond wire or clip
#464Semiconductor package and methods of manufacturing a semiconductor package
#465Semiconductor module, electronic component and method of manufacturing a semiconductor module
#466Semiconductor component and method of manufacture
#467Semiconductor module and semiconductor device
#468Power circuit and power module using MISFET having control circuit disposed between gate and source
#469Bond structures and the methods of forming the same
#470Cascode semiconductor package and related methods
#471Semiconductor device
#472Semiconductor package with elastic coupler and related methods
#473SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#474Semiconductor device
#475Semiconductor device
#476Method for manufacturing gate insulator for HEMT
#477Power semiconductor module and power semiconductor device
#478Power module
#479Silicon carbide power module
#480Electronic device
#481Package with metal-insulator-metal capacitor and method of manufacturing the same
#482Semiconductor device, and method for manufacturing semiconductor device
#483Semiconductor device and method for manufacturing the same
#484Methods for bump planarity control
#485Semiconductor device
#486Structure with micro device
#487Semiconductor chip and method for forming a chip pad
#488Semiconductor device
#489Semiconductor package
#490Switching device and electronic circuit
#491Semiconductor module
#492Recessed lead leadframe packages
#493Semiconductor device and method of manufacturing the same
#494Semiconductor device, and method for manufacturing semiconductor device
#495Self-alignment of a pad and ground in an image sensor
#496Semiconductor device
#497Semiconductor package
#498Semiconductor device and method of manufacturing
#499Semiconductor device and method of manufacture
#500Semiconductor chip and power module, and manufacturing method of the same
#501SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND PACKAGED SEMICONDUCTOR DEVICE
#502Semiconductor logic device and system and method of embedded packaging of same
#503Power package having multiple mold compounds
#504Detection of foreign particles during wire bonding
#505Packaging structure with recessed outer and inner lead surfaces
#506Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#507Heterojunction semiconductor device for reducing parasitic capacitance
#508Semiconductor device
#509Display panel and display device including display panel
#510Semiconductor structure and method for manufacturing the same
#511Semiconductor device and method of manufacture
#512Semiconductor device with a bridge insulation layer
#513Semiconductor copper metallization structure and related methods
#514Structure and method for semiconductor packaging
#515Chemical mechanical polishing for hybrid bonding
#516Semiconductor structure and method for forming the same
#517Semiconductor device
#518Discrete power transistor package having solderless DBC to leadframe attach
#519Package structure having integrated circuit component with conductive terminals of different dimensions
#520Micro-transfer-printable flip-chip structures and methods
#521Conductive clip connection arrangements for semiconductor packages
#522Electronic device
#523Semiconductor device and method of manufacturing the same
#524Electronic component including a conductive pillar and method of manufacturing the same
#525Molded intelligent power module and method of making the same
#526Semiconductor package and manufacturing method thereof
#527Semiconductor device manufacturing method and soldering support jig
#528MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#529Semiconductor device
#530Semiconductor chip and semiconductor device provided with same
#531Semiconductor device with first and second transistors and support part
#532Semiconductor chip and method of processing a semiconductor chip
#533LAND GRID BASED MULTI SIZE PAD PACKAGE
#534Semiconductor device and method for manufacturing the same
#535Semiconductor device and semiconductor element with improved yield
#536Semiconductor device
#537Methods of fluxless micro-piercing of solder balls, and resulting devices
#538Non-destructive testing of integrated circuit chips
#539NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
#540Semiconductor device and semiconductor module
#541Heterojunction semiconductor device for reducing parasitic capacitance
#542Mounting component, semiconductor device using same, and manufacturing method thereof
#543Semiconductor chip
#544METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES
#545Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#546Manufacturing method for semiconductor device and semiconductor device
#547Method of packaging power semiconductor module including power transistors
#548SEMICONDUCTOR COMPONENT HAVING AN ESD PROTECTION DEVICE
#549Power module, power converter and manufacturing method of power module
#550Semiconductor packages
#551Power semiconductor device load terminal
#552Semiconductor device
#553Power module based on multi-layer circuit board
#554Semiconductor device
#555Semiconductor device
#556Semiconductor device comprising PN junction diode and Schottky barrier diode
#5573D chip sharing clock interconnect layer
#558Localized high density substrate routing
#559Semiconductor device assembly with surface-mount die support structures
#560Semiconductor device assembly with die support structures
#561Semiconductor component and method of manufacture
#562Fan-out structure and manufacture thereof
#563Wide-bandgap semiconductor device including gate fingers between bond pads
#564Universal surface-mount semiconductor package
#565Mixed UBM and mixed pitch on a single die
#566Semiconductor chip, semiconductor device, and electronic device
#567Method of fabricating low-profile footed power package
#568Connection pads for low cross-talk vertical wirebonds
#569Semiconductor device and method of manufacturing the same
#570Semiconductor device and method of manufacturing the same
#571SEMICONDUCTOR DEVICE
#572Chip module with spatially limited thermally conductive mounting body
#573Semiconductor structure and manufacturing method thereof
#574Power semiconductor module for an inverter circuit and method of manufacturing the same
#575Semiconductor power device and method for producing same
#576Semiconductor device
#577Method of manufacturing a semiconductor device
#578Semiconductor module
#579Semiconductor device and manufacturing method thereof
#580Half-bridge power semiconductor module and method for manufacturing same
#581Semiconductor device and method of integrating power module with interposer and opposing substrates
#582Semiconductor device
#583Device including a compound semiconductor chip
#584Wrap-around source/drain method of making contacts for backside metals
#585Semiconductor device and method of manufacturing the same
#586Method and structure for wafer level packaging with large contact area
#587Package with metal-insulator-metal capacitor and method of manufacturing the same
#588Semiconductor device and semiconductor device manufacturing method
#589Semiconductor device and semiconductor module provided with same
#590Semiconductor package with heat-dissipating structure and method of manufacturing the same
#591Semiconductor device
#592Semiconductor device
#593Power semiconductor module
#594Semiconductor device comprising PN junction diode and schottky barrier diode
#595Physical topology for a power converter
#596Semiconductor device and a method of manufacturing the same
#597Semiconductor device and electronic apparatus
#598Bond structures and the methods of forming the same
#599Semiconductor copper metallization structure and related methods
#600Semiconductor device