Patents-Review.com
ClassID:

209550 ⎘

H01L2224/06102 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas; Disposition the bonding areas being at different heights

Recent Application in this class:
#1
20260040945
2026-02-05

SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE

 #2
20260005172
2026-01-01

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #3
20250379169
2025-12-11

SEMICONDUCTOR SUBSTRATES, SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME

 #4
20250357403
2025-11-20

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

 #5
20250357394
2025-11-20

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

 #6
20250336858
2025-10-30

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

 #7
20250293185
2025-09-18

SEMICONDUCTOR PACKAGE

 #8
20250239578
2025-07-24

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORMING THE SAME

 #9
20250233115
2025-07-17

Semiconductor Packages and Methods of Forming Same

 #10
20250125284
2025-04-17

ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK

 #11
20250096117
2025-03-20

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHODS OF FABRICATION

 #12
20250087614
2025-03-13

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF MANUFACTURING THE SAME

 #13
20240355766
2024-10-24

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

 #14
20240347511
2024-10-17

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS

 #15
20240297130
2024-09-05

METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE

 #16
20240274559
2024-08-15

ELECTRONIC DEVICE

 #17
20240266308
2024-08-08

SEMICONDUCTOR DEVICE

 #18
20240113095
2024-04-04

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

 #19
20240113094
2024-04-04

GALVANIC ISOLATION DEVICE

 #20
20240113042
2024-04-04

SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE

 #21
20240096760
2024-03-21

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #22
20240071942
2024-02-29

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

 #23
20230420411
2023-12-28

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES

 #24
20230411323
2023-12-21

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #25
20230402418
2023-12-14

Bump coplanarity for semiconductor device assembly and methods of manufacturing the same

 #26
20230335695
2023-10-19

Light-emitting device, manufacturing method thereof and display module using the same

 #27
20230317648
2023-10-05

Semiconductor Devices and Methods of Manufacture

 #28
20230207490
2023-06-29

SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES

 #29
20230163089
2023-05-25

SEMICONDUCTOR PACKAGES

 #30
20230154886
2023-05-18

Semiconductor package including semiconductor chips

 #31
20230088776
2023-03-23

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip

 #32
20230057560
2023-02-23

Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same

 #33
20220328439
2022-10-13

DISPLAY DEVICE

 #34
20220310540
2022-09-29

Silicon photonic interposer with two metal redistribution layers

 #35
20220285323
2022-09-08

Semiconductor packages and methods of forming same

 #36
20220238503
2022-07-28

DISPLAY MODULE

 #37
20220199579
2022-06-23

3D package configuration

 #38
20220130793
2022-04-28

Semiconductor package including semiconductor chips

 #39
20220059492
2022-02-24

Semiconductor package for improving reliability

 #40
20220059485
2022-02-24

Bump coplanarity for semiconductor device assembly and methods of manufacturing the same

 #41
20220037285
2022-02-03

MULTI-CHIP PACKAGE

 #42
20220028832
2022-01-27

Multi-chip package structure having dummy pad disposed between input/output units

 #43
20220028831
2022-01-27

Multi-chip package structure having dummy pad disposed between input/output units

 #44
20210305346
2021-09-30

Display device having side surface connection pads

 #45
20210288232
2021-09-16

Light-emitting device, manufacturing method thereof and display module using the same

 #46
20210249374
2021-08-12

Electronic circuit connection method and electronic circuit

 #47
20210233822
2021-07-29

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

 #48
20210183801
2021-06-17

Semiconductor package

 #49
20210126176
2021-04-29

Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip

 #50
20210111145
2021-04-15

Semiconductor package and manufacturing method thereof

 #51
20210104481
2021-04-08

Semiconductor apparatus and equipment

 #52
20210035890
2021-02-04

Semiconductor package and manufacturing method thereof

 #53
20210013144
2021-01-14

Semiconductor device and method of manufacturing a semiconductor device

 #54
20200411482
2020-12-31

Thermal pads between stacked semiconductor dies and associated systems and methods

