209546 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Structure Bonding areas having different sizes, e.g. different heights or widths
Manufacturing method for semiconductor device containing stacked semiconductor chips
#1802Semiconductor device
#1803Bonding structure with buffer layer and method of forming the same
#1804Power semiconductor packaging method and structure
#1805Device configuration and method to manufacture trench MOSFET with solderable front metal
#1806Semiconductor subassemblies with interconnects and methods for manufacturing the same
#1807Semiconductor device
#1808Downhill Wire Bonding for QFN L - Lead
#1809Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same
#1810Electronic system with expansion feature
#1811Temperature sensing device
#1812POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE
#1813Methods of packaging a semiconductor die and package formed by the methods
#1814Manufacturing method of semiconductor device
#1815SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1816Semiconductor device
#1817Structure and method for self protection of power device with expanded voltage ranges
#1818Semiconductor device having vertical MOSFET
#1819Integration type semiconductor device and method for manufacturing the same
#1820Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof
#1821Semiconductor module including semiconductor chips coupled to external contact elements
#1822Trenched semiconductor device
#1823Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#1824Interconnect for chip level power distribution
#1825Integrated circuit device and method for the production thereof
#1826Semiconductor light-emitting device
#1827Flux for soldering and soldering process
#1828Semiconductor device
#1829Semiconductor device with different sized ESD protection elements
#1830Module comprising a semiconductor chip
#1831Semiconductor device with Al pad
#1832Flip chip semiconductor device including an unconnected neutralizing electrode
#1833Semiconductor package
#1834Insulated gate semiconductor device
#1835Semiconductor module with multiple semiconductor chips
#1836Semiconductor module having deflecting conductive layer over a spacer structure
#1837Semiconductor module with semiconductor chips and method for producing it
#1838Vertically mountable semiconductor device package
#1839Leadframe-based semiconductor package and fabrication method thereof
#1840Space-efficient package for laterally conducting device
#1841Semiconductor device
#1842Electronic component structure and method of making
#1843High current semiconductor power device SOIC package
#1844Electronic component and method for manufacturing an electronic component
#1845Bond quality indication by bump structure on substrate
#1846Multi-chip module
#1847Module with silicon-based layer
#1848SEMICONDUCTOR PACKAGE
#1849Semiconductor and Method For Producing the Same
#1850Semiconductor die package including leadframe with die attach pad with folded edge
#1851Semiconductor device including switching element and two diodes
#1852Driver chip and display apparatus having the same
#1853Chip having side pad, method of fabricating the same and package using the same
#1854Semiconductor device having a high frequency electrode positioned with a via hole
#1855Pre-molded clip structure
#1856SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#1857Semiconductor device and package including the same
#1858Power device package
#1859Insulated gate type semiconductor device and method for fabricating the same
#1860Voltage regulator integrated with semiconductor chip
#1861Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same
#1862Microelectronic packages having improved input/output connections and methods therefor
#1863SEMICONDUCTOR DEVICE
#1864Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#1865Semiconductor apparatus and manufacturing method of semiconductor apparatus
#1866Tubular-shaped bumps for integrated circuit devices and methods of fabrication
#1867Interconnects for semiconductor light emitting devices
#1868Semiconductor device having zener diode and method for manufacturing the same
#1869SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1870Semiconductor storage device with first and second pads arranged in proximity with first to fourth output transistors for reducing an excess region
#1871Power supply device and switching power supply device
#1872Semiconductor chip and TAB package having the same
#1873Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof
#1874Semiconductor device
#1875SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE
#1876Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
#1877Radiation hardened lateral MOSFET structure
#1878PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE
#1879Light-emitting device
#1880Semiconductor device and a method of manufacturing the same
#1881Semiconductor device and a method of manufacturing the same
#1882SEMICONDUCTOR DEVICE
#1883Semiconductor Device and Method of Fabricating the Same
#1884Microelectronic packages fabricated at the wafer level and methods therefor
#1885Semiconductor package preventing generation of static electricity therein
#1886Method of providing solder bumps on a substrate using localized heating
#1887BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME
#1888Semiconductor device
#1889Insulated-gate semiconductor device
#1890Insulated-gate semiconductor device and PN junction diodes
#1891Process of fabricating a semiconductor package
#1892Structure of mounting electronic component
#1893Methods and substrates to connect an electrical member to a substrate to form a bonded structure
#1894Semiconductor component having a semiconductor die and a leadframe
#1895Compact impedance transformation circuit
#1896Structure of wafer level package with area bump
#1897Semiconductor chip and method for fabricating the same
#1898Power electronic package having two substrates with multiple electronic components
#1899Microball placement solutions
#1900Multi-chip module
#1901FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
