209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Semiconductor device having die pads with exposed surfaces
#602IGBT die structure with auxiliary P well terminal
#603Semiconductor device having a plurality of top surface connection terminals
#604Power module and fabrication method of the same, graphite plate, and power supply equipment
#605Manufacturing method of semiconductor device
#606Semiconductor device including sense insulated-gate bipolar transistor
#607Power semiconductor device
#608Integrated RF front end system
#609Cascode semiconductor package and related methods
#610Semiconductor device
#611Control device with semiconductor module having bent latch, control, power supply and motor control terminals
#612Semiconductor device
#613Flip-chip beamforming integrated circuit with integral thermal mass
#614Beamforming integrated circuit with RF grounded material ring
#615Thermally conductive semiconductor device and manufacturing method thereof
#616Mixed UBM and mixed pitch on a single die
#617Mixed UBM and mixed pitch on a single die
#618Power semiconductor module and method for manufacturing the same
#619Semiconductor device and semiconductor package
#620Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#621Semiconductor device
#622Semiconductor device
#623Compound semiconductor substrate and fabrication method therefor, compound semiconductor device and fabrication method therefor, power supply apparatus and high-output amplifier
#624SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#625Semiconductor device
#626Semiconductor device
#627Method of manufacturing a semiconductor device comprising a semiconductor chip mounted over a metal plate having an inclined surface
#628Integrated circuit die having a split solder pad
#629Power circuit and power module using MISFET having control circuit disposed between gate and source
#630Method of forming a semiconductor device including strain reduced structure
#631Pad structure and manufacturing method thereof
#632Display device for facilitating alignment of a pad of a display panel and an element mounted thereon
#633Power module and motor drive circuit
#634Electronic device including a HEMT
#635Solid state switch system
#636Heterojunction semiconductor device having source and drain pads with improved current crowding
#637Power module, electrical power conversion device, and driving device for vehicle
#638Semiconductor module
#639Conductive connections, structures with such connections, and methods of manufacture
#640Semiconductor device with solders of different melting points and method of manufacturing
#641Isolation between semiconductor components
#642METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#643Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#644Semiconductor device
#645Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#646Semiconductor device, fabrication method for semiconductor device, power supply apparatus and high-frequency amplifier
#647Connector formation methods and packaged semiconductor devices
#648Power module
#649Half-bridge power semiconductor module and method of manufacturing same
#650AlO/InOgate insulator for HEMT
#651Device overvoltage detector
#652Semiconductor module and method of manufacturing semiconductor module
#653Barrier layer for interconnects in 3D integrated device
#654Method of fabricating a circuit module
#655Multi-layer metal pads
#656Semiconductor device and method for manufacturing the same
#657Semiconductor device
#658Leadframe for a semiconductor component
#659Semiconductor package with elastic coupler and related methods
#660Semiconductor device
#661Localized high density substrate routing
#662Power module, power module group, power output stage, and drive system comprising a power output stage
#663Current breaker
#664Die stack assembly using an edge separation structure for connectivity through a die of the stack
#665Semiconductor device and semiconductor device mounting structure having conductor plates
#666Semiconductor device
#667Semiconductor device comprising PN junction diode and schottky barrier diode
#668Semiconductor device with metal patterns having convex and concave sides
#669Semiconductor device having conductive bumps of varying heights
#670Semiconductor device and method of manufacturing semiconductor device
#671Semiconductor device including a clip
#672Display apparatus with curved contacts
#673Semiconductor package
#674Semiconductor device and manufacturing method
#675Semiconductor module and semiconductor driving device
#676Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#677Power conversion device
#678Power semiconductor device load terminal
#679Low switching loss high performance power module
#680Semiconductor device
#681Semiconductor device
#682Power overlay structure and reconstituted semiconductor wafer having wirebonds
#683Power semiconductor device integrated with ESD protection circuit under source pad, drain pad, and/or gate pad
#684Semiconductor device and portable apparatus using the same
#685Multi-channel MCM with test circuitry for inter-die bond wire checking
#686Semiconductor device and semiconductor device manufacturing method
#687Semiconductor device, and method for manufacturing semiconductor device
#688Semiconductor package
#689Method of fabricating low-profile footed power package
#690Semiconductor device and electric power control apparatus
#691Method to improve CMP scratch resistance for non planar surfaces
#692Transistor device with increased gate-drain capacitance
#693Half-bridge power semiconductor module and manufacturing method therefor
#694Heterojunction semiconductor device for reducing parasitic capacitance
#695Power electronic switching device comprising a plurality of potential surfaces