 #55
20200343224
2020-10-29

Semiconductor packages and methods of forming same

 #56
20200313059
2020-10-01

Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip

 #57
20200284410
2020-09-10

Illumination device

 #58
20200266177
2020-08-20

Light-emitting device, manufacturing method thereof and display module using the same

 #59
20200098949
2020-03-26

Light-emitting diode and application therefor

 #60
20200051951
2020-02-13

Device package including molding compound having non-planar top surface around a die and method of forming same

 #61
20190385886
2019-12-19

Micro-transfer-printable flip-chip structures and methods

 #62
20190267528
2019-08-29

Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip

 #63
20190267354
2019-08-29

Semiconductor packages and methods of forming same

 #64
20190259724
2019-08-22

Dummy flip chip bumps for reducing stress

 #65
20190257503
2019-08-22

Illumination device

 #66
20190245114
2019-08-08

Component with geometrically adapted contact structure and method for producing the same

 #67
20190229098
2019-07-25

Light-emitting device, manufacturing method thereof and display module using the same

 #68
20190206820
2019-07-04

Methods for bump planarity control

 #69
20190189574
2019-06-20

Semiconductor chip and method for forming a chip pad

 #70
20190172811
2019-06-06

Line-integrated switch and method for producing a line-integrated switch

 #71
20190164922
2019-05-30

Semiconductor package

 #72
20190088526
2019-03-21

Micro-transfer-printable flip-chip structures and methods

 #73
20190074197
2019-03-07

Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface

 #74
20190067230
2019-02-28

Electronic component including a conductive pillar and method of manufacturing the same

 #75
20190067169
2019-02-28

Semiconductor package and manufacturing method thereof

 #76
20190013289
2019-01-10

Semiconductor package device and method of manufacturing the same

 #77
20190006323
2019-01-03

Thermal pads between stacked semiconductor dies and associated systems and methods

 #78
20190006299
2019-01-03

METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES

 #79
20180337116
2018-11-22

Semiconductor structure having bump on tilting upper corner surface

 #80
20180306420
2018-10-25

Illumination device

 #81
20180218990
2018-08-02

Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure

 #82
20180123011
2018-05-03

Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip

 #83
20180069073
2018-03-08

Semiconductor device and method of manufacturing the same

 #84
20180068910
2018-03-08

Method of manufacturing semiconductor device and semiconductor device

 #85
20180040577
2018-02-08

Pad structure and manufacturing method thereof

 #86
20180033767
2018-02-01

Device package including molding compound having non-planar top surface around a die

 #87
20180026157
2018-01-25

Ultraviolet reflective rough adhesive contact

 #88
20180019370
2018-01-18

LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING

 #89
20180019191
2018-01-18

Conductive connections, structures with such connections, and methods of manufacture

 #90
20180012830
2018-01-11

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

 #91
20170345739
2017-11-30

Advanced through substrate via metallization in three dimensional semiconductor integration

 #92
20170345738
2017-11-30

Advanced through substrate via metallization in three dimensional semiconductor integration

 #93
20170309588
2017-10-26

Dummy flip chip bumps for reducing stress

 #94
20170243890
2017-08-24

Display apparatus with curved contacts

 #95
20170221801
2017-08-03

Multi-terminal device packaging using metal sheet

 #96
20170200661
2017-07-13

Wafers having a die region and a scribe-line region adjacent to the die region

 #97
20170179062
2017-06-22

Semiconductor package

 #98
20170176804
2017-06-22

Display panel and display device including the same

 #99
20170162526
2017-06-08

Method to improve CMP scratch resistance for non planar surfaces

 #100
20170062686
2017-03-02

Method of making layered structure with metal layers using resist patterns and electrolytic plating

