209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Power supply, multi chip module, system in package and non-isolated DC-DC converter
#2102Acceleration sensor
#2103Electronic device and method for fabricating the same
#2104Semiconductor device
#2105Semiconductor package and semiconductor module
#2106Semiconductor device and method of fabricating the same
#2107Semiconductor device with sense structure
#2108Interconnection structure through passive component
#2109Semiconductor apparatus and manufacturing method
#2110Semiconductor device with split pad design
#2111Flip chip contact (FCC) power package
#2112DFN semiconductor package having reduced electrical resistance
#2113Semiconductor device
#2114Semiconductor device
#2115Method of marking a low profile packaged semiconductor device
#2116Manufacturing method of semiconductor device
#2117Semiconductor device and manufacturing method therefor
#2118Semiconductor device and manufacturing method thereof
#2119Housing for power semiconductor modules
#2120Metallization structure over passivation layer for IC chip
#2121Integrated circuit with stacked-die configuration utilizing substrate conduction
#2122Method of fabricating trench MIS device with thick oxide layer in bottom of trench
#2123Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
#2124Semiconductor device
#2125Power semiconductor device
#2126Method for manufacturing semiconductor device
#2127Semiconductor device
#2128Semiconductor chip and tab package having the same
#2129Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
#2130Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
#2131Power amplifier module
#2132Semiconductor wafer and testing method therefor
#2133Integration type semiconductor device and method for manufacturing the same
#2134High-powered light emitting device with improved thermal properties
#2135Structure of mounting electronic component
#2136Semiconductor device and manufacturing process thereof
#2137Power converter
#2138Semiconductor integrated circuit and a semiconductor device
#2139Semiconductor device having element portion and control circuit portion
#2140Power transistor including a leadframe and a semiconductor chip arranged on the leadframe
#2141Semiconductor device
#2142Sustaining circuit with bi-directional device
#2143Vertical MOSFET
#2144Semiconductor device
#2145Semiconductor device
#2146Redistributed solder pads using etched lead frame
#2147Robust power semiconductor package
#2148Semiconductor device with reduced contact resistance
#2149Semiconductor chip, electrically connections therefor
#2150Hermetic semiconductor package
#2151Current detection equipment and semiconductor device
#2152Integrated fet and schottky device
#2153Stacked packages
#2154Power gridding scheme
#2155Power gridding scheme
#2156Apparatus and methods for constructing antennas using wire bonds as radiating elements
#2157Component arrangement having an evaluation circuit for detecting wear on connections
#2158Semiconductor device and a method of manufacturing the same
#2159Probe pad arrangement for an integrated circuit and method of forming
#2160Semiconductor device and a manufacturing method of the same
#2161Active plate-connector device with built-in semiconductor dies
#2162Semiconductor device and method of manufacturing a semiconductor device
#2163Power semiconductor package
#2164Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#2165Stacked semiconductor device and semiconductor memory module
#2166Semiconductor device
#2167Switch elements and a DC/DC converter using the same
#2168Gallium nitride based III-V group compound semiconductor device and method of producing the same
#2169Highly compliant plate for wafer bonding
#2170Low inductance semiconductor device having half-bridge configuration
#2171Method for forming bump on electrode pad with use of double-layered film
#2172Vertical conduction power electronic device package and corresponding assembling method
#2173Light emitting device with transparent substrate having backside vias
#2174Semiconductor device with reduced contact resistance
#2175Bipolar transistor, oscillation circuit, and voltage controlled oscillator
#2176Power composite integrated semiconductor device and manufacturing method thereof
#2177Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#2178Solder flow stops for semiconductor die substrates
#2179Semiconductor device having insulated gate bipolar transistor
#2180Semiconductor light emitting device on insulating substrate and its manufacture method
#2181Semiconductor light-emitting device and fabrication method of the same
#2182Mounting with auxiliary bumps
#2183Leads under chip IC package
#2184Semiconductor device
#2185Semiconductor light emitting device with flexible substrate
#2186Semiconductor device using semiconductor chip
#2187Semiconductor component having multiple stacked dice
#2188Vehicle rotating electric machine
#2189High-frequency amplification device
#2190Method and apparatus for improved power routing
#2191Semiconductor device
#2192Power supply device and switching power supply device
#2193Microelectronic assembly having a redistribution conductor over a microelectronic die
#2194Semiconductor device, magnetic sensor, and magnetic sensor unit
#2195Power semiconductor module
#2196Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes
