209549 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas Disposition
Sub-classes:SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR PACKAGE WITH INCREASED THERMAL RADIATION EFFICIENCY
#3SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS
#5SEMICONDUCTOR DEVICE
#6METHOD OF MAKING SEMICONDUCTOR STRUCTURE INCLUDING BUFFER LAYER
#7NONVOLATILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME
#8SEMICONDUCTOR DEVICE
#9Semiconductor packages with pass-through clock traces and associated systems and methods
#10Semiconductor package
#11Silicon photonic interposer with two metal redistribution layers
#12Semiconductor package with increased thermal radiation efficiency
#13Semiconductor structure including buffer layer
#14Method of designing a layout, method of making a semiconductor structure and semiconductor structure
#15Semiconductor device
#16Chip packages and methods of manufacture thereof
#17Multiple sized bump bonds
#18Semiconductor device with post passivation structure
#19Semiconductor device with post passivation structure and fabrication method therefor
#20Semiconductor device
#21Chip packages and methods of manufacture thereof
#22Method of manufacturing connector structures of integrated circuits
#23Memory module in a package
#24Electrical connections for chip scale packaging
#25Semiconductor memory device having pads
#26Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#27Package systems
#28Connector structures of integrated circuits
#29Semiconductor device and manufacturing method thereof
#30Electrical connections for chip scale packaging
#31Semiconductor memory device having pads
#32Semiconductor memory device having pads
#33Semiconductor device including asymmetric electrode arrangement
#34Memory module in a package
#35Connector structures of integrated circuits
#36Package systems and manufacturing methods thereof
#37Wire bond splash containment
#38Electrical connections for chip scale packaging
#39Offset of contact opening for copper pillars in flip chip packages
#40Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump
#41Electronic device and method for fabricating an electronic device
#42Connector structures of integrated circuits
#43Electrical connection for chip scale packaging
#44Metal pad structures in dies
#45Bond pad configurations for semiconductor dies
#46Memory module in a package
#47Buffer pad in solder bump connections and methods of manufacture
#48Semiconductor device having a bus configuration which reduces electromigration
#49Ni plating of a BLM edge for Pb-free C4 undercut control
#50Ni plating of a BLM edge for Pb-free C4 undercut control
#51Power/ground layout for chips
#52Package systems having a eutectic bonding material and manufacturing methods thereof
#53Package systems having an opening in a substrate thereof and manufacturing methods thereof
#54Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device
#55Package substrate having main dummy pattern located in path of stress
#56Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
#57Redistribution layer enhancement to improve reliability of wafer level packaging
#58Electronic component mounting structure
#59Semiconductor memory device having pads
#60Device mounting board and manufacturing method therefor, and semiconductor module
#61Redistribution connecting structure of solder balls