#1902Electronic Device and Package Used for the Same
#1903DIE PAD ARRANGEMENT AND BUMPLESS CHIP PACKAGE APPLYING THE SAME
#1904Integrated circuit including clip
#1905Power semiconductor component
#1906Method for setting a reference potential of a current sensor and arrangement for determining the reference potential of a power semiconductor device
#1907WIREBOND-LESS SEMICONDUCTOR PACKAGE
#1908Semiconductor device and method of manufacturing the same
#1909Semiconductor device
#1910FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1911Semiconductor device with reduced contact resistance
#1912Interconnect structure for semiconductor package
#1913Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
#1914Semiconductor with reduced pad pitch
#1915Semiconductor device and method of manufacturing the same
#1916Copper bonding compatible bond pad structure and method
#1917Electronic module with switching functions and method for producing the same
#1918Method of providing mixed size solder bumps on a substrate using a solder delivery head
#1919Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#1920Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method
#1921Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#1922Structure and method for producing multiple size interconnections
#1923Semiconductor package having dimpled plate interconnections
#1924Bond wireless power module with double-sided single device cooling and immersion bath cooling
#1925Chip and flat panel display apparatus comprising the same
#1926Mounting integrated circuit dies for high frequency signal isolation
#1927Power semiconductor device connected in distinct layers of plastic
#1928Semiconductor device
#1929Interconnections resistant to wicking
#1930SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#1931GaN-based semiconductor light-emitting device, light illuminator, image display planar light source device, and liquid crystal display assembly
#1932HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#1933Semiconductor package structure having enhanced thermal dissipation characteristics
#1934Semiconductor integrated circuit device
#1935Semiconductor device and method for manufacturing the same
#1936Semiconductor device with reduced parasitic inductance
#1937Non-cyanide gold electroplating for fine-line gold traces and gold pads
#1938Optically coupled semiconductor device and electronic device
#1939Dual MOSFET package
#1940Electronic component having a semiconductor power device
#1941Copper straps
#1942Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
#1943Insulated gate semiconductor device
#1944Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device
#1945Increased interconnect density electronic package and method of fabrication
#1946Power semiconductor module as H-bridge circuit and method for producing the same
#1947Method of manufacturing semiconductor apparatus
#1948Semiconductor die package including multiple dies and a common node structure
#1949Filter device substrate and filter device
#1950Power semiconductor component, power semiconductor device as well as methods for their production
#1951Semiconductor power module including epoxy resin coating
#1952High reliability power module
#1953MOSFET power package
#1954Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test
#1955Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
#1956Power supply device and switching power supply device
#1957Power semiconductor component with a power semiconductor chip and method for producing the same
#1958Semiconductor device including a DC-DC converter
#1959Semiconductor device and medium of fabricating the same
#1960Circuit configuration and method to reduce ringing in the semiconductor power switching circuits
#1961Semiconductor integrated circuit device
#1962Electronic component having exposed surfaces
#1963Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#1964Semiconductor device and method of manufacturing the same
#1965Semiconductor device
#1966Thin film capacitor device used for a decoupling capacitor and having a resistor inside
#1967Method for diffusion soldering
#1968Semiconductor package
#1969Semiconductor device
#1970Chip underfill in flip-chip technologies
#1971Semiconductor device and manufacturing the same
#1972Redistributed solder pads using etched lead frame
#1973RF module including control IC without the aid of a relay pad
#1974Hermetically sealed ceramic package
#1975Power composite integrated semiconductor device and manufacturing method thereof
#1976Semiconductor device
#1977Vehicle Rotating Electric Machine
#1978Wiring board with conductive wirings and protrusion electrodes
#1979Semiconductor device having through contact blocks with external contact areas
#1980Semiconductor device with visible indicator and method of fabricating the same
#1981Gallium nitride based III-V group compound semiconductor device and method of producing the same
#1982Semiconductor device
#1983Semiconductor apparatus manufacturing method
#1984Semiconductor device with surface-mountable external contacts and method for manufacturing the same
#1985Electronic component and method for its assembly
#1986Semiconductor package with integrated heatsink and electromagnetic shield
#1987Power conversion device
#1988Method for manufacturing mold type semiconductor device
#1989Multi-chip package system
#1990Device for implementing an inverter having a reduced size
#1991Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
#1992System to wirebond power signals to flip-chip core
#1993Vertical power semiconductor component, semiconductor device and methods for the production thereof
#1994Semiconductor device having a metal plate conductor
#1995Semiconductor device and method for producing the same
#1996Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#1997Optimized contact design for thermosonic bonding of flip-chip devices
#1998Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#1999Method of manufacturing semiconductor device
#2000Package for high power density devices