#2197Surface mounted package with die bottom spaced from support board
#2198Leadless semiconductor package and manufacturing method thereof
#2199Semiconductor device for power MOS transistor module
#2200Self-coplanarity bumping shape for flip-chip
#2201Self-coplanarity bumping shape for flip chip
#2202Semiconductor device with non-overlapping chip mounting sections
#2203Semiconductor apparatus with improved yield
#2204Semiconductor device and method of manufacturing the same
#2205Semiconductor light emitting device capable of suppressing silver migration of reflection film made of silver
#2206Trench-gate semiconductor device and method of manufacturing
#2207Semiconductor chip and display device using the same
#2208Flip chip light-emitting diode package
#2209Manufacturing and testing of electrostatic discharge protection circuits
#2210Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement
#2211Package structure with two solder arrays
#2212Semiconductor package
#2213Multi-chip package structure
#2214Driver chip and display apparatus having the same
#2215Testable electrostatic discharge protection circuits
#2216Semiconductor device
#2217Semiconductor light emitting device
#2218Microelectronic packages and methods therefor
#2219Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#2220Microelectronic assembly having array including passive elements and interconnects
#2221Trench-gate semiconductor devices
#2222Power module
#2223Surface mountable hermetically sealed package
#2224Architecture for power modules such as power inverters
#2225Driver chip and display apparatus having the same
#2226Hermetic surface mounted power package
#2227Semiconductor device
#2228Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same
#2229Semiconductor device
#2230Semiconductor light emitting element
#2231Semiconductor device
#2232Inter-dice signal transfer methods for integrated circuits
#2233Low profile package having multiple die
#2234Semiconductor device
#2235Surface mount package
#2236Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#2237Strobe light control circuit and IGBT device
#2238High-frequency device
#2239Method for manufacturing metal structure having different heights
#2240Various structure/height bumps for wafer level-chip scale package
#2241Method and apparatus for improved power routing
#2242Lead frame structure with aperture or groove for flip chip in a leaded molded package
#2243Semiconductor component arrangement with an insulating layer having nanoparticles
#2244P and N contact pad layout designs of GaN based LEDs for flip chip packaging
#2245High power flip chip LED
#2246Inverted J-lead for power devices
#2247Semiconductor device and method for fabricating the same
#2248Semiconductor device manufacturing method and semiconductor device manufactured thereby
#2249Semiconductor device
#2250Chip package and electrical connection structure between chip and substrate
#2251Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
#2252Bonding structure with buffer layer and method of forming the same
#2253Method for mounting semiconductor chip and semiconductor chip-mounted board
#2254Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#2255Circuit device and manufacturing method thereof
#2256Fabrication method of semiconductor integrated circuit device
#2257Method of mounting a circuit component and joint structure therefor
#2258Electrode structure, and semiconductor light-emitting device having the same
#2259Chip package and electrical connection structure between chip and substrate
#2260Cellular mosfet devices and their manufacture
#2261Insulated gate type semiconductor device and method for fabricating the same
#2262Semiconductor laser device
#2263Die pillar structures and a method of their formation
#2264Package type semiconductor device
#2265Transistor having multiple gate pads
#2266Semiconductor device with peripheral trench
#2267Light emitting device assembly
#2268Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
#2269Light-emitting device
#2270Semiconductor device with staggered electrodes and increased wiring width
#2271Semiconductor module with scalable construction
#2272Power module having a heat sink
#2273Semiconductor device
#2274Semiconductor device and a method of manufacturing the same
#2275Optical semiconductor device and method of manufacturing the same
#2276Protection circuit device using MOSFETs and a method of manufacturing the same
#2277Integrated FET and schottky device
#2278Semiconductor device and a method of manufacturing the same
#2279Low-inductance circuit arrangement for power semiconductor modules
#2280Semiconductor device and semiconductor device manufacturing method
#2281Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
#2282Structure of multi-tier wire bonding for high frequency integrated circuit
#2283Semiconductor device and switching element
#2284High frequency power amplifier module and semiconductor integrated circuit device
#2285Acentric non-round electrical interconnections
#2286Electromigration resistant and profile consistent contact arrays
#2287Electrostatic discharge protection devices including a field-induced switching element
#2288Self-alignment of a pad and ground in an image sensor
#2289Semiconductor package
#2290Mixed UBM and mixed pitch on a single die