 #101
20170062292
2017-03-02

Method of manufacturing semiconductor device and semiconductor device

 #102
20160372406
2016-12-22

Electronic device with periphery contact pads surrounding central contact pads

 #103
20160358872
2016-12-08

Semiconductor package and method of manufacturing thereof

 #104
20160336286
2016-11-17

Conductive connections, structures with such connections, and methods of manufacture

 #105
20160181216
2016-06-23

Reducing solder pad topology differences by planarization

 #106
20160181168
2016-06-23

Environmental hardened packaged integrated circuit

 #107
20160172544
2016-06-16

Ultraviolet reflective rough adhesive contact

 #108
20160172329
2016-06-16

Interconnect structures for wafer level package and methods of forming same

 #109
20160148888
2016-05-26

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME

 #110
20160148887
2016-05-26

Device package with reduced thickness and method for forming same

 #111
20160126408
2016-05-05

LED having vertical contacts redistributed for flip chip mounting

 #112
20160111354
2016-04-21

Electronic device with first and second contact pads and related methods

 #113
20160087179
2016-03-24

Wafer-level flip chip device packages and related methods

 #114
20160087025
2016-03-24

Semiconductor device and method of manufacturing the same

 #115
20160075552
2016-03-17

Component which can be produced at wafer level and method of production

 #116
20160027754
2016-01-28

Semiconductor device

 #117
20160027746
2016-01-28

Semiconductor chip and method for forming a chip pad

 #118
20160020578
2016-01-21

Semiconductor laser structure

 #119
20150364443
2015-12-17

Device electrode formation using metal sheet

 #120
20150349225
2015-12-03

Light emitting device package

 #121
20150340271
2015-11-26

GaN power device with solderable back metal

 #122
20150325543
2015-11-12

Conductive connections, structures with such connections, and methods of manufacture

 #123
20150325507
2015-11-12

Conductive connections, structures with such connections, and methods of manufacture

 #124
20150287724
2015-10-08

Semiconductor device with output circuit and pad arrangements

 #125
20150221607
2015-08-06

Semiconductor device and manufacturing method thereof

 #126
20150209914
2015-07-30

Anisotropic conductive adhesive

 #127
20150171038
2015-06-18

Bump structures for semiconductor package

 #128
20150162395
2015-06-11

Semiconductor device and method of manufacturing the same

 #129
20150108579
2015-04-23

Semiconductor devices with output circuit and pad

 #130
20150076551
2015-03-19

Methods of fabricating wafer-level flip chip device packages

 #131
20150063745
2015-03-05

Optical coupling module

 #132
20150061084
2015-03-05

Substrate, method of fabricating the same, and application the same

 #133
20150044864
2015-02-12

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

 #134
20150035049
2015-02-05

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

 #135
20150008475
2015-01-08

Light emmiting diode chip

 #136
20150001573
2015-01-01

Light emitting device package

 #137
20150001465
2015-01-01

Electronic devices with yielding substrates

 #138
20140327101
2014-11-06

Image pickup device and method for producing the same

 #139
20140312390
2014-10-23

Layout structure of heterojunction bipolar transistors

 #140
20140246790
2014-09-04

Floating bond pad for power semiconductor devices

 #141
20140210074
2014-07-31

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

 #142
20140167254
2014-06-19

Bump structures for semiconductor package

 #143
20140124914
2014-05-08

Semiconductor packaging structure and method

 #144
20140117535
2014-05-01

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

 #145
20140091348
2014-04-03

Encapsulating sheet-covered semiconductor element and semiconductor device

 #146
20140077344
2014-03-20

Semiconductor device with protective layer over exposed surfaces of semiconductor die

 #147
20140061897
2014-03-06

Bump structures for semiconductor package

 #148
20140061710
2014-03-06

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

 #149
20140048940
2014-02-20

Conductive lines and pads and method of manufacturing thereof

 #150
20140021479
2014-01-23

GaN power device with solderable back metal

 #151
20140015088
2014-01-16

Three-dimensional integrated structure capable of detecting a temperature rise

 #152
20130334697
2013-12-19

Integrated circuit packaging system with through silicon via and method of manufacture thereof