#696Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#697Optimized solder pads for microelectronic components
#698Recessed lead leadframe packages
#699Semiconductor device and method of manufacturing the same
#7003-5 device with doped regions and method of fabricating
#701Connector formation methods and packaged semiconductor devices
#702High-frequency modules
#703Semiconductor device and semiconductor package
#704Semiconductor device and method for producing the same
#705Semiconductor device and method of manufacturing semiconductor device
#706Bonding pad arrangement design for multi-die semiconductor package structure
#707Semiconductor device
#708Semiconductor device and a method of manufacturing the same
#709Multiple-unit semiconductor device
#710Cascode semiconductor package and related methods
#711Semiconductor device
#712Semiconductor device
#713Method for manufacturing wire bonding structure, wire bonding structure, and electronic device
#714SEMICONDUCTOR DEVICE
#715Semiconductor device and method of manufacturing thereof
#716Electrically conductive barriers for integrated circuits
#717Heterojunction semiconductor device for reducing parasitic capacitance
#718Bond pads with differently sized openings
#719Semiconductor module
#720Communicating across galvanic isolation
#721Semiconductor device having a plurality of chips being stacked
#722Semiconductor device
#723Method and structure for wafer level packaging with large contact area
#724Semiconductor component and method of manufacture
#725Semiconductor component and method of manufacture
#726Semiconductor component and method of manufacture
#727Semiconductor component and method of manufacture
#728Integrated RF front end system
#729Semiconductor device comprising PN junction diode and Schottky barrier diode
#730CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#731Semiconductor device
#732Semiconductor package with small gate clip and assembly method
#733Power semiconductor package device having locking mechanism, and preparation method thereof
#734Semiconductor power device and method for producing same
#735Concentric bump design for the alignment in die stacking
#736Electronic device with periphery contact pads surrounding central contact pads
#737Semiconductor device and method of manufacturing semiconductor device
#738Semiconductor device
#739Power semiconductor module
#740Wafer bonding process and structure
#741Semiconductor device
#742Operational gallium nitride devices
#743Power semiconductor module
#744Molded module
#745THERMOCOMPRESSION BONDING WITH RAISED FEATURE
#746Semiconductor device and electrical contact structure thereof
#747Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#748Semiconductor device having a breakdown voltage holding region
#749Half-bridge HEMT circuit and an electronic package including the circuit
#750Bidirectional HEMT and an electronic package including the bidirectional HEMT
#751Electronic device including a bidirectional HEMT
#752Semiconductor device, and alternator and power conversion device which use same
#753Semiconductor device
#754Chip package and manufacturing method thereof
#755Semiconductor module with conductive pin
#756Power circuit and power module using MISFET having control circuit disposed between gate and source
#757Combined packaged power semiconductor device
#758Semiconductor device and method of manufacturing semiconductor device
#759Semiconductor device
#760Integration of heat spreader for beol thermal management
#761Switching device and electronic circuit
#762Compound semiconductor device including a sensing lead
#763Semiconductor devices including control and load leads of opposite directions
#764Semiconductor device and manufacturing method
#765High speed, efficient SiC power module
#766Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#767Method for insulating singulated electronic die
#768Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions
#769Source down semiconductor devices and methods of formation thereof
#770Method of manufacturing semiconductor package and semiconductor package
#771Method of manufacturing semiconductor device and semiconductor device
#772Amplifier
#773Semiconductor device with power transistors coupled to diodes
#774Method of manufacturing semiconductor device
#775Integrated circuit die with corner IO pads
#776Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#777Apparatus and semiconductor structure including a multilayer package substrate
#778Power module and fabrication method for the same
#779Semiconductor device and electronic apparatus of a cascode-coupled system
#780High current, low switching loss SiC power module
#781Semiconductor chip and method of processing a semiconductor chip
#782Localized high density substrate routing
#783Semiconductor device
#784Semiconductor device
#785Isolator with reduced susceptibility to parasitic coupling
#786Semiconductor module
#787Reducing solder pad topology differences by planarization
#788Packaging structure
#789Semiconductor device
#790Semiconductor device
#791Semiconductor device
#792Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#793SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
#794Device package with reduced thickness and method for forming same
#795Semiconductor module
#796Semiconductor device and manufacturing method thereof
#797Electrical connection module, semiconductor module and method for producing a semiconductor module
#798SUBSTRATES AND INTEGRATED CIRCUIT CHIP WITH IMPROVED PATTERN
#799Semiconductor device
#800Semiconductor die arrangement
#801Semiconductor package
#802Semiconductor device comprising a conductive film joining a diode and switching element
#803Power semiconductor module and method for producing a power semiconductor module