#2001Semiconductor device with thermoplastic resin to reduce warpage
#2002Semiconductor package structure and method of manufacture
#2003Power module structure and solid state relay using same
#2004Space-efficient package for laterally conducting device
#2005Apparatus and clocked method for pressure-sintered bonding
#2006Light emitting device
#2007Bonding structure with buffer layer and method of forming the same
#2008Circuit arrangement comprising having plurality of half bridges
#2009Semiconductor device and a method of manufacturing the same
#2010Rugged MESFET for Power Applications
#2011Power module
#2012Insulated gate type semiconductor device and method for fabricating the same
#2013SEMICONDUCTOR DEVICE
#2014Integrated circuit package system including ribbon bond interconnect
#2015Semiconductor device
#2016Semiconductor device including a particular dummy terminal
#2017Semiconductor device featuring electrode terminals forming superior heat-radiation system
#2018Semiconductor component and method for production of a semiconductor component
#2019Semiconductor device and power supply device using the same
#2020Production process for manufacturing such semiconductor package
#2021Electronic module and method of assembling the same
#2022Power semiconductor device in lead frame employing connecting element with conductive film
#2023Semiconductor device and a method of manufacturing the same
#2024Microelectronic packages and methods therefor
#2025Semiconductor device and radiation detector employing it
#2026Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die
#2027Integrated circuit solder bumping system
#2028Power semiconductor module with MOS chip
#2029Semiconductor package having plate interconnections
#2030Semiconductor component and method of assembling the same
#2031Interconnects for semiconductor light emitting devices
#2032Bonding structure with buffer layer and method of forming the same
#2033Semiconductor device and method of manufacturing the same
#2034Multi-chip package type semiconductor device
#2035Bumpless chip package
#2036Semiconductor power component with a vertical current path through a semiconductor power chip
#2037Bi-directional switch, and use of said switch
#2038Semiconductor connection component
#2039Semiconductor device and capacitance regulation circuit
#2040Semiconductor device and capacitance regulation circuit
#2041Semiconductor component and method of manufacture
#2042Insulated gate semiconductor device and manufacturing method thereof
#2043Bonding pad on IC substrate and method for making the same
#2044Connection element for a semiconductor component and method for producing the same
#2045Method for mounting electronic element on a circuit board
#2046Die pad arrangement and bumpless chip package applying the same
#2047Direct FET device for high frequency application
#2048Light-emitting-diode packaging structure having thermal-electric element
#2049Structure and method for producing multiple size interconnections
#2050Surface mount package
#2051Light-emitting device
#2052Semiconductor device
#2053Semiconductor half-bridge module with low inductance
#2054Lead frame structure with aperture or groove for flip chip in a leaded molded package
#2055Wafer and single chip having circuit rearranged structure and method for fabricating the same
#2056Gate contact and runners for high density trench MOSFET
#2057Trenched MOSFET device with contact trenches filled with tungsten plugs
#2058Source contact and metal scheme for high density trench MOSFET
#2059Semiconductor device having capacitive insulation means and communication terminal using the device
#2060Encapsulated power semiconductor assembly
#2061Semiconductor device
#2062Methods of making integrated circuits
#2063High power semiconductor device capable of preventing parasitical bipolar transistor from turning on
#2064Light emitting apparatus and method of manufacturing the same
#2065Semiconductor device
#2066Semiconductor device packages with substrates for redistributing semiconductor device electrodes
#2067Semiconductor device and manufacturing method of the same
#2068Method of bonding solder pads of flip-chip package
#2069Semiconductor device including wire bonding pads and pad layout method
#2070Semiconductor device and manufacturing method of the same
#2071Semiconductor component in a housing with mechanically inforcing flat conductor webs
#2072Electrode structure, and semiconductor light-emitting device having the same
#2073Semiconductor device having power transistors and Schottky barrier diode
#2074Semiconductor package
#2075System having semiconductor component with multiple stacked dice
#2076Device packages having a III-nitride based power semiconductor device
#2077Semiconductor device having surface mountable external contact areas and method for producing the same
#2078Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink
#2079Semiconductor device and chip-stack semiconductor device
#2080Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#2081Semiconductor device
#2082Power semiconductor module
#2083Semiconductor device and method of manufacturing semiconductor device
#2084Strobe light control circuit and IGBT device
#2085Leadless semiconductor package and manufacturing method thereof
#2086Semiconductor device with extraction electrode
#2087Forming solder balls on substrates
#2088Semiconductor package fabrication
#2089Current regulator having a transistor and a measuring resistor
#2090Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
#2091Semiconductor device, magnetic sensor, and magnetic sensor unit
#2092Semiconductor flip chip package having substantially non-collapsible spacer
#2093High frequency semiconductor device
#2094High reflectivity p-contacts for group lll-nitride light emitting diodes
#2095Semiconductor device
#2096Semiconductor device with semiconductor chip mounted in package
#2097Semiconductor device and manufacturing process therefor
#2098Optical guide and surface light emitting apparatus using the same
#2099Semiconductor device
#2100Semiconductor device and method of manufacturing the same