 #153
20130334563
2013-12-19

LED having vertical contacts redistruted for flip chip mounting

 #154
20130328172
2013-12-12

Wafer-level flip chip device packages and related methods

 #155
20130299848
2013-11-14

Semiconductor packages and methods of formation thereof

 #156
20130248916
2013-09-26

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

 #157
20130214310
2013-08-22

Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

 #158
20130187271
2013-07-25

Semiconductor device and method of manufacturing the same

 #159
20130161788
2013-06-27

Semiconductor package including stacked semiconductor chips and a redistribution layer

 #160
20130127364
2013-05-23

Front facing piggyback wafer assembly

 #161
20130127048
2013-05-23

Device having electrodes formed from bumps with different diameters

 #162
20130082382
2013-04-04

SEMICONDUCTOR DEVICE

 #163
20130069229
2013-03-21

Package substrate and semiconductor package including the same

 #164
20130065331
2013-03-14

Mounting method for semiconductor light emitter using resist with openings of different sizes

 #165
20130043583
2013-02-21

Dummy flip chip bumps for reducing stress

 #166
20130026630
2013-01-31

FLIP CHIPS HAVING MULTIPLE SOLDER BUMP GEOMETRIES

 #167
20120292757
2012-11-22

Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof

 #168
20120280385
2012-11-08

Electronic device packaging structure

 #169
20120273952
2012-11-01

Microelectronic chip, component containing such a chip and manufacturing method

 #170
20120273823
2012-11-01

Method of manufacturing nitride semiconductor light emitting element having thick metal bump

 #171
20120267781
2012-10-25

Mechanisms for forming copper pillar bumps using patterned anodes

 #172
20120267675
2012-10-25

LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME

 #173
20120267648
2012-10-25

Light-emitting diode die packages and illumination apparatuses using same

 #174
20120261709
2012-10-18

Light-emitting diode die packages and illumination apparatuses using same

 #175
20120248604
2012-10-04

Selective electromigration improvement for high current C4s

 #176
20120241801
2012-09-27

FLIP-CHIP LED PACKAGING AND MANUFACTURING THEREOF

 #177
20120217496
2012-08-30

Electronic devices with yielding substrates

 #178
20120199990
2012-08-09

Semiconductor module having deflecting conductive layer over a spacer structure

 #179
20120193672
2012-08-02

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

 #180
20120161189
2012-06-28

Light-emitting diode die package and method for producing same

 #181
20120161169
2012-06-28

Light-emitting diode die package and method for producing same

 #182
20120129333
2012-05-24

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

 #183
20120122311
2012-05-17

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

 #184
20120107988
2012-05-03

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

 #185
20120094407
2012-04-19

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

 #186
20120045871
2012-02-23

Method of manufacturing semiconductor package

 #187
20120043654
2012-02-23

Mechanisms for forming copper pillar bumps using patterned anodes

 #188
20120032259
2012-02-09

Bottom source power MOSFET with substrateless and manufacturing method thereof

 #189
20120025373
2012-02-02

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

 #190
20120013011
2012-01-19

Conductive lines and pads and method of manufacturing thereof

 #191
20120012990
2012-01-19

Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die

 #192
20120003830
2012-01-05

Method for manufacture of integrated circuit package system with protected conductive layers for pads

 #193
20110316126
2011-12-29

Semiconductor element and method of manufacturing the semiconductor element

 #194
20110315956
2011-12-29

Electronic devices with yielding substrates

 #195
20110291245
2011-12-01

Semiconductor device with substrate-side exposed device-side electrode and method of fabrication