#804Method of forming a high electron mobility semiconductor device and structure therefor
#805Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device
#806Bond pad structure for low temperature flip chip bonding
#807Semiconductor component having inner and outer semiconductor component housings
#808Power overlay structure having wirebonds and method of manufacturing same
#809Method of manufacturing a single light-emitting structure
#810Semiconductor packages and modules with integrated ferrite material
#811Semiconductor device
#812Power module with a plurality of patterns with convex and concave side
#813Semiconductor package with small gate clip and assembly method
#814Semiconductor package having cascaded chip stack
#815Method for making a photolithography mask intended for the formation of contacts, mask and integrated circuit corresponding thereto
#816Electronic component
#817Semiconductor device
#818Semiconductor device manufacturing method and semiconductor device
#819Method for manufacturing a chip arrangement
#820Method and structure for wafer level packaging with large contact area
#821Semiconductor module
#822Low-inductance circuit arrangement comprising load current collecting conductor track
#823Electronic circuit, production method thereof, and electronic component
#824Semiconductor device having a breakdown voltage holding region
#825Semiconductor device and method for fabricating the same
#826Semiconductor device
#827Semiconductor chip and method for forming a chip pad
#828Semiconductor device having a mounting member that includes a die pad unit and terminals with multiple conductive regions
#829Semiconductor device and manufacturing method
#830Universal surface-mount semiconductor package
#831Semiconductor device having low on resistance
#832Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#833Contact test structure and method
#834Semiconductor device with a heat-dissipating plate
#835Semiconductor device and a method of manufacturing the same
#836Cascoded semiconductor device
#837Semiconductor device
#838Combined packaged power semiconductor device
#839Semiconductor device
#840Integrated RF front end system
#841Bonding pad arrangment design for multi-die semiconductor package structure
#842Semiconductor device having solderable and bondable electrical contact pads
#843Semiconductor device including sense insulated-gate bipolar transistor
#844Conductive connections, structures with such connections, and methods of manufacture
#845Semiconductor device with notched main lead
#846Ultra-thin semiconductor device and preparation method thereof
#847Semiconductor chip having different conductive pad widths and method of making layout for same
#848Semiconductor device and method of fabricating semiconductor device
#849Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#850Low-profile footed power package
#851Compound semiconductor device and method of manufacturing the same
#852Semiconductor device for reducing propagation time of gate input signals
#853Semiconductor device for reducing gate wiring length
#854Semiconductor module
#855Collapsible probe tower device and method of forming thereof
#856Drive chip and display apparatus
#857Power semiconductor device
#858Operational Gallium Nitride devices
#859Semiconductor device
#860Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#861Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#862Semiconductor device packaging having plurality of wires bonding to a leadframe
#863Semiconductor device
#864Semiconductor device having multiple chips mounted to a carrier
#865Seal ring structure with a metal pad
#866Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements
#867Heterojunction semiconductor device for reducing parasitic capacitance
#868Substrate and package structure
#869Method for manufacturing semiconductor devices having a metallisation layer
#870Method and apparatus for image sensor packaging
#871Substrate design for semiconductor packages and method of forming same
#872Multi-segment monolithic LED chip
#873Electric power semiconductor device
#874Light-emitting device and light-emitting device package
#875Amplifier
#876Semiconductor device
#877Semiconductor device comprising heat dissipating connector
#878Power conversion device
#879Isolation between semiconductor components
#880Semiconductor device having mirror-symmetric terminals and methods of forming the same
#881Semiconductor package with conductive clips
#882Preparation method of a thin power device
#883Method of making stacked multi-chip packaging structure
#884Power module, power converter and manufacturing method of power module
#885GaN based semiconductor light-emitting device and method for producing same
#886Nitride semiconductor device with multi-layer structure electrode having different work functions
#887Light-emitting device including light-emitting diode element that is mounted on outer portion of electrode
#888Electronic device
#889Method and structure for wafer level packaging with large contact area
#890Power semiconductor device to reduce voltage variation between terminals
#891Semiconductor device including a MOSFET and having a super-junction structure
#892Semiconductor device and semiconductor device mounting structure
#893Semiconductor device packages and methods of manufacturing the same
#894Electronic component
#895Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#896Semiconductor device
#897Semiconductor device and manufacturing method thereof
#898Method and system for interleaved boost converter with co-packaged gallium nitride power devices
#899Semiconductor device and method of manufacturing the same
#900Semiconductor device and method for producing semiconductor device