 #196
20110233765
2011-09-29

Semiconductor device and method of manufacturing the same

 #197
20110221058
2011-09-15

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

 #198
20110204325
2011-08-25

Light-emitting device, light-emitting element and method of manufacturing same

 #199
20110198745
2011-08-18

Wafer-level packaged device having self-assembled resilient leads

 #200
20110198635
2011-08-18

Light emitting diode with metal piles and multi-passivation layers and its manufacturing method

 #201
20110198568
2011-08-18

Nitride semiconductor element and method for production thereof

 #202
20110175223
2011-07-21

Stacked semiconductor components having conductive interconnects

 #203
20110170274
2011-07-14

Circuit substrate and display device

 #204
20110140125
2011-06-16

Light emitting diodes with smooth surface for reflective electrode

 #205
20110114706
2011-05-19

Mounting structure, and method of manufacturing mounting structure

 #206
20110062582
2011-03-17

Display device

 #207
20110062486
2011-03-17

Fabrication for electroplating thick metal pads

 #208
20110041332
2011-02-24

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS

 #209
20110008923
2011-01-13

Light emitting diodes with smooth surface for reflective electrode

 #210
20100327440
2010-12-30

3-D semiconductor die structure with containing feature and method

 #211
20100320479
2010-12-23

Light emitting apparatus and method for producing the same

 #212
20100308442
2010-12-09

Semiconductor device, semiconductor wafer and manufacturing method of the same

 #213
20100301349
2010-12-02

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

 #214
20100289149
2010-11-18

Semiconductor component and assumbly with projecting electrode

 #215
20100267200
2010-10-21

Semiconductor die packages using thin dies and metal substrates

 #216
20100252855
2010-10-07

SEMICONDUCTOR LIGHT-EMITTING DEVICE

 #217
20100208441
2010-08-19

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

 #218
20100203658
2010-08-12

Method of manufacturing light-emitting device

 #219
20100200870
2010-08-12

Light-emitting diode die package and method for producing same

 #220
20100190332
2010-07-29

Method of forming a copper topped interconnect structure that has thin and thick copper traces

 #221
20100190298
2010-07-29

Semiconductor device and production method therefor

 #222
20100176415
2010-07-15

Light emitting device with improved light extraction efficiency

 #223
20100171177
2010-07-08

Semiconductor device with output circuit arrangement

 #224
20100167423
2010-07-01

Semiconductor package and methods of manufacturing the same

 #225
20100163869
2010-07-01

Bonding inspection structure

 #226
20100163090
2010-07-01

THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE

 #227
20100144139
2010-06-10

Methods for fabricating semiconductor components with conductive interconnects having planar surfaces

 #228
20100141132
2010-06-10

Light-emitting diode die packages and illumination apparatuses using same

 #229
20100139767
2010-06-10

Chip package structure and method of fabricating the same

 #230
20100120183
2010-05-13

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

 #231
20100096974
2010-04-22

Blue-green and green phosphors for lighting applications

 #232
20100093133
2010-04-15

Electronic device and method for fabricating the same

 #233
20100078670
2010-04-01

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

 #234
20100065964
2010-03-18

Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure

 #235
20100062554
2010-03-11

Light-emitting device, light-emitting element and method of manufacturing same

 #236
20100059733
2010-03-11

LED structure

 #237
20100051995
2010-03-04

Semiconductor light emitting apparatus having stacked reflective dielectric films

 #238
20100051994
2010-03-04

Semiconductor light emitting device and semiconductor light emitting apparatus

 #239
20100051987
2010-03-04

Semiconductor light-emitting device and method for manufacturing same

 #240
20100051978
2010-03-04

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

 #241
20100038652
2010-02-18

Light emitting element and method of making same

 #242
20100025702
2010-02-04

SUBSTRATE-FREE FLIP CHIP LIGHT EMITTING DIODE

 #243
20100013094
2010-01-21

Semiconductor package and methods of manufacturing the same

 #244
20100012968
2010-01-21

Light emitting element and method of making the same

 #245
20090321778
2009-12-31

FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

 #246
20090262517
2009-10-22

Light source unit

 #247
20090261372
2009-10-22

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME

 #248
20090242924
2009-10-01

Light emitting diodes with smooth surface for reflective electrode

 #249
20090206477
2009-08-20

Semiconductor device and method of manufacturing semiconductor device

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2009-08-06

Light emitting diode and method for manufacturing the same

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2009-07-30

LUMINESCENT MATERIAL

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20090186433
2009-07-23

Method of making phosphor containing glass plate, method of making light emitting device

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20090181497
2009-07-16

Method for processing a base that includes connecting a first base to a second base with an insulating film

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20090176331
2009-07-09

Method for processing a base that includes connecting a first base to a second base

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20090166888
2009-07-02

3-D semiconductor die structure with containing feature and method

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20090127705
2009-05-21

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

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20090103292
2009-04-23

Image display unit with light emitting devices having a resin surrounding the light emitting devices

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2009-04-02

GAN TYPE LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME

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20090072385
2009-03-19

Electronic assemblies providing active side heat pumping

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20090057707
2009-03-05

Semiconductor light emitting device and method for manufacturing same

 #261
20090050940
2009-02-26

Semiconductor device

 #262
20090050926
2009-02-26

Light emitting device

 #263
20090050916
2009-02-26

Semiconductor light emitting device and semiconductor light emitting apparatus

 #264
20090026634
2009-01-29

Method of manufacturing an electronic part mounting structure

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2009-01-22

Luminescent material

 #266
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2009-01-08

Optical semiconductor device

 #267
20090007405
2009-01-08

Capacitor device and method of manufacturing the same

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2008-10-30

Compound semiconductor light-emitting device and production method thereof

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2008-10-09

Display device

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2008-10-02

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

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2008-10-02

Light emitting element and method of making same

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2008-09-25

System for fabricating semiconductor components with conductive interconnects

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2008-09-18

Semiconductor module having deflecting conductive layer over a spacer structure

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2008-09-04

Semiconductor device having a support substrate partially having metal part extending across its thickness

 #275
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2008-09-04

Light emitting apparatus

 #276
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2008-08-28

Methods for fabricating semiconductor components with conductive interconnects

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2008-08-28

Semiconductor components with conductive interconnects

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20080197511
2008-08-21

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

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20080164482
2008-07-10

Light-Emitting Device and Method for Manufacturing Same

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2008-06-26

Fabrication for electroplating thick metal pads

 #281
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2008-06-19

Interconnects for semiconductor light emitting devices

 #282
20080099885
2008-05-01

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

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20080074029
2008-03-27

Method of making a light emitting device

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20080070337
2008-03-20

Light emitting element and method of making same

 #285
20080042156
2008-02-21

Semiconductor light-emitting device and light-emitting display therewith

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20080017869
2008-01-24

Light emitting diode chip with large heat dispensing and illuminating area

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2008-01-10

Electronic device with EMI screen and packing process thereof

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2007-12-20

Structure and method for producing multiple size interconnections

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2007-12-20

Semiconductor device and method for manufacturing same

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2007-12-13

Chip and flat panel display apparatus comprising the same

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20070246735
2007-10-25

Semiconductor light emitting element

 #292
20070237890
2007-10-11

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

 #293
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2007-10-11

Semiconductor die packages using thin dies and metal substrates

 #294
20070235844
2007-10-11

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

 #295
20070228559
2007-10-04

Connecting structure, method for forming bump, and method for producing device-mounting substrate

 #296
20070223170
2007-09-27

Varistor and light-emitting apparatus

 #297
20070215886
2007-09-20

Compound semiconductor light-emitting device with AlGaInP light-emitting layer formed within

 #298
20070205520
2007-09-06

Chip package and method for fabricating the same

 #299
20070187708
2007-08-16

LED Illumination Apparatus and Card-Type LED Illumination Source

 #300
20070176186
2007-08-02

Light emitting device for enhancing brightness